Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2003
09/04/2003US20030165303 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC ( low-temperature co-fired ceramic ) technology
09/04/2003US20030165178 Identifying defects in a conductive structure of a wafer, based on heat transfer therethrough
09/04/2003US20030165052 Semiconductor device and manufacturing the same
09/04/2003US20030164911 Liquid crystal display device
09/04/2003US20030164556 Composite interposer for BGA packages
09/04/2003US20030164555 B-stageable underfill encapsulant and method for its application
09/04/2003US20030164554 Quad flat no lead (QFN) grid array package, method of making and memory module and computer system including same
09/04/2003US20030164553 Method of attaching a die to a substrate
09/04/2003US20030164552 Under-ball metallic layer
09/04/2003US20030164551 Method and apparatus for flip-chip packaging providing testing capability
09/04/2003US20030164549 Semiconductor device and manufacturing method for the same, circuit board, and electronic device
09/04/2003US20030164548 Flip chip packaging using recessed interposer terminals
09/04/2003US20030164547 Semiconductor device and manufacturing method thereof
09/04/2003US20030164544 Semiconductor module including a plurality of semiconductor devices detachably
09/04/2003US20030164543 Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods
09/04/2003US20030164542 Decreased thickness; electric characteristics
09/04/2003US20030164541 Method and apparatus for dielectric filling of flip chip on interposer assembly
09/04/2003US20030164540 Semiconductor die packages with recessed interconnecting structures and methods for assembling the same
09/04/2003US20030164538 Semiconductor device
09/04/2003US20030164537 Semiconductor component comprising a surface metallization
09/04/2003US20030164536 Semiconductor device
09/04/2003US20030164535 Lead frame manufacturing method
09/04/2003US20030164532 Fuse construction for integrated circuit structure having low dielectric constant dielectric material
09/04/2003US20030164521 Semiconductor device having ESD protective transistor
09/04/2003US20030164516 Semiconductor device and method of manufacturing the same
09/04/2003US20030164508 Electrostatic discharge protection apparatus
09/04/2003US20030164505 Light-emitting semiconductor component
09/04/2003US20030164494 Diverse band gap energy level semiconductor device
09/04/2003US20030164493 Diverse band gap energy level semiconductor device
09/04/2003US20030164492 Diverse band gap energy level semiconductor device
09/04/2003US20030164491 Diverse band gap energy level semiconductor device
09/04/2003US20030164395 Solder ball attaching process
09/04/2003US20030164353 Method for manufacturing semiconductor device
09/04/2003US20030164303 Forming vias on the package substrate coated with copper film; electroplating to form electrical conductive holes; coating a resisting agent; etching the pattern; removing; electroplating substrate with nickel and gold, and removing the resist
09/04/2003US20030164231 Electroosmotic microchannel cooling system
09/04/2003US20030164211 Fe-ni or fe-ni-co or fe-ni-co-cu alloy strip with improved cuttability
09/04/2003US20030164206 Discontinuous carbon fiber reinforced metal matrix composite
09/04/2003CA2477766A1 Improved patching methods and apparatus for fabricating memory modules
09/04/2003CA2477763A1 Methods and apparatus for fabricating chip-on-board modules
09/04/2003CA2477754A1 Memory module assembly using partially defective chips
09/04/2003CA2477071A1 Finned-tube heat exchangers and cold plates, self-cooling electronic co mponent systems using same, and methods for cooling electronic components using same
09/03/2003EP1341231A2 System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit package
09/03/2003EP1341230A1 Heat dissipator for integrated circuits
09/03/2003EP1341229A1 Method for hermetic sealing of electronic parts
09/03/2003EP1341228A2 Electronic product with heat radiating plate
09/03/2003EP1341227A2 Interconnection structure in semiconductor devices and method for making the same
09/03/2003EP1341214A1 Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip
09/03/2003EP1341186A1 A flexible hybrid memory element
09/03/2003EP1340267A2 Enhanced interface thermoelectric coolers
