Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2003
08/14/2003US20030151032 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof
08/14/2003US20030150898 Micromagnetic device for power processing applications and method of manufacture therefor
08/14/2003US20030150641 Multilayer package for a semiconductor device
08/14/2003US20030150635 Microelectronic connections with liquid conductive elements
08/14/2003US20030150605 Thermal transfer interface system and methods
08/14/2003US20030150604 Polymer with solder pre-coated fillers for thermal interface materials
08/14/2003US20030150599 Cooling apparatus boiling and condensing refrigerant with effective performance in a titled position
08/14/2003US20030150598 Heat conduction pipe
08/14/2003US20030150597 Continuous heat sink for an electronic device
08/14/2003US20030150596 Computer heat sink
08/14/2003US20030150595 Structure and manufacture of a heat sink with high heat transmission
08/14/2003US20030150111 Components with releasable leads
08/14/2003US20030150110 Design method for plating of printed circuit board strip and manufacturing method of semiconductor chip package using the same
08/14/2003DE10210524C1 Cryogenic cooling unit includes positive displacement micropump, condenser, interception chamber, and sub-cooling heat exchanger
08/13/2003EP1335428A2 Resin-moulded semiconductor device and method for manufacturing the same
08/13/2003EP1335427A2 Resin-moulded semiconductor device
08/13/2003EP1335426A2 Packaged semiconductor device and method of formation
08/13/2003EP1335422A2 Chip sized semiconductor device and a process for making it
08/13/2003EP1334647A1 An integrated circuit carrier
08/13/2003EP1334522A1 Semiconductor device with reduced line-to-line capacitance and cross talk noise
08/13/2003EP1334520A2 Film material comprising metal spikes and method for the production thereof
08/13/2003EP1334519A2 Ball limiting metallurgy for input/outputs and methods of fabrication
08/13/2003EP1334513A2 Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith
08/13/2003EP1334416A2 Circuit arrangement and a method for detecting an undesired attack on an integrated circuit
08/13/2003EP1334370A2 Method for locating defects and measuring resistance in a test structure
08/13/2003EP1177621B1 Mos variable gain amplifier
08/13/2003EP1092340B1 Cooling system for a power electronic unit for operating at least one electrical group of a motor vehicle
08/13/2003EP0929935A4 Coplanar waveguide amplifier
08/13/2003EP0882207B1 Active heat sink structure with flow augmenting rings and method for removing heat
08/13/2003CN2566461Y Modular radiating fan structure
08/13/2003CN2566460Y Heat pipe radiator with multistage radiating structure
08/13/2003CN2566459Y Radiating fin
08/13/2003CN2566458Y Radiating structure for computer central processor
08/13/2003CN2566457Y Heat pipe radiator for central processor of computer
08/13/2003CN2566456Y Inverse bonding chip packaged base plate
08/13/2003CN2566455Y Crystal coated packaged base plate and crystal coated chip
08/13/2003CN2566454Y Circuit board preventing moulding-die glue-overflow
08/13/2003CN2566350Y CPU multifunctional radiator
08/13/2003CN2566349Y Radiator with combined structure
08/13/2003CN2566348Y Heat sink with combined structure
08/13/2003CN2566347Y Fixed device for heat pipe radiator
08/13/2003CN2566345Y Cpu散热器 Cpu radiator
08/13/2003CN2566344Y Base with radiating conduit
08/13/2003CN2566343Y Fastening piece for radiator
08/13/2003CN2566342Y Fixed device for CPU radiator
08/13/2003CN1436386A Water getter devices for laser amplifiers and process for manufacture thereof
08/13/2003CN1436370A Semiconductor chip and semiconductor device using said semiconductor chip
08/13/2003CN1436117A Encapsulation using microcellular foamed materials
08/13/2003CN1436035A Apparatus and method for mfg. ceramic laminate
08/13/2003CN1435915A Spherical grid array connection device
08/13/2003CN1435883A Non-gate-comtrolled diode element electrostatic discharge protection circuit and mfg. method thereof
08/13/2003CN1435882A Semiconductor device and mfg. method thereof
08/13/2003CN1435881A Connecting pad structure and mfg. method thereof
