| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/21/2014 | US8633576 Stacked chip-on-board module with edge connector |
| 01/21/2014 | US8633575 IC package with integrated electrostatic discharge protection |
| 01/21/2014 | US8633574 Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages |
| 01/21/2014 | US8633571 Semiconductor device and test method |
| 01/21/2014 | US8633567 Devices including a P-I-N diode disposed adjacent a silicide in series with a dielectric material |
| 01/21/2014 | US8633566 Memory cell repair |
| 01/21/2014 | US8633562 Voltage switchable dielectric for die-level electrostatic discharge (ESD) protection |
| 01/21/2014 | US8633525 Scratch protection for direct contact sensors |
| 01/21/2014 | US8633520 Semiconductor device |
| 01/21/2014 | US8633511 Method of producing semiconductor device packaging having chips attached to islands separately and covered by encapsulation material |
| 01/21/2014 | US8633507 LED with versatile mounting ways |
| 01/21/2014 | US8633482 Semiconductor device test structures and methods |
| 01/21/2014 | US8633408 Miniature housing and support arrangement having at least one miniature housing |
| 01/21/2014 | US8633407 Semiconductor device capable of switching operation modes |
| 01/21/2014 | US8633103 Semiconductor device and manufacturing method of the same |
| 01/21/2014 | US8633101 Semiconductor device and manufacturing method of semiconductor device |
| 01/21/2014 | US8633099 Method for forming interlayer connectors in a three-dimensional stacked IC device |
| 01/21/2014 | US8633088 Glass frit wafer bond protective structure |
| 01/21/2014 | US8633064 Methods of manufacture of top port multipart surface mount silicon condenser microphone package |
| 01/21/2014 | US8633062 Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof |
| 01/21/2014 | US8633061 Method of fabricating package structure |
| 01/21/2014 | US8633060 Semiconductor device production method and semiconductor device |
| 01/21/2014 | US8633056 Integrated circuit package system and method of manufacture thereof |
| 01/21/2014 | DE202013105809U1 Leistungshalbleitermodul und Kontaktierungsanordnung Power semiconductor module and contacting arrangement |
| 01/16/2014 | WO2014011825A1 Electrical connector with reduced stack height |
| 01/16/2014 | WO2014011808A1 Racetrack design in radio frequency shielding applications |
| 01/16/2014 | WO2014011638A1 Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages |
| 01/16/2014 | WO2014011615A1 Integrating through substrate vias from wafer backside layers of integrated circuits |
| 01/16/2014 | WO2014011612A2 Non-circular under bump metallization (ubm) structure, orientation of non-circular ubm structure and trace orientation to inhibit peeling and/or cracking |
| 01/16/2014 | WO2014011281A1 Methods for flip chip stacking |
| 01/16/2014 | WO2014011232A1 Semiconductor socket with direct selective metalization |
| 01/16/2014 | WO2014011167A1 Semiconductor secured to substrate via hole in substrate |
| 01/16/2014 | WO2014010563A1 Method for producing thermally conductive sheet |
| 01/16/2014 | WO2014010559A1 Epoxy resin, epoxy resin composition, method for curing same, and cured product thereof |
| 01/16/2014 | WO2014010521A1 Method for producing thermally conductive sheet |
| 01/16/2014 | WO2014010520A1 Thermally conductive sheet |
| 01/16/2014 | WO2014010455A1 Chassis and method for producing chassis |
| 01/16/2014 | WO2014010420A1 Resin composition, cured product thereof, and optical semiconductor device using same |
| 01/16/2014 | WO2014010354A1 Light emission device, illumination device, and insulating substrate |
| 01/16/2014 | WO2014010333A1 METHOD FOR FORMING Cu WIRING, AND COMPUTER-READABLE MEMORY MEDIUM |
| 01/16/2014 | WO2014010258A1 Acrylic resin composition for semiconductor sealing, semiconductor device using same, and manufacturing method thereof |
| 01/16/2014 | WO2014010220A1 Submount, sealed semiconductor element, and method for fabricating same |
| 01/16/2014 | WO2014010197A1 Electronic component |
| 01/16/2014 | WO2014010140A1 Nitride semiconductor light emitting device |
| 01/16/2014 | WO2014010074A1 Semiconductor device |
| 01/16/2014 | WO2014009997A1 Semiconductor device and method for producing same |
| 01/16/2014 | WO2014009996A1 Semiconductor device and method for producing same |
| 01/16/2014 | WO2014009247A1 Antifuse |
| 01/16/2014 | WO2014008937A1 Method of manufacturing a functional inlay |
| 01/16/2014 | WO2014008891A2 Metal-ceramic substrate |
| 01/16/2014 | WO2014008719A1 Light emitting device and manufacturing method thereof |
| 01/16/2014 | US20140019716 Plateable diffusion barrier techniques |
