Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2003
08/27/2003CN1438703A 半导体集成电路器件 The semiconductor integrated circuit device
08/27/2003CN1438702A Metal washer structure on semiconductor substrate
08/27/2003CN1438701A Jointing washer structure on semiconductor substrate
08/27/2003CN1438700A Semiconductor lead carriage and its package assembly
08/27/2003CN1438699A Efficient radiator fin and making method thereof
08/27/2003CN1438698A 半导体器件 Semiconductor devices
08/27/2003CN1438697A Surface adhesive type prefocus cup structure for placing optical crystal chip
08/27/2003CN1438696A Pattern combination stucture of releasing stress force
08/27/2003CN1438687A Semiconductor device and its making method
08/27/2003CN1438686A Semiconductor device and making method
08/27/2003CN1438684A Semiconductor chip package method and its package structure
08/27/2003CN1119833C Packaged integrated circuit device
08/27/2003CN1119832C Thermally enhanced leadframe
08/27/2003CN1119643C Checking chip
08/27/2003CN1119619C Device for spray-cooling electronic component
08/26/2003US6611950 Semiconductor device, semiconductor device design method, semiconductor device design method recording medium, and semiconductor device design support system
08/26/2003US6611635 Opto-electronic substrates with electrical and optical interconnections and methods for making
08/26/2003US6611541 Laser diode matching circuit and method of impedance matching therefor
08/26/2003US6611458 Semiconductor integrated circuit device
08/26/2003US6611449 Contact for memory cells
08/26/2003US6611431 Heat dissipation assembly
08/26/2003US6611419 Electronic assembly comprising substrate with embedded capacitors
08/26/2003US6611188 Integrated vertical spiral inductor on semiconductor material
08/26/2003US6611098 Thermal shock resistance
08/26/2003US6611065 Connection material
08/26/2003US6611064 Semiconductor device and method for manufacturing the same
08/26/2003US6611063 Resin-encapsulated semiconductor device
08/26/2003US6611062 Twisted wordline strapping arrangement
08/26/2003US6611061 Tantalum-aluminum-nitrogen material for semiconductor devices
08/26/2003US6611060 Semiconductor device having a damascene type wiring layer
08/26/2003US6611059 Integrated circuitry conductive lines
08/26/2003US6611057 Semiconductor device attaining both high speed processing and sufficient cooling capacity
08/26/2003US6611056 Composite material, and manufacturing method and uses of same
08/26/2003US6611055 Leadless flip chip carrier design and structure
08/26/2003US6611054 IC package lid for dose enhancement protection
08/26/2003US6611052 Wafer level stackable semiconductor package
08/26/2003US6611051 Semiconductor device and communication terminal using thereof
08/26/2003US6611050 Chip edge interconnect apparatus and method
08/26/2003US6611049 Semiconductor device with chamfered substrate and method of making the same
08/26/2003US6611048 Exposed paddle leadframe for semiconductor die packaging
08/26/2003US6611047 Semiconductor package with singulation crease
08/26/2003US6611042 Semiconductor device including resistors isolated and equdistant from diffusion regions
08/26/2003US6611041 Inductor with patterned ground shield
08/26/2003US6611040 Inexpensive; permanently writing and storing individual identification codes
08/26/2003US6611039 Vertically oriented nano-fuse and nano-resistor circuit elements
08/26/2003US6611035 Ferrite magnetic film structure having magnetic anisotropy, method of manufacturing the same, and planar magnetic device employing ferrite magnetic film structure having magenetic anisotropy
08/26/2003US6611030 Cmosfet with conductive, grounded backside connected to the wiring layer through a hole that separates the Mosfets
08/26/2003US6611025 Apparatus and method for improved power bus ESD protection
08/26/2003US6611012 Semiconductor device
08/26/2003US6611011 Memory cell array divided into a plurality of subarrays arranged in matrix form
