Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2003
08/21/2003US20030159122 Semiconductor device having wide wiring pattern in outermost circuit
08/21/2003US20030158696 Controller for monitoring temperature
08/21/2003US20030158295 Thixotropic fluorinated curable compositions and articles sealed therewith
08/21/2003US20030157815 Ammonia gas passivation on nitride encapsulated devices
08/21/2003US20030157811 Semiconductor device
08/21/2003US20030157810 Semiconductor device and method of manufacturing the same
08/21/2003US20030157805 Thick traces from multiple damascene layers
08/21/2003US20030157796 Etch stop layer for silicon (si) via etch in three-dimensional (3-d) wafer-to-wafer vertical stack
08/21/2003US20030157790 Method of forming bump
08/21/2003US20030157788 Method of suppressing void formation in a metal line
08/21/2003US20030157782 Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same
08/21/2003US20030157780 Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials
08/21/2003US20030157779 Method for applying adjusting marks on a semiconductor disk
08/21/2003US20030157775 Method for manufacturing semiconductor device with hetero junction bipolar transistor
08/21/2003US20030157762 Method and apparatus for marking microelectronic dies and microelectronic devices
08/21/2003US20030157761 Method for forming bumps, semiconductor device, and solder paste
08/21/2003US20030157755 Method of manufacturing semiconductor device
08/21/2003US20030157752 Method for producing an antifuse and antifuse for the selective electrical connection of adjacent conductive regions
08/21/2003US20030157749 Electronic component, manufacturing method therefor, aggregate electronic component, mounting structure of electronic component, and electronic device
08/21/2003US20030157748 Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices
08/21/2003US20030157747 Semiconductor build-up package
08/21/2003US20030157746 Composite structure for electronic microsystems and method for production of said composite structure
08/21/2003US20030157438 Forming a first UBM (under ball metallurgy) over an active surface of wafer; second UBM is formed over first UBM; part of second UBM is removed to expose first UBM; solders are formed to cover second UBM and first UBM not covered by second UBM
08/21/2003US20030157437 Semiconductor module substrate sheet, semiconductor module substrate sheet fabricating method and semiconductor module
08/21/2003US20030157359 Metal plate and method of shaping the same
08/21/2003US20030157342 For managing/dissipating heat generated by electronic devices
08/21/2003US20030156969 Coupling electroconductive pads
08/21/2003US20030156804 Hermetic high frequency module and method for producing the same
08/21/2003US20030156441 Electronic circuit package
08/21/2003US20030156400 Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management
08/21/2003US20030156395 Electronic component and method of manufacturing same
08/21/2003US20030156385 Controlling thermal, acoustic, and/or electromagnetic properties of a computing device
08/21/2003US20030156379 Laminated substrate, method of producing the same, nonreciprocal circuit element, and communication device
08/21/2003US20030156378 Multilayer lithography
08/21/2003US20030156375 Enriched macromolecular materials having temperature-independent high electrical conductivity and methods of making same
08/21/2003US20030155976 Cmos transceiver having an integrated power amplifier
08/21/2003US20030155961 Redundant antifuse segments for improved programming efficiency
08/21/2003US20030155933 Dielectric test structure and test method
08/21/2003US20030155927 Multiple directional scans of test structures on srmiconductor integrated circuits
08/21/2003US20030155664 Liquid epoxy resin composition and semiconductor device
08/21/2003US20030155663 Adhesives, adhesive films and electric devices
08/21/2003US20030155662 Semiconductor device and fabrication method therefor
08/21/2003US20030155661 Radio-frequency power component, radio-frequency power module, method for producing a radio-frequency power component, and method for producing a radio-frequency power module
08/21/2003US20030155660 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
08/21/2003US20030155659 Memory module having interconnected and stacked integrated circuits
08/21/2003US20030155657 Manufacturing method of semiconductor device
08/21/2003US20030155656 Anisotropically conductive film
08/21/2003US20030155655 Integrated, active, moisture and oxygen getter layers
08/21/2003US20030155652 Semiconductor device and its manufacturing method
08/21/2003US20030155651 Microwave monolithic integrated circuit package
