Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2003
08/14/2003WO2003067645A1 Semiconductor device and method of isolating circuit regions
08/14/2003WO2003067609A2 Signal wire shielding technique
08/14/2003WO2003067604A2 Circuit system with a printed board comprising a programmable memory element
08/14/2003WO2003066248A2 Device and method for disabling electronic devices
08/14/2003WO2003065926A2 Wearable biomonitor with flexible thinned integrated circuit
08/14/2003WO2003026009A3 Power electronics component
08/14/2003WO2003021675A3 Method for manufacturing a programmable chalcogenide fuse within a semiconductor device
08/14/2003WO2003019652A3 Method for fixing an electrical element and a module with an electrical element fixed thus
08/14/2003WO2003007312A3 Thermal interface material and heat sink configuration
08/14/2003WO2002064496A3 Method for forming microelectronic spring structures on a substrate
08/14/2003WO2002043143A3 Method and device for cooling electronic components, for example, of integrated switching circuits
08/14/2003WO2002033751A3 Microelectronic substrate with integrated devices
08/14/2003WO2002027785A3 Direct heatpipe attachment to die using center point loading
08/14/2003WO2002021595A3 Integrated core microelectronic package
08/14/2003WO2002015266A3 Direct build-up layer on an encapsulated die package
08/14/2003US20030153665 Heat conductive mold and manufacturing method thereof
08/14/2003US20030153650 Epoxy resin composition and electronic part
08/14/2003US20030153223 Connecting method for metal material and electric conductive plastic material and product thereby
08/14/2003US20030153204 Terminal structure having large peel strength of land portion and ball
08/14/2003US20030153198 Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates
08/14/2003US20030153179 Apparatus and method for scribing semiconductor wafers using vision recognition
08/14/2003US20030153176 Interconnection structure and interconnection structure formation method
08/14/2003US20030153174 Methods for making a paste of materials to form bumps for screen print processes
08/14/2003US20030153173 Method of forming a novel top-metal fuse structure
08/14/2003US20030153172 Method of manufacturing a semiconductor integrated circuit device
08/14/2003US20030153171 Wafer level package with air pads and manufacturing method thereof
08/14/2003US20030153160 Ball grid array package for enhanced stress tolerance
08/14/2003US20030153159 Integrated circuit having oversized components and method of manafacture thereof
08/14/2003US20030153143 Electroless deposition of doped noble metals and noble metal alloys
08/14/2003US20030153135 Method for forming semiconductor memory device having a fuse
08/14/2003US20030153134 Semiconductor device, and a method of producing semiconductor device
08/14/2003US20030153133 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
08/14/2003US20030153132 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
08/14/2003US20030153131 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
08/14/2003US20030153129 Method for fabricating preplated nickel/palladium and tin leadframes
08/14/2003US20030153128 Semiconductor device and manufacturing the same
08/14/2003US20030153127 Method of manufacturing a semiconductor device
08/14/2003US20030153124 Semiconductor device and method for manufacturing the same, circuit substrate and electronic apparatus
08/14/2003US20030153121 Semiconductor package production method and semiconductor package
08/14/2003US20030153119 Integrated circuit package and method for fabrication
08/14/2003US20030153110 Thin film transistor substrate and method of manufacturing the same
08/14/2003US20030153108 Plastic packaging of LED arrays
08/14/2003US20030153107 Method for reworking metal layers on integrated circuit bond pads
08/14/2003US20030153103 Bond pad structure comprising multiple bond pads with metal overlap
08/14/2003US20030153099 Method of making a flexible substrate with a filler material
08/14/2003US20030152777 Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
08/14/2003US20030152776 Flame-retardant epoxy resin composition and laminate made with the same
08/14/2003US20030152773 Diamond integrated heat spreader and method of manufacturing same
08/14/2003US20030152764 Heat conductive interfaces
08/14/2003US20030152706 Defect-free dielectric coatings and preparation thereof using polymeric nitrogenous porogens