08/26/2003US6611010 Semiconductor device
08/26/2003US6611006 Vertical component peripheral structure
08/26/2003US6610934 Semiconductor module and method of making the device
08/26/2003US6610924 Semiconductor package
08/26/2003US6610923 Multi-chip module utilizing leadframe
08/26/2003US6610635 Dry thermal interface material
08/26/2003US6610621 Glass-ceramic composition for ceramic electronic part, ceramic electronic part, and method for manufacturing multilayer ceramic electronic part
08/26/2003US6610610 Methods for selective removal of material from wafer alignment marks
08/26/2003US6610601 Bond pad and wire bond
08/26/2003US6610597 Method of fabricating a semiconductor device
08/26/2003US6610595 Ball limiting metallurgy for input/outputs and methods of fabrication
08/26/2003US6610594 Locally increasing sidewall density by ion implantation
08/26/2003US6610591 Methods of ball grid array
08/26/2003US6610590 Method of manufacturing a laser impression on a low thermal conductivity layer of a semiconductor device
08/26/2003US6610587 Method of forming a local interconnect
08/26/2003US6610561 Method of fabricating a semiconductor device
08/26/2003US6610560 Chip-on-chip based multi-chip module with molded underfill and method of fabricating the same
08/26/2003US6610558 Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate
08/26/2003US6610406 Used to coat electronic or electrical devices such as semiconductors, diodes, and integrated circuits; free of halogen, phosphorus, and antimony
08/26/2003US6610162 Methods for stress reduction feature for LOC lead frame
08/26/2003US6610151 Seed layers for interconnects and methods and apparatus for their fabrication
08/26/2003US6609923 Semiconductor device-socket
08/26/2003US6609914 High speed and density circular connector for board-to-board interconnection systems
08/26/2003US6609561 Tunnel-phase change heat exchanger
08/26/2003US6609560 Flat evaporator
08/21/2003WO2003069969A2 High density 3-d integrated circuit package
08/21/2003WO2003069968A2 Housing for a power semiconductor module which is resistant to high voltages
08/21/2003WO2003069743A1 Sub-mount and semiconductor device
08/21/2003WO2003069734A1 Intermediate board
08/21/2003WO2003069695A2 Multilayer package for a semiconductor device
08/21/2003WO2003069671A2 Rf transition for an area array package
08/21/2003WO2003069670A1 Semiconductor device and method for manufacturing same
08/21/2003WO2003069665A1 Method of manufacturing an encapsulated integrated circuit package
08/21/2003WO2003069661A1 Semiconductor manufacturing method and semiconductor manufacturing apparatus
08/21/2003WO2003068825A2 Multifunctional monomers and their use in making cross-linked polymers and porous films
08/21/2003WO2003052817A3 Method of bonding and transferring a material to form a semiconductor device
08/21/2003WO2003046988A3 Electronic assembly
08/21/2003WO2003031994B1 Socket and contact of semiconductor package
08/21/2003WO2003031373A3 Thick film conductor compositions for use on aluminum nitride substrates
08/21/2003WO2003030081A3 Semiconductor wafer identification
08/21/2003WO2003026008A3 Power electronics component
08/21/2003WO2003005444A3 Ceramic-filled polymer substrate for using in high frequency technology
08/21/2003WO2003005410A3 Semiconductor device, semiconductor test structure and method for producing a semiconductor device
08/21/2003WO2003003455A3 Using the wave soldering process to attach motherboard chipset heat sinks
08/21/2003WO2002099845A3 Electronic chip and electronic chip assembly
08/21/2003WO2002091496A3 Reversible field-programmable electric interconnects
08/21/2003WO2002058154A3 Semiconductor component comprising esd protection
08/21/2003WO2002045152A3 Flip chip mounting technique
08/21/2003WO2002017390A3 Refrigeration device and a method for producing the same
08/21/2003WO2001090866A3 Active cooling system for cpu and semiconductors
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