Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2003
09/09/2003US6617659 Semiconductor device having heat detecting element and insulating cavity and method of manufacturing thereof
09/09/2003US6617655 MOSFET device with multiple gate contacts offset from gate contact area and over source area
09/09/2003US6617649 Low substrate-noise electrostatic discharge protection circuits with bi-directional silicon diodes
09/09/2003US6617630 Resin-encapsulated semiconductor apparatus and process for its fabrication
09/09/2003US6617622 The pads on adjacent rows are offset from each other. Leads are provided on the semiconductor chip and bonding wires selectively connect the leads to the pads.
09/09/2003US6617528 Electronic package with stacked connections and method for making same
09/09/2003US6617525 Molded stiffener for flexible circuit molding
09/09/2003US6617517 Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink
09/09/2003US6617510 Stress relief bend useful in an integrated circuit redistribution patch
09/09/2003US6617401 Free of halogen, and contains at least one cure modifier, and, optionally at least one ancillary curing catalyst; for encapsulating a solid state device
09/09/2003US6617400 Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst
09/09/2003US6617399 Thermosetting resin compositions comprising epoxy resins, adhesion promoters, curatives based on the combination of nitrogen compounds and transition metal complexes, and polysulfide tougheners
09/09/2003US6617398 Forming laminate; curing; cladding with copper; printed circuits
09/09/2003US6617263 Pattern forming method for flattening an organic film for a liquid crystal display device
09/09/2003US6617261 Structure and method for fabricating GaN substrates from trench patterned GaN layers on sapphire substrates
09/09/2003US6617260 Method of manufacturing semiconductor device prevented from peeling of wirings from insulating film
09/09/2003US6617259 Method for fabricating semiconductor device and forming interlayer dielectric film using high-density plasma
09/09/2003US6617252 Monolithic low dielectric constant platform for passive components and method
09/09/2003US6617244 Etching method
09/09/2003US6617243 Routing for multilayer ceramic substrates to reduce excessive via depth
09/09/2003US6617242 Method for fabricating interlevel contacts of aluminum/refractory metal alloys
09/09/2003US6617240 Method of fabricating semiconductor device
09/09/2003US6617234 Method of forming metal fuse and bonding pad
09/09/2003US6617233 Process of fabricating an anti-fuse for avoiding a key hole exposed
09/09/2003US6617231 Method for forming a metal extrusion free via
09/09/2003US6617201 U-shape tape for BOC FBGA package to improve moldability
09/09/2003US6617200 System and method for fabricating a semiconductor device
09/09/2003US6617199 Electronic device having fibrous interface
09/09/2003US6617198 Semiconductor assembly without adhesive fillets
09/09/2003US6617197 Multi row leadless leadframe package
09/09/2003US6617196 Semiconductor device
09/09/2003US6617194 Electronic component, communication device, and manufacturing method for electronic component
09/09/2003US6617193 Semiconductor device, semiconductor device substrate, and methods of fabricating the same
09/09/2003US6617181 Flip chip testing
09/09/2003US6617180 Test structure for detecting bridging of DRAM capacitors
09/09/2003US6617178 Test system for ferroelectric materials and noble metal electrodes in semiconductor capacitors
09/09/2003US6617176 Method of determining barrier layer effectiveness for preventing metallization diffusion by forming a test specimen device and using a metal penetration measurement technique for fabricating a production semiconductor device and a test specimen device thereby formed
09/09/2003US6617172 Semiconductor device having identification number, manufacturing method thereof and electronic device
09/09/2003US6617046 For sealing gaps between printed circuit boards and semiconductor packages
09/09/2003US6617028 Phosphorus and nitrogen containing resin hardener and a flame retarding resin composition containing said hardener
09/09/2003US6617021 Blend of epoxy resin, phenolic resin, butadiene-styrene copolymer and organosilicon compound
09/09/2003US6616999 At a juncture between an electronic component and a heat sink for facilitating heat transfer
09/09/2003US6616984 Cocuring agent is preferable 2-allyphenyl glycidyl ether, 2,2'-diallybisphenol A diglycidyl ether, or mixtures thereof.