08/14/2003US20030151906 Electromagnetic noise suppression device
08/14/2003US20030151899 Operating device for heat sink
08/14/2003US20030151898 Thermally conducting silicone resin composition and a thermally conducting filler; non-fluid prior to operation and softens or melts when heated to fill the gap between electronic component and heat dissipating member
08/14/2003US20030151897 Heat dissipation device
08/14/2003US20030151896 Loop thermosyphon using microchannel etched semiconductor die as evaporator
08/14/2003US20030151895 Heat spreader with oscillating flow
08/14/2003US20030151485 Surface mounted inductance element
08/14/2003US20030151479 Latching micro magnetic relay packages and methods of packaging
08/14/2003US20030151477 High-frequency module and its manufacturing method
08/14/2003US20030151471 Multilayer ceramic device
08/14/2003US20030151421 Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
08/14/2003US20030151149 Semiconductor device
08/14/2003US20030151148 Single unit automated assembly of flex enhanced ball grid array packages
08/14/2003US20030151147 Electrical assembly with vertical multiple layer structure
08/14/2003US20030151146 Vertical electronic circuit package and method of fabrication therefor
08/14/2003US20030151144 Semiconductor device and method of manufacturing semiconductor device
08/14/2003US20030151143 Semiconductor packaging device and manufacture thereof
08/14/2003US20030151142 Subresolution features for a semiconductor device
08/14/2003US20030151141 External connection terminal and semiconductor device
08/14/2003US20030151140 Bump structure of a flip chip type semiconductor element mounted face down
08/14/2003US20030151139 Semiconductor device
08/14/2003US20030151138 Circuit arrangement with a programmable memory element on a circuit board, with security against reprogramming
08/14/2003US20030151137 Semiconductor device
08/14/2003US20030151135 Circuit device and manufacturing method of circuit device
08/14/2003US20030151134 Semiconductor device
08/14/2003US20030151133 RF transition for an area array package
08/14/2003US20030151132 Placing a thermally conductive material on a die substrate; and establishing thermal contact between an outer region and the thermally conductive material to effect a dissipation of heat away from the die.
08/14/2003US20030151131 Thermally coupling electrically decoupling cooling device for integrated circuits
08/14/2003US20030151130 Water cooling type cooling block for semiconductor chip
08/14/2003US20030151129 Method and apparatus for conducting heat in a flip-chip assembly
08/14/2003US20030151128 Semiconductor device
08/14/2003US20030151127 Semiconductor device
08/14/2003US20030151124 Integrated circuit device
08/14/2003US20030151123 Semiconductor die package having two die paddles
08/14/2003US20030151122 Semiconductor die is housed in a semiconductor package whose lid is formed with a projection that electrically contacts the first surface of the semiconductor die to shield it from the second circuit region.
08/14/2003US20030151121 Optical transmission module
08/14/2003US20030151120 Lead-frame forming for improved thermal performance
08/14/2003US20030151116 Semiconductor device incorporating elements formed of refractory metal-silicon-nitrogen and method for fabrication
08/14/2003US20030151115 Semiconductor device and production method therefor
08/14/2003US20030151113 Semiconductor device
08/14/2003US20030151106 Semiconductor device having heat detecting element and insulating cavity and mehtod of manufacturing thereof
08/14/2003US20030151100 Semiconductor integrated circuit device
08/14/2003US20030151096 Semiconductor device
08/14/2003US20030151095 Thin film transistor array substrate for liquid crystal display and method for fabricating same
08/14/2003US20030151061 Insulating element
08/14/2003US20030151060 Semiconductor device having a fuse and method of forming thereof
08/14/2003US20030151055 Semiconductor device and electro-optical device including the same
08/14/2003US20030151053 Processing a memory link with a set of at least two laser pulses
08/14/2003US20030151047 Semiconductor reliability test chip
08/14/2003US20030151046 Bipolar transistor characterization apparatus and method employing air bridge connectors to test probe pads
1 ... 1617 1618 1619 1620 1621 1622 1623 1624 1625 1626 1627 1628 1629 1630 1631 1632 1633 1634 1635 1636 1637 ... 2262