Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2003
09/16/2003US6618941 Incorporated into a compressible dielectric material, which forms a compressible pad-on-pad connector between two conducting elements; palladium
09/16/2003US6618938 Interposer for semiconductor package assembly
09/16/2003CA2128872C High conductivity hybrid material for thermal management
09/12/2003WO2003075421A1 Semiconductor light emitting device and plant cultivating system
09/12/2003WO2003075340A2 Method for obtaining metal to metal contact between a metal surface and a bonding pad.
09/12/2003WO2003075339A1 B-stageable underfill encapsulant and method for its application
09/12/2003WO2003075338A1 Underfill encapsulant for wafer packaging and method for its application
09/12/2003WO2003075337A1 Fluxless assembly of chip size semiconductor packages
09/12/2003WO2003075322A2 Identifying defects in a conductive structure of a wafer, based on heat transfer therethrough
09/12/2003WO2003075190A1 Back end of line clone test vehicle
09/12/2003WO2003074958A1 Flat-plate heat-pipe with lanced-offset fin wick
09/12/2003WO2003046463A3 Stacked low profile cooling system and method for making same
09/12/2003WO2003041133A3 Electrothermal self-latching mems switch and method
09/12/2003WO2003030225A3 Semiconductor chip with multiple rows of bond pads
09/12/2003WO2003028090A3 Integration of barrier layer and seed layer
09/12/2003WO2003021661B1 Process for making a mim capacitor
09/12/2003WO2002103809A8 Encapsulated photovoltaic modules and method of manufacturing same
09/12/2003WO2002050901A3 Electronic device using evaporative micro-cooling and associated methods
09/12/2003WO2002050890A3 Electroconductive connection between a chip and a coupling element in addition to a security element containing a connection of said type
09/12/2003WO2002041677A3 Cooling device, method for the production thereof, and device for carrying out this method
09/11/2003WO2003075393A1 High frequency module
09/11/2003US20030171456 Epoxy resins
09/11/2003US20030171026 Electrical device
09/11/2003US20030171006 Apparatus and methods for enhancing thermal performance of integrated circuit packages
09/11/2003US20030171004 Deposition method of dielecrtric films having a low dielectric constant
09/11/2003US20030171001 Method of manufacturing semiconductor devices
09/11/2003US20030170989 Etched oxide layer forming interconnect metallization trench within the oxide layer, after etching via, second inductor trench, interconnect metallization trench and first inductor trench are filled with copper
09/11/2003US20030170980 Semiconductor device and method of manufacturing the same
09/11/2003US20030170979 Semiconductor device capable of preventing ring defect and method of manufacturing the same
09/11/2003US20030170977 Routing for multilayer ceramic substrates to reduce excessive via depth
09/11/2003US20030170975 Method for forming a metal extrusion free via
09/11/2003US20030170974 Method of fabricating a semiconductor device
09/11/2003US20030170972 Dynamic solder attach
09/11/2003US20030170970 Semiconductor device and method of manufacturing the same
09/11/2003US20030170968 Multi-layer structure for reducing capacitance and manufacturing method thereof
09/11/2003US20030170967 Process for fabricating a semiconductor device
09/11/2003US20030170962 Semiconductor device and manufacturing method thereof
09/11/2003US20030170935 Method and apparatus for encapsulating articles by stencil printing
09/11/2003US20030170934 Top layers of metal for high performance IC's
09/11/2003US20030170933 System for providing an open-cavity low profile encapsulated semiconductor package
09/11/2003US20030170932 Methods and apparatus for packaging semiconductor devices
09/11/2003US20030170931 Electronic device and method of manufacturing the same, and electronic instrument
09/11/2003US20030170446 Sheet for conducting heat
09/11/2003US20030170444 Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive
09/11/2003US20030170436 Dielectric material and dielectric sintered body, and wiring board using the same
09/11/2003US20030169983 Modular heat sinks
09/11/2003US20030169575 High frequency module
09/11/2003US20030169571 Module and method of manufacturing the module
09/11/2003US20030169569 Heat sink assembly with fixing device
09/11/2003US20030169134 Millimeter wave (MMW) radio frequency transceiver module and method of forming same
09/11/2003US20030169065 Method and apparatus for evaluating insulating film
09/11/2003US20030168968 Layered structure of wire, a manufacturing method therefor, and an optical apparatus
