Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2003
07/31/2003US20030143777 Super thin/super thermal ball grid array package
07/31/2003US20030143776 Method of manufacturing an encapsulated integrated circuit package
07/31/2003US20030143764 Silicon carbide interconnect for semiconductor components and method of fabrication
07/31/2003US20030143762 Interconnect structure
07/31/2003US20030143761 Method of manufacturing a semiconductor device
07/31/2003US20030143486 Photoreactive resin composition and Method of manufacturing circuit board and ceramic multilayer substrate using the resin composition
07/31/2003US20030143480 For forming protective film or an insulating film for a semiconductor element or a circuit board such as a printed board
07/31/2003US20030143412 Heat radiation of the thermal conductive sheet with conductive foil
07/31/2003US20030143406 Providing a film of compliant material; pre-forming film of compliant material to conform a shape of film to a mold cavity surface of transfer mold; placing pre-formed film of compliant material within transfer mold adjacent to mold cavity surface
07/31/2003US20030143382 Heat transfer through covalent bonding of thermal interface material
07/31/2003US20030143341 Dimensional stability, a low-dielectric constant, and are stable at high temperatures
07/31/2003US20030143103 For fixing silicon chips or the like onto a base
07/31/2003US20030142569 Capacitive techniques to reduce noise in high speed interconnections
07/31/2003US20030142522 Rectifier system
07/31/2003US20030142485 Socket having frame for supporting thermal module
07/31/2003US20030142479 Computer cooling system
07/31/2003US20030142478 Heat-dissipating assembly and securing device used therein
07/31/2003US20030142477 Method and apparatus for absorbing thermal energy
07/31/2003US20030142476 Centrifugal blower unit having swirl chamber, and electronic apparatus equipped with centrifugal blower unit
07/31/2003US20030142460 Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board
07/31/2003US20030142459 Integrated circuit
07/31/2003US20030141926 Semiconductor integrated circuit device
07/31/2003US20030141884 Contactor having conductive particles in a hole as a contact electrode
07/31/2003US20030141802 Electronic device having a getter used as a circuit element
07/31/2003US20030141782 Adhesive connection for a stress-sensitive component
07/31/2003US20030141606 For use in manufacturing semiconductor device
07/31/2003US20030141605 Method of forming identifying mark on semiconductor wafer
07/31/2003US20030141603 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
07/31/2003US20030141602 Lead pin with Au-Ge based brazing material
07/31/2003US20030141601 Semiconductor device with tapered contact hole and wire groove
07/31/2003US20030141598 Stacked fill structures for support of dielectric layers
07/31/2003US20030141597 Semiconductor apparatus having contacts of multiple heights and method of making same
07/31/2003US20030141596 Wiring board, semiconductor device, and method of manufacturing wiring board
07/31/2003US20030141595 System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit package
07/31/2003US20030141593 Flip-chip without bumps and polymer for board assembly
07/31/2003US20030141592 Dual cure B-stageable underfill for wafer level
07/31/2003US20030141591 Under bump structure and process for producing the same
07/31/2003US20030141590 Non-contact IC card having enhanced reliability
07/31/2003US20030141589 Encapsulated high-frequency electrical circuit
07/31/2003US20030141587 Split-gate power module and method for suppressing oscillation therein
07/31/2003US20030141586 Module with adhesively attached heat sink
07/31/2003US20030141584 Variable rotational assignment of interconnect levels in integrated circuit fabrication
07/31/2003US20030141583 Stacked package
07/31/2003US20030141582 Stack type flip-chip package
07/31/2003US20030141579 Lead frame for resin-molded semiconductor device
07/31/2003US20030141578 Redundant pinout configuration for signal enhancement in IC packages
07/31/2003US20030141577 Short-prevented lead frame and method for fabricating semiconductor package with the same
07/31/2003US20030141576 Semiconductor chip mounting substrate and flat display
07/31/2003US20030141575 Semiconductor package with die pad having recessed portion
