Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2003
09/02/2003US6614113 Semiconductor device and method for producing the same
09/02/2003US6614112 Semiconductor device with shock absorbing bond pad
09/02/2003US6614111 Semiconductor device using bumps, method for fabricating same, and method for forming bumps
09/02/2003US6614110 Module with bumps for connection and support
09/02/2003US6614109 Thermal sink of semiconductor material capable of absorbing heat from the integrated circuit is formed on the back side; p-type and n-type thermoelectric cooling elements
09/02/2003US6614108 Electronic package and method therefor
09/02/2003US6614107 Thin-film heat sink and method of manufacturing same
09/02/2003US6614106 Stacked circuit device and method for evaluating an integrated circuit substrate using the stacked circuit device
09/02/2003US6614105 Chip-type semiconductor device
09/02/2003US6614103 Plastic packaging of LED arrays
09/02/2003US6614102 Shielded semiconductor leadframe package
09/02/2003US6614101 Lead frame with raised leads and plastic packaged semiconductor device using the same
09/02/2003US6614100 Lead frame for the installation of an integrated circuit in an injection-molded package
09/02/2003US6614099 Copper metallurgy in integrated circuits
09/02/2003US6614098 Semiconductor devices and fabrication thereof
09/02/2003US6614097 Method for composing a dielectric layer within an interconnect structure of a multilayer semiconductor device
09/02/2003US6614096 Method for manufacturing a semiconductor device and a semiconductor device
09/02/2003US6614095 Diamond component with rear side contact and a method for the production thereof
09/02/2003US6614093 Integrated inductor in semiconductor manufacturing
09/02/2003US6614092 Microelectronic device package with conductive elements and associated method of manufacture
09/02/2003US6614091 Semiconductor device having a wire bond pad and method therefor
09/02/2003US6614088 Breakdown improvement method and sturcture for lateral DMOS device
09/02/2003US6614082 Fabrication of semiconductor devices with transition metal boride films as diffusion barriers
09/02/2003US6614073 Semiconductor chip with a base electrode and an emitter electrode exposed on one of a pair of opposite lateral faces and a collector electrode exposed on a remaining one of the pair of the opposite lateral faces
09/02/2003US6614061 Electrostatic discharge-protection semiconductor device
09/02/2003US6614051 Resistor and a capacitor connected in series; to measure charge accumulation on a semiconductor wafer
09/02/2003US6614049 System LSI chip having a logic part and a memory part
09/02/2003US6613978 Radiation shielding of three dimensional multi-chip modules
09/02/2003US6613834 Film forming material comprising siloxane resin and polycarbosilane dissolved together, having relative dielectric constant in range from about 2.5 to 3.0
09/02/2003US6613829 Conductive hardening resin for a semiconductor device and semiconductor device using the same
09/02/2003US6613699 Process for producing a semiconductor device
09/02/2003US6613696 Method of forming composite silicon oxide layer over a semiconductor device
09/02/2003US6613694 Semiconductor device, manufacturing method for semiconductor device and mounting method for the same
09/02/2003US6613671 Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby
09/02/2003US6613669 Semiconductor device and method for manufacturing the same
09/02/2003US6613668 Two layer liner for dual damascene via
09/02/2003US6613662 Method for making projected contact structures for engaging bumped semiconductor devices
09/02/2003US6613661 Process for fabricating secure integrated circuit
09/02/2003US6613654 Fabrication of semiconductor devices with transition metal boride films as diffusion barriers
09/02/2003US6613612 Fuse in semiconductor device and fabricating method thereof
09/02/2003US6613609 Method for producing a portable electronic device with an integrated circuit protected by a photosensitive resin
09/02/2003US6613608 Semiconductor wafer with anisotropic conductor film, and method of manufacture thereof
09/02/2003US6613607 Method for manufacturing encapsulated electronic components, particularly integrated circuits
09/02/2003US6613606 Structure of high performance combo chip and processing method
09/02/2003US6613605 Interconnection method entailing protuberances formed by melting metal over contact areas
09/02/2003US6613595 Test structure and method for flash memory tunnel oxide quality
09/02/2003US6613592 IMD oxide crack monitor pattern and design rule
