Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2003
08/07/2003US20030146501 Power converter
08/07/2003US20030146500 Package for semiconductor device with ground lead connection having high stress resistance
08/07/2003US20030146499 Composite material including copper and cuprous oxide and application thereof
08/07/2003US20030146498 Composite material including copper and cuprous oxide and application thereof
08/07/2003US20030146497 Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin
08/07/2003US20030146495 Semiconductor device and method for fabricating the same
08/07/2003US20030146491 Semiconductor integrated circuit device and method of producing the same
08/07/2003US20030146483 Metal pad of a semiconductor element
08/07/2003US20030146475 Pixel structure
08/07/2003US20030146456 Local interconnect for integrated circuit
08/07/2003US20030146451 Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materials
08/07/2003US20030146384 Surface-mount package for an optical sensing device and method of manufacture
08/07/2003US20030146381 Monitoring of contact hole production
08/07/2003US20030146268 Packaging for multi-processor shared-memory system
08/07/2003US20030146017 A Method of Forming A HiGH RELIABILITY INTERPOSER FOR LOW COST HIGH RELIABILITY APPLICATIONS
08/07/2003US20030146012 Semiconductor chip, chip stack package and manufacturing method
08/07/2003US20030145949 Mixture of epoxy resin and glycidyl(meth)acrylate polymer
08/07/2003US20030145939 Dual die bonder for a semiconductor device and a method thereof
08/07/2003US20030145622 Accumulator
08/07/2003US20030145594 Method and apparatus for converting dissipated heat to work energy
08/07/2003US20030145462 Heat transfer material for an improved die edge contacting socket
08/07/2003US20030145461 Semiconductor device and method of manufacturing the same
08/07/2003US20030145460 Standoff arrangements to control distance and provide electrical function
08/07/2003DE20308524U1 Heat sink system for a CPU has contact heat sink plate coupled to thermally transmitting tube
08/07/2003CA2474781A1 Heat-sink with large fins-to-air contact area
08/06/2003EP1333710A2 Method and apparatus for absorbing thermal energy
08/06/2003EP1333502A2 Surface-mount package for an optical sensing device and method of manufacture
08/06/2003EP1333496A2 Semiconductor device for RF signal switching with high isolation layout for the signal lines
08/06/2003EP1333494A2 Semiconductor device and method of fabricating a semiconductor assembly
08/06/2003EP1333493A2 Interconnect structure
08/06/2003EP1333492A1 Cooling a microchip on a circuit board
08/06/2003EP1333491A2 Ball grid array package enhanced with a thermal and electrical connector
08/06/2003EP1333490A2 Ball grid array package with patterned stiffener layer
08/06/2003EP1333489A2 Semiconductor chip with a protective film
08/06/2003EP1333488A2 Electronic device having a getter used as a circuit element
08/06/2003EP1333487A2 System and method for aligning an integrated circuit die on an integrated circuit substrate
08/06/2003EP1333486A2 Semiconductor device having wiring line with hole, and manufacturing method thereof
08/06/2003EP1333484A2 Interlayer between titanium nitride and high density plasma oxide
08/06/2003EP1333480A2 Transfer molding process for an integrated circuit and pre-formed release film for use in this process
08/06/2003EP1333237A2 Accumulator
08/06/2003EP1333234A1 Thermoelectric heat pump
08/06/2003EP1333077A1 Varnish containing polyamide resin and use thereof
08/06/2003EP1332830A1 Lead pin with Au-Ge based brazing material
08/06/2003EP1332653A1 Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production
08/06/2003EP1332518A1 Integrated circuit inductor structure and non-destructive etch depth measurement
08/06/2003EP1169735A4 Semiconductor radiation emitter package
08/06/2003EP0898712B1 Wafer-level burn-in and test
08/06/2003CN2565153Y Integrated circuit of decreasing circuit drop
08/06/2003CN2565152Y High-density fin set radiator
08/06/2003CN2565151Y Radiator structure
08/06/2003CN2565150Y IC packaging assembly with holding mechanism
08/06/2003CN1435075A Heat sink
08/06/2003CN1434665A Substrate for seal and making method display device and electronic instrument thereof