07/31/2003US20030141574 Wiring line for high frequency
07/31/2003US20030141571 Semiconductor device and manufacturing method thereof
07/31/2003US20030141568 Semiconductor device and manufacturing method thereof
07/31/2003US20030141567 Method of improving copper interconnects of semiconductor devices for bonding
07/31/2003US20030141531 Semiconductor device having capacitor
07/31/2003US20030141529 Semiconductor apparatus having a built-in-electric coil and a method of making the semiconductor apparatus
07/31/2003US20030141517 Compression assembled electronic package having a plastic molded insulation ring
07/31/2003US20030141501 Semiconductor integrated circuit device
07/31/2003US20030141498 Electronic devices containing organic semiconductor materials
07/31/2003US20030141192 Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied
07/31/2003US20030141107 Apparatus and method for routing electrical signals
07/31/2003US20030141105 Circuit component built-in module, radio device having the same, and method for producing the same
07/31/2003US20030141091 Underfill coating for loc package
07/31/2003US20030141042 High thermal capability positive heat sink for rectifier assembly
07/31/2003US20030141041 Tube-style radiator structure for computer
07/31/2003US20030141040 Heat dissipating device for an electronic component
07/31/2003US20030141007 Apparatus and method for manufacturing ceramic laminate
07/31/2003US20030141006 Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board, and manufacturing method of double-sided wiring board
07/31/2003US20030140678 System and method for aligning an integrated circuit die on an integrated circuit substrate
07/31/2003US20030140514 Scribe lines for increasing wafer utilizable area
07/31/2003US20030140490 Multi-layer circuit assembly and process for preparing the same
07/31/2003US20030140489 Semiconductor module and producing method therefor
07/31/2003US20030140485 Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, semiconductor chip mounting method and semiconductor chip packaging body
07/31/2003DE20304926U1 Universal holder for processor cooling elements has holding plate of optional material placed on base so elastic holding yoke grips under base fixing protrusions and is locked by bolts
07/31/2003DE19549647C2 High-density packaging multi-chip semiconductor module
07/31/2003CA2474054A1 Apparatus incorporating small-feature-size and large-feature-size components and method for making same
07/31/2003CA2439812A1 Dielectric films for narrow gap-fill applications
07/30/2003EP1331838A2 Integrated power and cooling architecture
07/30/2003EP1331707A1 Ball grid array connection device
07/30/2003EP1331669A2 Antifuse structure and method of making
07/30/2003EP1331665A1 Cooling apparatus
07/30/2003EP1331664A1 Semiconductor device and its manufacturing method
07/30/2003EP1331602A2 Hybrid card with antenna and manufacturing equipment
07/30/2003EP0844899B1 Hermetically sealed electrical feedthrough for use with implantable electronic devices
07/30/2003EP0792573B1 Compliant thermal connectors and assemblies
07/30/2003CN2563625Y Separator of heat radiation system
07/30/2003CN1433576A Anti-tamper encapsulation for integrated circuit
07/30/2003CN1433575A Method and apparatus for encoding information in IC package
07/30/2003CN1433574A 集成电路封装 IC packaging
07/30/2003CN1433573A Leadless semiconductor product packaging apparatus having window lid and method for packaging
07/30/2003CN1433571A Semiconductor device, metal laminated plate for fabricating circuit on semiconductor, and method of fabricating circuit
07/30/2003CN1433532A Photosensitive resin composition
07/30/2003CN1433252A Semiconductor equipment and its making process
07/30/2003CN1433075A Semiconductor and its manufacture
07/30/2003CN1433074A Semiconductor lead frame
07/30/2003CN1433073A Semiconductor device and its making process, circuit board and electronic instrument
07/30/2003CN1433072A Wiring structure and its making process, semiconductor device with the wiring structure and its wiring base board
07/30/2003CN1433071A Chip package and its making process
07/30/2003CN1433070A Chip package and its making process
07/30/2003CN1433069A Inner guide type airflow energy transmission method and device
07/30/2003CN1433068A 半导体器件 Semiconductor devices
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