Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2003
09/11/2003US20030168203 Multi-material heat spreader
09/11/2003US20030168202 CPU cooler
09/11/2003US20030168177 Device and method for core buildup using a separator
09/11/2003US20030167632 System and method for providing a redistribution metal layer in an integrated circuit
09/11/2003US20030167630 Method for attaching a die with a low melting metal
09/11/2003US20030167629 Multilayer integrated substrate and manufacturing method for multilayer ceramic element
09/11/2003DE20309646U1 Graphics card fan has freely vibrating mount
09/11/2003DE20208531U1 Passive electronic element as multilayer structure of molten glass layers with conductive track has recess(es) for functional ceramic body
09/11/2003DE20121941U1 Module with power semiconductor component on substrate with three terminals has at least two terminals coupled by flip-chip contacting to contact unit
09/10/2003EP1343362A1 Cooling system for elecronic devices
09/10/2003EP1343249A2 Device having inductors and capacitors and a fabrication method thereof
09/10/2003EP1343205A2 Lead frame manufacturing method
09/10/2003EP1343204A1 Electronic device unit
09/10/2003EP1343203A2 Method for forming a metal extrusion free via
09/10/2003EP1343109A2 System for providing an open-cavity low profile encapsulated semiconductor package
09/10/2003EP1342973A1 Device and method for absorbing and radiating heat in very small space
09/10/2003EP1342760A1 Water soluble paste and its use
09/10/2003EP1342747A1 Sheet for conducting heat
09/10/2003EP1342294A1 I-channel surface-mount connector
09/10/2003EP1342268A2 Electronic assembly with high capacity thermal interface and methods of manufacture
09/10/2003EP1342267A2 Thermoelectric spot coolers for rf and microwave communication integrated circuits
09/10/2003EP1342263A2 Ionized metal plasma deposition process having enhanced via sidewall coverage
09/10/2003EP1342075A2 Nanosensors
09/10/2003EP1198692B1 Heat exchanger
09/10/2003CN2572732Y Heat sink for heat-producing component on circuit board
09/10/2003CN2572564Y Grain crystal grade package structure
09/10/2003CN2572563Y Heat sink structure
09/10/2003CN2572562Y Improved structure for fastener of IC heat sink
09/10/2003CN2572561Y Radiation fin combining structure
09/10/2003CN2572560Y Flow guide for heat radiation fan of integrated circuit
09/10/2003CN2572559Y Isolation piece structure between lighting assembly and receiving assembly
09/10/2003CN2572558Y Electronic component blanket piece
09/10/2003CN2572461Y Pin fin type heat-pipe heat-sink
09/10/2003CN2572456Y Spiral stair radiation module
09/10/2003CN1441995A System and method for array processing surface acoustic wave devices
09/10/2003CN1441972A Thermoelectric element
09/10/2003CN1441964A Semiconductor photodetector
09/10/2003CN1441963A UV laser system and method for single pulse servering of IC fuses
09/10/2003CN1441959A Method of etching tungsten or tungsten nitride electrode gates in semiconductor structures
09/10/2003CN1441632A Electronic device
09/10/2003CN1441613A High frequency module
09/10/2003CN1441550A Electronic device and its producing method
09/10/2003CN1441549A Small electronic part
09/10/2003CN1441495A Semiconductor device and its producing method, curcuit board and electronic instrument
09/10/2003CN1441493A Semiconductor element in stacked structure
09/10/2003CN1441492A Electronic element and its producing method
09/10/2003CN1441491A 半导体装置 Semiconductor device
09/10/2003CN1441490A Semiconductor device and its producing method
09/10/2003CN1441489A Semiconductor device and its producing method, curcuit board and electronic instrument
09/10/2003CN1441488A 半导体器件 Semiconductor devices
09/10/2003CN1441487A Wiring base board and its producing method, electronic parts and electronic instrument
09/10/2003CN1441486A Wiring base board and method for producing belt type wiring base board
09/10/2003CN1441485A 半导体器件 Semiconductor devices
09/10/2003CN1441484A Electronic product with heat radiation plate
09/10/2003CN1441483A Semiconductor device and its producing method
09/10/2003CN1441474A Method for producing semiconductor device
09/10/2003CN1441473A Adhesive for electronic element device
09/10/2003CN1441472A Semiconductor device and its producing method, curcuit board and electronic instrument
09/10/2003CN1441471A Semiconductor device and its producing and detecting method and equipment
09/10/2003CN1121133C Heat radiation structure of closed type device
09/10/2003CN1121068C Radiating fin for integrated circuit and its manufacturing method
09/09/2003US6618539 Heater module and optical waveguide module
09/09/2003US6618268 Apparatus for delivering power to high performance electronic assemblies
09/09/2003US6618267 Multi-level electronic package and method for making same
09/09/2003US6618253 Retainer device for heat sink assembly
09/09/2003US6618252 Heat sink of module with built-in IC
09/09/2003US6618251 Cooling device capable of contacting target with smaller urging force
09/09/2003US6617946 Microwave package
09/09/2003US6617919 RF amplifier
09/09/2003US6617787 Light-emitting system with alicyclic epoxy sealing member
09/09/2003US6617702 To provide for wireless communications between circuit systems fabricated on or bonded to the substrate.
09/09/2003US6617701 Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device
09/09/2003US6617700 Repairable multi-chip package and high-density memory card having the package
09/09/2003US6617699 120 degree bump placement layout for an integrated circuit power grid
09/09/2003US6617698 Reworkable and thermally conductive adhesive and use thereof
09/09/2003US6617697 Assembly with connecting structure
09/09/2003US6617696 Supporting control gate connection on a package using additional bumps
09/09/2003US6617695 Semiconductor device and semiconductor module using the same
09/09/2003US6617693 Semiconductor device and semiconductor chip for use therein
09/09/2003US6617692 Apparatus for implementing selected functionality on an integrated circuit device
09/09/2003US6617691 Semiconductor device
09/09/2003US6617690 Interconnect structures containing stress adjustment cap layer
09/09/2003US6617689 Metal line and method of suppressing void formation therein
09/09/2003US6617687 Method of forming a test insert for interfacing a device containing contact bumps with a test substrate
09/09/2003US6617686 Semiconductor device and method of isolating circuit regions
09/09/2003US6617685 Clip heat sink assembly
09/09/2003US6617684 Packaged die on PCB with heat sink encapsulant
09/09/2003US6617683 Thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface material
09/09/2003US6617682 Structure for reducing die corner and edge stresses in microelectronic packages
09/09/2003US6617681 Interposer and method of making same
09/09/2003US6617680 Chip carrier, semiconductor package and fabricating method thereof
09/09/2003US6617678 Semiconductor device
09/09/2003US6617677 Electric or electronic component and method of manufacturing such a component
09/09/2003US6617675 Semiconductor device and semiconductor device assembly
09/09/2003US6617674 Semiconductor package and method of preparing same
09/09/2003US6617673 Memory card
09/09/2003US6617671 High density stackable and flexible substrate-based semiconductor device modules
09/09/2003US6617669 Multilayer semiconductor wiring structure with reduced alignment mark area
09/09/2003US6617666 Semiconductor device with capacitor and process for manufacturing the device
09/09/2003US6617664 Semiconductor device having a fuse and a fabrication process thereof
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