Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2003
08/20/2003CN2567778Y Semiconductor package device with radiation structure
08/20/2003CN2567777Y Radiating fan
08/20/2003CN2567776Y Cooling device assembly
08/20/2003CN2567775Y Improved structure of fin
08/20/2003CN2567774Y Fastening device for radiator
08/20/2003CN2567773Y Curved surface type cooling device with flexible fin
08/20/2003CN2567772Y Cooling device of electronic heater element
08/20/2003CN2567771Y High-density cooling device
08/20/2003CN2567770Y Chip cooling structure
08/20/2003CN2567769Y High-density integrated circuit packaging structure
08/20/2003CN2567768Y Encapsulation structure for chip on base plate
08/20/2003CN2567653Y CPU heat-sink system
08/20/2003CN2567652Y Heat sink
08/20/2003CN2567651Y Micro-groove group evaporation cooling device
08/20/2003CN2567648Y Connecting structure of heat-sink module set
08/20/2003CN2567646Y Fixing structure of cooling fin
08/20/2003CN2567642Y Cooling device for central processing unit
08/20/2003CN2567619Y Structure of cooling module
08/20/2003CN1437839A A printed circuit board assembly with improved bypass decoupling for BGA packages
08/20/2003CN1437780A Connector and substrate for electronic circuit fabrication
08/20/2003CN1437657A Hardened Fe-Ni alloy for making integrated circuit grids and method for making same
08/20/2003CN1437258A Antistatic assembly and antistatic circuit for electrostatic discharge protection assembly
08/20/2003CN1437257A 晶圆结构 Wafer structure
08/20/2003CN1437256A Semiconductor element and producing method thereof, and semiconductor device and producing method thereof
08/20/2003CN1437255A Semiconductor configuration and making process
08/20/2003CN1437254A Heat disperser
08/20/2003CN1437233A Packaged semiconductor device and its forming method
08/20/2003CN1437230A Electrostatic protection structure with defect area inside drain and its making process
08/20/2003CN1436868A High-strength and high-conductivity copper-base material and its prepn process
08/20/2003CN1436819A Black composite particles for semiconductor sealing material use and semiconductor sealing material
08/20/2003CN1119074C Combined electric conductor and optical wave guide edge contact parts
08/20/2003CN1118922C Improved structure of modular power source
08/20/2003CN1118873C Semiconductor device with X-shaped tube core support
08/20/2003CN1118870C Method for producing semiconductor device
08/20/2003CN1118869C Integrated circuit contacts with fixed stringers
08/19/2003USRE38222 Electrostatic discharge protection circuit triggered by capacitive-coupling
08/19/2003US6609242 Automated creation of power distribution grids for tiled cell arrays in integrated circuit designs
08/19/2003US6608752 Adaptive heat sink for electronics applications
08/19/2003US6608751 Electronic device
08/19/2003US6608390 Wirebonded semiconductor package structure and method of manufacture
08/19/2003US6608389 Semiconductor device with stress relieving layer comprising circuit board and electronic instrument
08/19/2003US6608388 Delamination-preventing substrate and semiconductor package with the same
08/19/2003US6608387 Semiconductor device formed by mounting semiconductor chip on support substrate, and the support substrate
08/19/2003US6608386 Sub-nanoscale electronic devices and processes
08/19/2003US6608385 Contact structure and production method thereof and probe contact assembly using same
08/19/2003US6608384 Semiconductor device and method of forming the same
08/19/2003US6608382 Metal bump
08/19/2003US6608381 Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof
08/19/2003US6608380 Semiconductor chip package having one or more sealing screws
08/19/2003US6608379 Enhanced chip scale package for flip chips
08/19/2003US6608377 Wafer level package including ground metal layer
08/19/2003US6608376 Integrated circuit package substrate with high density routing mechanism
08/19/2003US6608375 Semiconductor apparatus with decoupling capacitor
08/19/2003US6608373 Support structure for power element
08/19/2003US6608372 Surface mountable chip type semiconductor device and manufacturing method
08/19/2003US6608371 Simple electrical connection of miniature, stacked chips
08/19/2003US6608369 Reliability
08/19/2003US6608368 Semiconductor device with power source conductor pattern and grounding conductor pattern
08/19/2003US6608367 Leadframe inductors
08/19/2003US6608366 Lead frame with plated end leads
08/19/2003US6608355 Semiconductor integrated circuit having anti-fuse, method of fabricating, and method of writing data in the same
08/19/2003US6608353 Thin film transistor having pixel electrode connected to a laminate structure
08/19/2003US6608351 Semiconductor device comprising a high-voltage circuit element
08/19/2003US6608335 Grounded fill in a large scale integrated circuit
08/19/2003US6608259 Ground plane for a semiconductor chip
08/19/2003US6608112 Batimastat BB94 ("Batimastat")
08/19/2003US6607989 Heat treatment redistributes Cu particles segregated in the Al-Cu alloy layer during the O2-plasma pretreatment, preventing occurrence of a short-circuit failure.