09/11/2003US20030168749 No internal void; simplified fabrication
09/11/2003US20030168748 Semiconductor device
09/11/2003US20030168747 Method of forming an air gap intermetal layer dielectric (ILD) by utilizing a dielectric material to bridge underlying metal lines
09/11/2003US20030168745 Multi-layer structure for reducing capacitance and manufacturing method thereof
09/11/2003US20030168744 Semiconductor device and method of manufacturing the same
09/11/2003US20030168743 Wiring-inclusive structure and forming method thereof
09/11/2003US20030168742 Microelectronic die including low rc under-layer interconnects
09/11/2003US20030168741 Providing semiconductor wafer substrate; depositing topographic layer of conductive lead line material on substrate; depositing topographic fill patterns; arranging; depositing a planarization layer
09/11/2003US20030168740 Semiconductor device and a method of manufacturing the same
09/11/2003US20030168739 Array structure of solder balls able to control collapse
09/11/2003US20030168737 Arrangements for minimizing signal path discontinuities
09/11/2003US20030168735 Semiconductor apparatus and method for fabricating the same
09/11/2003US20030168734 Wafer level chip-scale package
09/11/2003US20030168733 Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument
09/11/2003US20030168732 Injection molded heat dissipation device
09/11/2003US20030168731 Thermal interface material and method of fabricating the same
09/11/2003US20030168730 Carbon foam heat exchanger for integrated circuit
09/11/2003US20030168729 Insulating substrate, manufacturing method thereof, and module semiconductor device with insulating substrate
09/11/2003US20030168728 Mounting structure of a semiconductor device
09/11/2003US20030168727 Multi-layer board
09/11/2003US20030168725 Methods of making microelectronic assemblies including folded substrates
09/11/2003US20030168724 Power semiconductor module with ceramic substrate
09/11/2003US20030168723 Semiconductor device having a warp preventing sheet
09/11/2003US20030168722 Semiconductor device
09/11/2003US20030168721 Adhering a semiconductor chip to a substrate by using an adhesive, and providing a sealant around the semiconductor chip, on a surface of the substrate on which the semiconductor chip is mounted
09/11/2003US20030168720 Semiconductor device and manufacturing method for same
09/11/2003US20030168719 Multi-row leadframe
09/11/2003US20030168715 Methods of forming fuse box guard rings for integrated circuit devices
09/11/2003US20030168714 Triple damascene fuse
09/11/2003US20030168701 Method and structure for low capacitance ESD robust diodes
09/11/2003US20030168675 Memory element and method for fabricating a memory element
09/11/2003US20030168671 Emitter turn-off thyristors and their drive circuits
09/11/2003US20030168670 Method of making radiation emitter devices
09/11/2003US20030168658 Semiconductor device with built-in light receiving element, production method thereof, and optical pickup incorporating the same
09/11/2003US20030168635 For use in flat panel displays and lighting elements
09/11/2003US20030168612 Process for precise arrangement of micro-bodies
09/11/2003US20030168497 Method and device for bleed out control in solder bonding
09/11/2003US20030168341 Applying functional alloy plating to an electronic component to be mounted using an electrolytic procedure with a pulse waveform, functional alloy plating comprising tin and silver
09/11/2003US20030168256 Package module for an IC device and method of forming the same
09/11/2003US20030168255 Multi-layer printed circuit board and a BGA semiconductor package using the multi-layer printed circuit board
09/11/2003US20030168254 Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module
09/11/2003US20030168253 Microelectronic component and assembly having leads with offset portions
09/11/2003US20030168252 Contact device and a process to facilitate contact of power electronics components and an assembly that consists of one or several power electronics components
09/11/2003US20030168251 Providing synthetic polymer molecules having crosslinkable groups that are inert until activated; activating the crosslinkable groups under crosslinking conditions to obtain irreversible intramolecular crosslinked polymer
09/11/2003US20030168250 High frequency device packages and methods
09/11/2003US20030168208 Electronic component cooling apparatus
09/11/2003US20030168207 Loop heat pipe modularized heat exchanger
09/11/2003US20030168205 High performance liquid-cooled heat sink with twisted tape inserts for electronics cooling
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