08/06/2003CN1434517A Single transistor adopted high-density semiconductor memory unit and memory array
08/06/2003CN1434513A Programmable gate array based on transistor grid oxidation layr breakdown property
08/06/2003CN1434512A Semiconductor device and photoelectric device including same
08/06/2003CN1434511A Blocking circuit for IC
08/06/2003CN1434510A Semiconductor device and making method thereof
08/06/2003CN1434508A Semiconductor device
08/06/2003CN1434507A Wire solder free semiconductor device and package method thereof
08/06/2003CN1434506A Wire solder free semiconductor device and package method thereof
08/06/2003CN1434505A 半导体器件 Semiconductor devices
08/06/2003CN1434504A Semiconductor device and making method, and printing mask
08/06/2003CN1434498A Flip chip type semiconductor device and making method thereof
08/06/2003CN1434496A Method for assembling QFN type image sensor and structure thereof
08/06/2003CN1434495A Reinforced heat radiation type chip down embedded ball type array carrying board structure and making method thereof
08/06/2003CN1434350A Photoreactive resin composition and circuit board and method for making multilayer ceramic base material
08/06/2003CN1117396C Semiconductor package body and semiconductor module using same
08/06/2003CN1117395C Semiconductor package manufacturing method and semiconductor package
08/06/2003CN1117394C Semiconductor insert piece
08/06/2003CN1117392C Buried wiring structure and its mfg. method
08/05/2003US6604231 Three-dimensional MCM, method for manufacturing the same, and storage medium storing data for the method
08/05/2003US6603667 Electronic circuit unit that is suitable for miniaturization and excellent in high frequency characteristic
08/05/2003US6603665 Heat dissipating assembly with thermal plates
08/05/2003US6603663 Electronic unit
08/05/2003US6603662 Computer cooling system
08/05/2003US6603646 Multi-functional energy conditioner
08/05/2003US6603324 Special contact points for accessing internal circuitry of an integrated circuit
08/05/2003US6603321 Method and apparatus for accelerated determination of electromigration characteristics of semiconductor wiring
08/05/2003US6603211 Method and system for providing a robust alignment mark at thin oxide layers
08/05/2003US6603210 Semiconductor module and producing method therefor
08/05/2003US6603209 Compliant integrated circuit package
08/05/2003US6603207 Electrode structure for semiconductor device, method for forming the same, mounted body including semiconductor device and semiconductor device
08/05/2003US6603205 Material for electronic components, method of connecting material for electronic components, ball grid array type electronic components and method of connecting ball grid array type electronic components
08/05/2003US6603204 Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics
08/05/2003US6603202 Circuit board-providing article, circuit board, semiconductor device and process for the production of the same
08/05/2003US6603200 Integrated circuit package
08/05/2003US6603199 Integrated circuit package having die with staggered bond pads and die pad assignment methodology for assembly of staggered die in single-tier ebga packages
08/05/2003US6603198 Semiconductor structure having stacked semiconductor devices
08/05/2003US6603197 Semiconductor unit
08/05/2003US6603196 Leadframe-based semiconductor package for multi-media card
08/05/2003US6603195 Planarized plastic package modules for integrated circuits
08/05/2003US6603194 Outer frame section; a plurality of chip mounting sections which are supported by the outer frame section and on which a plurality of semiconductor chips are mounted; lead sections surrounding the chip mounting sections;connecting and
08/05/2003US6603193 Semiconductor package
08/05/2003US6603192 Scratch resistance improvement by filling metal gaps
08/05/2003US6603191 Semiconductor device and method of manufacturing the same
08/05/2003US6603190 Semiconductor device
08/05/2003US6603187 Antifuse structure suitable for VLSI application
08/05/2003US6603166 Frontside contact on silicon-on-insulator substrate
08/05/2003US6603165 Semiconductor device and method for fabricating the same
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