08/19/2003US6607986 Laminating a first insulating layer containing carbon and a second insulating layer containing carbon on a substrate, patterning the second insulating layer into a preset shape, forming grooves in first layer by etching with reactive gas
08/19/2003US6607982 High magnesium content copper magnesium alloys as diffusion barriers
08/19/2003US6607981 Method for forming a Cu interconnect pattern
08/19/2003US6607978 Method of making a semiconductor device with alloy film between barrier metal and interconnect
08/19/2003US6607976 Copper interconnect barrier layer structure and formation method
08/19/2003US6607970 Semiconductor device and method of manufacturing the same
08/19/2003US6607962 Globally planarized backend compatible thin film resistor contact/interconnect process
08/19/2003US6607958 Semiconductor device and method of manufacturing the same
08/19/2003US6607945 Laser-assisted silicide fuse programming
08/19/2003US6607943 Low profile ball grid array package
08/19/2003US6607942 Method of fabricating as grooved heat spreader for stress reduction in an IC package
08/19/2003US6607941 Process and structure improvements to shellcase style packaging technology
08/19/2003US6607940 Method of manufacturing semiconductor devices and semiconductor devices made according to the method
08/19/2003US6607939 Method of making a multi-layer interconnect
08/19/2003US6607938 Wafer level stack chip package and method for manufacturing same
08/19/2003US6607928 Integrated circuit device having an embedded heat slug
08/19/2003US6607821 Applications and devices based on nanostructured non-stoichiometric substances
08/19/2003US6607779 Non-stoichiometric non- equilibrium material, and the material is a nanostructured material.
08/19/2003US6607117 Solder ball attaching system and method
08/19/2003US6607028 Positioning structure for heat dissipating fins
08/19/2003US6607023 Structure for assembling a heat sink assembly
08/19/2003US6607019 Method and apparatus for application of adhesive tape to semiconductor devices
08/14/2003WO2003067949A1 Cooling mechanism and information processing device using the cooling mechanism
08/14/2003WO2003067946A1 Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board
08/14/2003WO2003067940A2 Circuit carrier and production thereof
08/14/2003WO2003067659A1 Device for connecting an ic terminal to a reference potential
08/14/2003WO2003067658A2 Thermal management materials having a phase change dispersion
08/14/2003WO2003067656A1 Semiconductor chip mounting board, its manufacturing method, and semiconductor module
08/14/2003WO2003067653A2 Monitoring of contact hole production
08/14/2003WO2003067651A1 Test wafer and method for investigating elecrostatic discharge induced wafer defects
08/14/2003WO2003067648A2 Semiconductor device and method of manufacturing the same
08/14/2003WO2003067647A2 Method and device for protecting electronic, optoelectronic and/or electromechanical microcomponents
08/14/2003WO2003067646A2 Semiconductor substrate comprising an electrically isolated region, in particular for vertical integration
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