08/21/2003US20030155650 On-chip reference current and voltage generating circuits
08/21/2003US20030155648 Method of fabricating a thin and fine ball-grid array package with embedded heat spreader
08/21/2003US20030155647 Single substrate with package zones; bonding semiconductor chips; encapsulation; cutting apart
08/21/2003US20030155645 Semiconductor device and manufacturing the same
08/21/2003US20030155644 Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material
08/21/2003US20030155642 Unique feature design enabling structural integrity for advanced low k semiconductor chips
08/21/2003US20030155641 Enhanced chip scale package for wire bond dies
08/21/2003US20030155640 Integrated circuit package
08/21/2003US20030155639 Multilayer; transparent substrate, light receiver chips, hermetic sealing with polymer, die bonding chips
08/21/2003US20030155638 Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device
08/21/2003US20030155637 Heat sink apparatus utilizing the heat sink shroud to dissipate heat
08/21/2003US20030155636 Molded stiffener for thin substrates
08/21/2003US20030155634 Lead frame for a semiconductor device and a semiconductor device incorporating the lead frame
08/21/2003US20030155633 Wire bond package with core ring formed over I/O cells
08/21/2003US20030155629 Laser-breakable fuse link with alignment and break point promotion structures
08/21/2003US20030155590 Semiconductor device
08/21/2003US20030155570 Method of measuring the width of a damascene resistor
08/21/2003US20030155569 Diverse band gap energy level semiconductor device
08/21/2003US20030155455 Mixture of fine inrganic compound in thermosetting resin; heating, pressurization, curing
08/21/2003US20030155434 Spray nozzle apparatus and method of use
08/21/2003US20030155408 Sacrificial seed layer process for forming c4 solder bumps
08/21/2003US20030155405 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
08/21/2003US20030155402 Solder process and solder alloy therefor
08/21/2003US20030155151 Electrical contacts for flexible displays
08/21/2003US20030155145 Thermally enhanced semiconductor build-up package
08/21/2003US20030155110 Advanced air cooled heat sink
08/21/2003US20030155106 Heat sink apparatus with air duct
08/21/2003US20030155105 Vapor chamber having integral captive fasteners
08/21/2003US20030155103 Folded fin on edge heat sink
08/21/2003US20030155102 Vapor chamber having integral captive fasteners
08/21/2003US20030154598 Attaching device for mounting and fixing a device for generating heat and a heat sink provided on the device for generating heat on a board, amount board having the board, the device for generating heat, and the heat sink, and an attaching method of the device for generating heat and the heat sink provided on the device for generating heat on the board
08/21/2003DE10162637C1 Schaltungsanordnung mit elektronischen Bauelementen auf einem isolierenden Trägersubstrat Circuit arrangement having electronic components on an insulating support substrate
08/21/2003CA2474070A1 High density 3-d integrated circuit package
08/20/2003EP1337135A2 High frequency unit
08/20/2003EP1337134A2 Terminal structure having large peel strength of land portion and ball
08/20/2003EP1337007A1 Intermediate board
08/20/2003EP1336993A1 Assembly structure for electronic power integrated circuit formed on a semiconductor die and corresponding manufacturing process
08/20/2003EP1336992A2 Thermally-capacitive phase change encapsulant for electronic devices
08/20/2003EP1336991A2 Integrated Circuit Having Oversized Components and Method of Manufacture thereof
08/20/2003EP1336990A1 Casing for high-voltage resistant power semconductor module
08/20/2003EP1336201A1 Integrated circuit configuration that is protected against analysis, and method for producing the configuration
08/20/2003EP1336200A2 Method for eliminating crack damage at interfaces in integrated circuits
08/20/2003EP1336199A2 Lid and heat spreader design for a semiconductor package
08/20/2003EP1336197A1 Method for protecting electronic or micromechanical components
08/20/2003EP1336196A2 Device and method for encasing an electronic component
08/20/2003EP1336194A1 A method for attaching an integrated circuit on a silicon chip to a smart label
08/20/2003EP1335831A1 A method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article
08/20/2003EP0870181B1 Method and apparatus for thermal gradient stabilization of microbolometer focal plane arrays
08/20/2003EP0843621B1 Conductive via fill inks for ceramic multilayer circuit boards on support substrates
08/20/2003CN2567934Y Integral radiator made of two-kind of heat conduction material
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