09/09/2003US6616967 Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process
09/09/2003US6616854 Method of bonding and transferring a material to form a semiconductor device
09/09/2003US6616469 Electrical and fluid interconnect
09/09/2003US6616436 Apparatus for manufacturing semiconductor packages
09/09/2003US6615911 High performance liquid-cooled heat sink with twisted tape inserts for electronics cooling
09/09/2003US6615910 Advanced air cooled heat sink
09/09/2003US6615909 Corrugated matrix heat sink for cooling electronic components
09/09/2003US6615609 Accumulator
09/09/2003US6615485 Probe card assembly and kit, and methods of making same
09/04/2003WO2003073816A1 Finned- tube heat exchangers and cold plates, self-cooling electronic component systems using same, and methods for cooling electronic components using same
09/04/2003WO2003073805A2 Improved patching methods and apparatus for fabricating memory modules
09/04/2003WO2003073607A1 Mems-based, computer systems, clock generation and oscillator circuits and lc-tank apparatus for use therein
09/04/2003WO2003073596A1 Integrated magnetic buck converter with magnetically coupled synchronously rectified mosfet gate drive
09/04/2003WO2003073505A1 Integrated circuit device and method of manufacturing thereof
09/04/2003WO2003073504A1 Semiconductor device and method of producing high contrast identification mark
09/04/2003WO2003073503A2 Fuse structure programming by electromigration of silicide enhanced by creating temperature gradient
09/04/2003WO2003073502A1 Micro grid array package for a semiconducteur die
09/04/2003WO2003073501A2 Leadframe inductors
09/04/2003WO2003073500A1 A substrate for a semiconductor device
09/04/2003WO2003073494A2 Method of controlling metal etch processes, and system for accomplishing same
09/04/2003WO2003073475A2 Heat sink for semiconductor die employing phase change cooling
09/04/2003WO2003073474A2 Modular semiconductor die package and method of manufacturing thereof
09/04/2003WO2003073473A2 High frequency device packages and methods
09/04/2003WO2003073467A2 Integrated active moisture and oxygen getter layers
09/04/2003WO2003073357A1 Methods and apparatus for fabricating chip-on-board modules
09/04/2003WO2003073356A1 Memory module assembly using partially defective chips
09/04/2003WO2003073187A2 Method for automatic thermal calibration of a cooling system
09/04/2003WO2003072846A1 A method of depositing a barrier layer
09/04/2003WO2003072668A1 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
09/04/2003WO2003072655A1 Encapsulating epoxy resin composition, and electronic parts device using the same
09/04/2003WO2003072628A1 Encapsulating epoxy resin composition, and electronic parts device using the same
09/04/2003WO2003072627A1 Low-corrosive epoxy resins and production method therefor
09/04/2003WO2003072325A1 Ceramic multilayer substrate manufacturing method and unfired composite multilayer body
09/04/2003WO2003052890B1 Processing a memory link with a set of at least two laser pulses
09/04/2003WO2003041162A3 Method of forming reliable cu interconnects
09/04/2003WO2003028091A3 Copper interconnect barrier layer structure and formation method
09/04/2003WO2003024724B1 Dry thermal interface material
09/04/2003WO2003022732A3 Method for the production of a membrane
09/04/2003WO2003017365A3 Thermal transfer devices using heat pipes
09/04/2003WO2003012865A3 Cooling apparatus
09/04/2003WO2002060810A3 Micro-element substrate interconnection
09/04/2003WO2002058152A3 Electronic circuit device and method for manufacturing the same
09/04/2003WO2002049104A3 Power module having improved transient thermal impedance
09/04/2003WO2002009153A3 Method of fabricating integrated circuits, providing improved so-called 'saw bow' conductive tracks
09/04/2003WO2002003463A3 Electronic package having embedded capacitors and method of fabrication therefor
09/04/2003WO2000015547A3 Metal-carbon composite powders, methods for producing powders and devices fabricated from same
09/04/2003US20030166746 Organic component comprises long-chain cycloaliphatic epoxy resin, short-chain cycloaliphatic epoxy resin, cyanate ester, lewis acid catalyst; useful in die attach adhesives, underfills, encapsulants, via fills, prepreg binders
09/04/2003US20030166344 Method for manufacturing a semiconductor device
09/04/2003US20030166338 CMP slurry for metal and method for manufacturing metal line contact plug of semiconductor device using the same
09/04/2003US20030166334 Bond pad and process for fabricating the same
09/04/2003US20030166333 Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
09/04/2003US20030166332 Bump fabrication method
09/04/2003US20030166314 Resin encapsulated BGA-type semiconductor device
09/04/2003US20030166313 Semiconductor element mounting method
09/04/2003US20030166312 Methods for assembly and packaging of flip chip configured dice with interposer
09/04/2003US20030165771 Blends of curable epoxy resins, polyepoxides, novolacs and photoinintiators, used to from films having high glass transition temperature and good flexibility used in printed circuits
09/04/2003US20030165625 Heating, crosslinking
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