Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2003
08/28/2003US20030162319 Micro grid array semiconductor die package
08/28/2003US20030162312 Vehicle, display device and manufacturing method for a semiconductor device
08/28/2003US20030162311 Substrate mapping
08/28/2003US20030162047 Electrically conductive filled through holes
08/28/2003US20030162038 Curable composition for forming low bleeding gel type cured product
08/28/2003US20030162034 Organofluorosilicate glass films containing both organic species and inorganic fluorines, exclusive of significant amounts of fluorocarbon species; insulating layers for integrated circuits and associated electronic devices
08/28/2003US20030161943 Provides dual damascene interconnect module that incorporates selective chemical vapor deposition of aluminum via fill with copper wire formed within barrier layer
08/28/2003US20030161198 Method and apparatus for implementing a selectively operable clock booster for DDR memory or other logic modules which utilize partially-defective memory parts, or a combination of partially-defective and flawless memory parts
08/28/2003US20030161132 Communication device
08/28/2003US20030161129 Flexible multilayer wiring board and manufacture method thereof
08/28/2003US20030161128 Multi-layer wiring device, wiring method and wiring characteristic analyzing/predicting method
08/28/2003US20030161124 Wiring-design system for wiring-board for area-input/output-type semiconductor chip
08/28/2003US20030161122 Electronic component and method of producing the same
08/28/2003US20030161120 Wiring board, method of manufacturing the same, electronic component, and electronic instrument
08/28/2003US20030161119 Printed circuit board assembly having retention module and back plate
08/28/2003US20030161112 Semiconductor device and method of producing the same
08/28/2003US20030161111 Heat dissipation structure for use in combination with electronic circuit board
08/28/2003US20030161109 Electronic product with heat radiating plate
08/28/2003US20030161107 Heat dissipater for integrated circuits
08/28/2003US20030161106 Heat sink with integrated electronics
08/28/2003US20030161105 Thermal dissipation assembly for electronic components
08/28/2003US20030161104 Finned-tube heat exchangers and cold plates, self-cooling electronic component systems using same, and methods for cooling electronic components using same
08/28/2003US20030161103 Cooling units
08/28/2003US20030161100 Electronic apparatus
08/28/2003US20030161086 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
08/28/2003US20030161085 Heat sink fastener
08/28/2003US20030160715 Semiconductor device, method of manufacturing semiconductor device and communication method
08/28/2003US20030160339 Electronic component and fabrication method thereof
08/28/2003US20030160338 Coupling spaced bond pads to a contact
08/28/2003US20030160337 Semiconductor device and process for fabrication thereof
08/28/2003US20030160335 Flip chip interconnection structure and fabrication process thereof
08/28/2003US20030160333 Semiconductor devices having multilevel interconnections and methods for manufacturing the same
08/28/2003US20030160332 Semiconductor devices and methods of manufacturing such semiconductor devices
08/28/2003US20030160331 Interconnection structure between wires
08/28/2003US20030160330 Multilayer bonding pad; overcoating copper with titanium-aluminum alloy; passivation, annealing
08/28/2003US20030160328 Wiring structure in a semiconductor device
08/28/2003US20030160327 Semiconductor device
08/28/2003US20030160326 Electroplating copper; etching; stress relieving
08/28/2003US20030160325 Multilayer structure; fine wire pattern; controlling incline
08/28/2003US20030160323 Wafer-level package structure
08/28/2003US20030160322 Monolithic microwave integrated circuit package having thermal via
08/28/2003US20030160320 High heat dissipation micro-packaging body for semiconductor chip
08/28/2003US20030160319 Solid assembly of flip-chip package attached to heat removal device and method of manufacturing same
08/28/2003US20030160317 Forming channel in electroconductive foil; overcoating with dielectric
08/28/2003US20030160316 Open-type multichips stack packaging
08/28/2003US20030160314 Modular semiconductor die package and method of manufacturing thereof