09/03/2003EP1340266A2 Enhanced interface thermoelectric coolers
09/03/2003EP1340262A2 Poly fuse rom with mos device based cell structure and the method for read and write therefore
09/03/2003EP1340260A2 Compact semiconductor structure and a method for producing the same
09/03/2003EP1340259A1 Method for production of a support element for an ic component
09/03/2003EP1340258A2 Thermally enhanced microcircuit package and method of forming same
09/03/2003EP1340257A2 An electronic assembly having a heat pipe that conducts heat from a semiconductor die
09/03/2003EP1340256A2 Packaged electronic component and method for packaging an electronic component
09/03/2003EP1340255A2 Interposer for a semiconductor module, semiconductor produced using such an interposer and method for producing such an interposer
09/03/2003EP1340252A2 Optimized liners for dual damascene metal wiring
09/03/2003EP1340250A2 Bump formation method and bump forming apparatus to semiconductor wafer
09/03/2003EP1340245A2 Method for incorporating silicon into cvd metal films
09/03/2003EP1340126A1 Method of aligning a photolithographic mask to a crystal plane
09/03/2003EP1339524A1 Fluxing underfill compositions
09/03/2003CN2571137Y Novel superconductor radiator
09/03/2003CN2570983Y Heat sink fin fixing mount with improved arrangement
09/03/2003CN2570982Y Circular heat sinking unit
09/03/2003CN2570981Y Upside-down mounting type chip packaging arrangement
09/03/2003CN2570980Y Packaging arrangement of superintegrated circuit
09/03/2003CN2570979Y Chip packaging arrangement
09/03/2003CN2570978Y Rewinding type semiconductor packaging arrangement
09/03/2003CN2570854Y Vane style radiator
09/03/2003CN1440076A Semiconductor device
09/03/2003CN1440075A Radiator by utilizing its shield
09/03/2003CN1440074A Semiconductor device and manufacture thereof, circuit board and electronic device
09/03/2003CN1440073A Semiconductor component basement and manufacture thereof, semiconductor potted element
09/03/2003CN1440072A Semiconductor device and manufacture thereof, circuit board and electronic device
09/03/2003CN1440068A Multilayer wire distribution device and method thereof, wire distribution characteristic analysing and predicting method
09/03/2003CN1440065A Semiconductor device and manufacture thereof, electronic machine
09/03/2003CN1440064A Semiconductor device and manufacture thereof, circuit board and electronic machine
09/03/2003CN1440063A Semiconductor device and manufacture thereof, circuit board and electronic machine
09/03/2003CN1440062A Projected spots forming method, semiconductor component with projected spots and manufacture thereof, semiconductor device and manufacture thehreof, circuit placode
09/03/2003CN1440058A Metal board and shaping method thereof
09/03/2003CN1440049A Manufacture for semiconductor devices
09/03/2003CN1439685A Adhesion agent, adhesive membrane and electrie device
09/03/2003CN1120653C Fan attachment clip for heat sink
09/03/2003CN1120399C Method and device for establishing heat transfer between integrated circuit and radiating sheets
09/02/2003US6615399 Semiconductor device having dummy pattern
09/02/2003US6615390 Method of manufacturing IC cards
09/02/2003US6615041 Methods and systems for providing information to a home system regarding a wireless unit roaming in a visited system
09/02/2003US6614664 Memory module having series-connected printed circuit boards
09/02/2003US6614660 Thermally enhanced IC chip package
09/02/2003US6614657 Heat sink for cooling an electronic component of a computer
09/02/2003US6614655 Method of controlling cooling system for a personal computer and personal computer
09/02/2003US6614641 Ceramic electronic component
09/02/2003US6614590 Optical semiconductor hermetic sealing package, optical semiconductor module and optical fiber amplifier
09/02/2003US6614308 Multi-stage, high frequency, high power signal amplifier
09/02/2003US6614123 Plastic ball grid array package with integral heatsink
09/02/2003US6614120 Semiconductor device
09/02/2003US6614118 Structures to mechanically stabilize isolated top-level metal lines
09/02/2003US6614117 Method for metallization of a semiconductor substrate and related structure
09/02/2003US6614116 Buried digit line stack and process for making same
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