| 01/16/2014 | US20140017853 Stacked digital/rf system-on-chip with integral isolation layer |
| 01/16/2014 | US20140017463 Marking co2 laser-transparent materials by using absorption-material-assisted laser processing |
| 01/16/2014 | US20140017447 Method for forming identification marks on refractory material single crystal substrate, and refractory material single crystal substrate |
| 01/16/2014 | US20140015598 Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages |
| 01/16/2014 | US20140015150 Semiconductor device and manufacturing method of same |
| 01/16/2014 | US20140015149 Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device |
| 01/16/2014 | US20140015148 Semiconductor package and method of manufacturing the same |
| 01/16/2014 | US20140015147 Chip stack packages, system in packages including the same, and methods of operating the same |
| 01/16/2014 | US20140015146 Semiconductor component having through-silicon vias and method of manufacture |
| 01/16/2014 | US20140015145 Multi-chip package and method of manufacturing the same |
| 01/16/2014 | US20140015144 Multi-chip package |
| 01/16/2014 | US20140015143 Methods of forming nano-scale pores, nano-scale electrical contacts, and memory devices including nano-scale electrical contacts, and related structures and devices |
| 01/16/2014 | US20140015142 Semiconductor device |
| 01/16/2014 | US20140015140 Power module substrate, power module, and method for manufacturing power module substrate |
| 01/16/2014 | US20140015139 Semiconductor device and method for manufacturing the same |
| 01/16/2014 | US20140015138 Leakage Reducing Writeline Charge Protection Circuit |
| 01/16/2014 | US20140015137 Semiconductor devices and the method of manufacturing the same |
| 01/16/2014 | US20140015136 Ic device including package structure and method of forming the same |
| 01/16/2014 | US20140015135 Self-aligned via interconnect using relaxed patterning exposure |
| 01/16/2014 | US20140015134 Method of Packaging a Die |
| 01/16/2014 | US20140015133 Supply voltage or ground connections for integrated circuit device |
| 01/16/2014 | US20140015132 Systems and Methods for Mechanical and Electrical Package Substrate Issue Mitigation |
| 01/16/2014 | US20140015131 Stacked fan-out semiconductor chip |
| 01/16/2014 | US20140015130 Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods |
| 01/16/2014 | US20140015129 Stacked package including spacers and method of manufacturing the same |
| 01/16/2014 | US20140015128 Nonvolatile memory device and method for fabricating the same |
| 01/16/2014 | US20140015127 Contact support pillar structure for flip chip semiconductor devices and method of manufacture therefore |
| 01/16/2014 | US20140015126 Semiconductor package and stacked semiconductor package using the same |
| 01/16/2014 | US20140015125 Semiconductor package and method of fabricating the same |
| 01/16/2014 | US20140015124 Pillar on pad interconnect structures, semiconductor dice and die assemblies including such interconnect structures, and related methods |
| 01/16/2014 | US20140015123 Sensor package and method of forming same |
| 01/16/2014 | US20140015122 Method of Forming Post Passivation Interconnects |
| 01/16/2014 | US20140015121 Wiring substrate and manufacturing method thereof |
| 01/16/2014 | US20140015120 Semiconductor device including cooler |
| 01/16/2014 | US20140015119 Semiconductor device/electronic component mounting structure |
| 01/16/2014 | US20140015118 Semiconductor chip including heat radiation portion and method of fabricating the semiconductor chip |
| 01/16/2014 | US20140015117 Very extremely thin semiconductor package |
| 01/16/2014 | US20140015116 Emi shielding and thermal dissipation for semiconductor device |
| 01/16/2014 | US20140015115 Semiconductor chips having improved solidity, semiconductor packages including the same and methods of fabricating the same |
| 01/16/2014 | US20140015114 Electronic device manufacturing method, electronic device, and chip assembly |
| 01/16/2014 | US20140015113 Laser Processing Method and Semiconductor Device |
| 01/16/2014 | US20140015112 Method for manufacturing semiconductor device, and semiconductor substrate |
| 01/16/2014 | US20140015111 Chip package and method for forming the same |
| 01/16/2014 | US20140015106 Thermal Structure for Integrated Circuit Package |
| 01/16/2014 | US20140015096 Anti-fuse of semiconductor device, semiconductor module and system each including the semiconductor device, and method for forming the anti-fuse |
| 01/16/2014 | US20140015095 Dual Anti-Fuse |
| 01/16/2014 | US20140015094 Semiconductor device and method for manufacturing the same |
| 01/16/2014 | US20140015061 Methods and structures for multiport memory devices |