09/02/2003US6613586 Hydrogen barrier encapsulation techniques for the control of hydrogen induced degradation of ferroelectric capacitors in conjunction with multilevel metal processing for non-volatile integrated circuit memory devices
09/02/2003US6613450 Metal/ceramic bonding article
09/02/2003US6613449 Chip on films; flexible printed circuit
09/02/2003US6613443 Silicon nitride ceramic substrate, silicon nitride ceramic circuit board using the substrate, and method of manufacturing the substrate
09/02/2003US6612890 Method and system for manufacturing electronic packaging units
09/02/2003US6612852 Contactless interconnection system
09/02/2003US6612159 Overlay registration error measurement made simultaneously for more than two semiconductor wafer layers
09/02/2003US6612120 Spray cooling with local control of nozzles
09/02/2003US6612024 Method of mounting a device to a mounting substrate
09/02/2003US6611999 Detent means for a heat sink
08/2003
08/28/2003WO2003071604A1 Semiconductor bonding method and multilayer semiconductor produced by the method
08/28/2003WO2003071603A1 Module part
08/28/2003WO2003071601A2 Circuit module and method for the production thereof
08/28/2003WO2003071596A2 Electronic component with an adhesive layer and method for the production thereof
08/28/2003WO2003071198A1 A heat transfer apparatus
08/28/2003WO2003070994A2 Lead-free tin-silver-copper alloy solder composition
08/28/2003WO2003070813A1 Method of making a nanoporous film
08/28/2003WO2003070812A1 Static electricity preventing method and method using the method
08/28/2003WO2003070809A2 Organosiloxanes and their use in dielectric films of semiconductors
08/28/2003WO2003044843A3 Forming low k dielectric layers
08/28/2003WO2003030257A3 Soldered heat sink anchor and method of use
08/28/2003WO2003030256A3 Arrangements to increase structural rigidity of semiconductor package
08/28/2003WO2003028092A3 Dual-damascene interconnects without an etch stop layer by alternating ilds
08/28/2003WO2003019620A3 Technique to minimize crosstalk in electronic packages
08/28/2003WO2002097881A3 Folded-fin heat sink assembly and method of manufacturing same
08/28/2003WO2002071482A8 Hollow structure in an integrated circuit and method for producing such a hollow structure in an integrated circuit
08/28/2003WO2002065543A3 Bonded structure using reacted borosilicate mixture
08/28/2003WO2002058117A3 Metal-insulator-metal capacitor in copper
08/28/2003WO2002027793A3 Method and apparatus for providing a variable inductor on a semiconductor chip
08/28/2003WO2002021593A9 Method of forming titanium nitride (tin) films using metal-organic chemical vapor deposition (mocvd)
08/28/2003WO2002011207A3 Electronic assembly comprising substrate with embedded capacitors and methods of manufacture
08/28/2003US20030163218 Patching methods and apparatus for fabricating memory modules
08/28/2003US20030162935 Halogen-free
08/28/2003US20030162911 No flow underfill composition
08/28/2003US20030162898 Blend curable at a low and high temperature of an epoxy resin-unsaturated aliphatic acid adduct, a (meth)acrylate, a free radical initiator, a crystallizable epoxy resin, and latent curing agent; smooth undercoatings for circuit boards
08/28/2003US20030162521 System and method for on-chip filter tuning
08/28/2003US20030162412 Low-dielectric silicon nitride film and method of forming the same, semiconductor device and fabrication process thereof
08/28/2003US20030162410 Method of depositing low K films
08/28/2003US20030162408 Insulation film on semiconductor substrate and method for forming same
08/28/2003US20030162405 Method of fabricating a thin and fine ball-grid array package with embedded heat spreader
08/28/2003US20030162391 Barrier layer and method of depositing a barrier layer
08/28/2003US20030162387 Method of making a void-free aluminum film
08/28/2003US20030162383 Semiconductor device and method for fabricating the same
08/28/2003US20030162382 Semiconductor device
08/28/2003US20030162379 Solder ball fabrication process
08/28/2003US20030162354 Method of fabricating semiconductor memory device and semiconductor memory device driver
08/28/2003US20030162331 Method for preventing burnt fuse pad from further electrical connection
08/28/2003US20030162330 Method for manufacturing a semiconductor device
08/28/2003US20030162328 Semiconductor device and method for manufacturing the semiconductor device
08/28/2003US20030162327 Methods for transverse hybrid LOC package
08/28/2003US20030162326 Semiconductor device and manufactuiring method thereof
08/28/2003US20030162325 Stacked die in die BGA package
08/28/2003US20030162323 Method for conducting heat in a flip-chip assembly
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