08/13/2003CN1435880A Radiator assembly and radiator assembly fixing devcie
08/13/2003CN1435808A Semiconductor chip mounting substrate and two-dimensional display
08/13/2003CN1435608A Cooling and heating device using thermoelectric module
08/13/2003CN1435575A Centrifugel fan unit with vortex chamber and electronic device provided with same
08/13/2003CN1118224C Heat spreader system for cooling heat-generating components
08/13/2003CN1118112C Socket for electric component
08/13/2003CN1118102C Insulating grid type semiconductor device and method of fabricating same
08/13/2003CN1118099C Method for mounting intermediate connecting element to terminal of electronic module
08/13/2003CN1118098C Semiconductor integrated circuit device
08/13/2003CN1118097C 半导体器件 Semiconductor devices
08/13/2003CN1118094C Device and method for connecting two electronic components
08/13/2003CN1118091C Integrated circuits and mfg. methods
08/13/2003CN1118089C Semiconductor wafer, semiconductor chip, method for mfg. them and IC card
08/13/2003CN1118088C Semiconductor apparatus and method for fabricating same
08/13/2003CN1118039C Circuit unit with chip card module and coil connected therewith
08/13/2003CN1117818C Thermosetting encapsulants for electronics packaging
08/13/2003CN1117775C Amorphous copolymers of tetrafluoethylene and hexafluoropropylene and coating articte thereof
08/12/2003US6606254 Cooling module grounding structure and method and electronic apparatus with the structure
08/12/2003US6606251 Power conditioning module
08/12/2003US6606246 Method and apparatus for retaining cooling apparatus and bus bar
08/12/2003US6606244 Pointing device having computer host
08/12/2003US6606237 Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same
08/12/2003US6606011 Energy conditioning circuit assembly
08/12/2003US6605876 Semiconductor chip package and connection structure including a ground metal plane having blank patterns
08/12/2003US6605875 Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size
08/12/2003US6605874 Multi-level metallization structure that uses a conductive shunt layer that is deposited upon a lower interconnect at the junction between the lower interconnect and an upper interconnect
08/12/2003US6605873 Integrated electronic device comprising a mechanical stress protection structure
08/12/2003US6605871 RF circuit chip and RF circuit device including the RF circuit chip
08/12/2003US6605870 Pressure-contact type semiconductor device
08/12/2003US6605869 Semiconductor device with improved cooling efficiency and reduced electric resistance
08/12/2003US6605868 Insulating substrate including multilevel insulative ceramic layers joined with an intermediate layer
08/12/2003US6605867 Surface mount type semiconductor package and manufacturing method therefor
08/12/2003US6605866 Protruding leads allow for electrical connection of a second semiconductor package placed on top of the first semiconductor; protruding parts of leads form space between the stacked packages for improved heat dissipation
08/12/2003US6605865 Semiconductor package with optimized leadframe bonding strength
08/12/2003US6605864 Support matrix for integrated semiconductors, and method for producing it
08/12/2003US6605861 Semiconductor device
08/12/2003US6605857 Reducing magnetic coupling using triple well
08/12/2003US6605853 Semiconductor device having heat protection circuits
08/12/2003US6605848 Semiconductor device with metal gate electrode and silicon oxynitride spacer
08/12/2003US6605844 Semiconductor device
08/12/2003US6605842 Semiconductor device and a method of manufacturing the same
08/12/2003US6605825 Bipolar transistor characterization apparatus with lateral test probe pads
08/12/2003US6605824 Semiconductor drive
08/12/2003US6605779 Electronic control unit
08/12/2003US6605778 Circuit carrier, in particular printed circuit board
08/12/2003US6605532 Structure for an electrical contact to a thin film in a semiconductor structure and method for making the same
08/12/2003US6605531 Hole-filling technique using CVD aluminum and PVD aluminum integration
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