08/28/2003US20030160313 Semiconductor device
08/28/2003US20030160310 Micro-machined semiconductor package
08/28/2003US20030160309 Ground plane for exposed package
08/28/2003US20030160308 Semiconductor device
08/28/2003US20030160307 Leadframe inductors
08/28/2003US20030160306 Leadframe inductors
08/28/2003US20030160303 Semiconductor chip mounting wafer
08/28/2003US20030160299 On- chip inductor having improved quality factor and method of manufacture thereof
08/28/2003US20030160298 Anti-fuse and method for writing information into the anti-fuse
08/28/2003US20030160297 System for programming fuse structure by electromigration of silicide enhanced by creating temperature gradient
08/28/2003US20030160294 Substrate for semiconductor package
08/28/2003US20030160293 Method of connecting core I/O pins to backside chip I/O pads
08/28/2003US20030160285 Semiconductor device and method of manufacturing the same
08/28/2003US20030160268 Variating width between wire channels
08/28/2003US20030160267 Semiconductor device having a capacitor and a metal interconnect layer with tungsten as a main constituent material and containing molybdenum
08/28/2003US20030160261 Semiconductor device with slot above guard ring
08/28/2003US20030160258 Electronic part and method of producing the same
08/28/2003US20030160256 Plastic packaging of LED arrays
08/28/2003US20030160252 Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof
08/28/2003US20030160036 Laser repair operation
08/28/2003US20030159852 Multilayer wiring board, manufacturing method therefor and test apparatus thereof
08/28/2003US20030159819 Heatsink device for cooling chipset
08/28/2003US20030159817 Heat sink and its manufacturing method
08/28/2003US20030159806 Flat-plate heat-pipe with lanced-offset fin wick
08/28/2003US20030159278 Methods and apparatus for fabricating Chip-on-Board modules
08/28/2003US20030159262 High frequency device packages and methods
08/28/2003DE20309446U1 Flip-chip structure for light emitting diode (LED) with silicon substrate, has conductors defined as plus and minus poles by chip
08/28/2003DE20308235U1 Releasable connector for vertical stack of microtechnical components in mm range
08/28/2003DE20307485U1 High performance cooler for electronic components with forced flow of coolant through chambers
08/27/2003EP1339271A1 Substrate and production method therefor
08/27/2003EP1339102A1 Lead frame and semiconductor device using this
08/27/2003EP1338914A2 Method for manufacturing liquid crystal display
08/27/2003EP1338397A2 Method for manufacturing encapsulated electronic components
08/27/2003EP1338035A2 Method for producing semiconductor modules and a module produced according to said method
08/27/2003EP1338031A2 Copper alloy interconnections for integrated circuits and methods of making same
08/27/2003EP1337497A2 A heat conductive material
08/27/2003EP1230711B1 Arrangement for electrically connecting chips in a circuit that is embodied in a three-dimensional manner
08/27/2003EP1192659B1 Multichip module and method for producing a multichip module
08/27/2003EP0948879A4 Ceramic composite wiring structures for semiconductor devices and method of manufacture
08/27/2003EP0708985B1 Apparatus for encapsulating with plastic a lead frame with chips
08/27/2003CN2569532Y Improved heat conductive tube and radiation fin device
08/27/2003CN2569345Y 回路型热管结构 Loop type heat pipe structure
08/27/2003CN2569344Y 散热器 Heat sink
08/27/2003CN2569343Y Heat radiator combination
08/27/2003CN2569342Y Detachable high density radiator
08/27/2003CN2569341Y Downward joint type integrated circuit radiator
08/27/2003CN2569340Y Crystal coated chip
08/27/2003CN2569216Y Packed structure for increasing heat radiation surface area and heat dispatching
08/27/2003CN1439193A SAW device
08/27/2003CN1439174A Process for the manufacture of printed circuit boards with plated resistors
08/27/2003CN1439144A Semiconductor device and its manufacturing method
08/27/2003CN1438833A Circuit-board having internal electronic element and making method thereof
08/27/2003CN1438705A Diode structure and its electrostatic discharge protection circuit
08/27/2003CN1438704A Electrostatic discharge circuit suitable to bearing high roltage in high frequeny and analogue
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