| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/17/2003 | CN2574218Y Heat sink assembly |
| 09/17/2003 | CN2574217Y Heat sink |
| 09/17/2003 | CN2574216Y Chip packaging structure and substrate in structure |
| 09/17/2003 | CN2574106Y Radiating module |
| 09/17/2003 | CN2574105Y Computer central processor heat sink |
| 09/17/2003 | CN2574104Y Radiating module for central processor |
| 09/17/2003 | CN2574103Y Radiator fastener |
| 09/17/2003 | CN2574101Y Radiator fastening device |
| 09/17/2003 | CN2574100Y Radiator fastening device |
| 09/17/2003 | CN1443385A 半导体激光器件 The semiconductor laser device |
| 09/17/2003 | CN1443370A 半导体装置 Semiconductor device |
| 09/17/2003 | CN1443369A Housing device and contact element used therein |
| 09/17/2003 | CN1443368A Method for contacting semiconductor component |
| 09/17/2003 | CN1443365A Electronic chip component comprising integrated circuit and method for producing same |
| 09/17/2003 | CN1442906A Flexible mixed storage element |
| 09/17/2003 | CN1442902A Semiconductor device and its manufacturing method |
| 09/17/2003 | CN1442900A Integrated radiator of radiating fin, heat pipe or cellular pipe, mother board metal |
| 09/17/2003 | CN1442899A Packaging substrate |
| 09/17/2003 | CN1442898A Method of attaching pipe core on to substrate |
| 09/17/2003 | CN1442892A Manufacturing method of semiconductor device and electron device, calculating method of welding condition |
| 09/17/2003 | CN1442891A Soft type encapsulating structure and its making method |
| 09/17/2003 | CN1442890A Manufacturing method of lead wire frame |
| 09/17/2003 | CN1442740A 液晶显示装置 The liquid crystal display device |
| 09/17/2003 | CN1442729A Integrated circuit chip, electronic device and its manufacturing method and electronic machine |
| 09/17/2003 | CN1121720C Epoxy seal semiconductor device and its mfg. method |
| 09/17/2003 | CN1121719C Process for producing electronic devices |
| 09/17/2003 | CN1121718C Method for formation of sub groundrule pattern in IC mfg. |
| 09/17/2003 | CN1121717C Method for forming multilevel interconnects in semiconductor device |
| 09/17/2003 | CN1121716C Planarization method of non conformal layer in IC fabrication |
| 09/17/2003 | CN1121715C Hump jointing method and device |
| 09/16/2003 | US6622294 Adaptive power routing and shield sharing to reduce shield count |
| 09/16/2003 | US6621839 Method for contacting a high-power diode laser bar and a high-power diode laser bar-contact arrangement of electrical contacts with minor thermal function |
| 09/16/2003 | US6621707 Liquid-cooled electronic apparatus |
| 09/16/2003 | US6621705 Miniature surface mount heatsink element and method of use |
| 09/16/2003 | US6621704 Clip for heat sink |
| 09/16/2003 | US6621703 Automotive bridge rectifier assembly with thermal protection |
| 09/16/2003 | US6621702 Method and apparatus for absorbing thermal energy |
| 09/16/2003 | US6621701 Water cooled inverter |
| 09/16/2003 | US6621699 Electronic component cooling apparatus |
| 09/16/2003 | US6621693 Low profile, high density storage array |
| 09/16/2003 | US6621673 Two-stage ESD protection circuit with a secondary ESD protection circuit having a quicker trigger-on rate |
| 09/16/2003 | US6621425 Semiconductor device, terminal device and communication method |
| 09/16/2003 | US6621324 Redundant antifuse segments for improved programming efficiency |
| 09/16/2003 | US6621289 Method and test circuit for developing integrated circuit fabrication processes |
| 09/16/2003 | US6621286 System and method for inspecting a semiconductor device with contact sections that slide over the terminals of the semiconductor device |
| 09/16/2003 | US6621280 Method of testing an integrated circuit |
| 09/16/2003 | US6621260 Special contact points for accessing internal circuitry of an integrated circuit |
| 09/16/2003 | US6621173 Semiconductor device having an adhesive and a sealant |
| 09/16/2003 | US6621172 Semiconductor device and method of fabricating the same, circuit board, and electronic equipment |
| 09/16/2003 | US6621171 Semiconductor device having a wire laid between pads |
| 09/16/2003 | US6621170 Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film |
| 09/16/2003 | US6621169 Stacked semiconductor device and method of producing the same |
| 09/16/2003 | US6621167 Metal interconnect structure |
| 09/16/2003 | US6621166 Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging |
| 09/16/2003 | US6621165 Semiconductor device fabricated by reducing carbon, sulphur, and oxygen impurities in a calcium-doped copper surface |
| 09/16/2003 | US6621164 Chip size package having concave pattern in the bump pad area of redistribution patterns and method for manufacturing the same |
| 09/16/2003 | US6621162 High frequency circuit apparatus |
| 09/16/2003 | US6621161 Semiconductor encapsulated in a hollow package, made by housing a chip in a plurality of cavities of a plate-like substrate, bonding a plate-like cap to teh substrate, and separating the bonded members along space between cavities |
| 09/16/2003 | US6621160 Semiconductor device and mounting board |
| 09/16/2003 | US6621157 Method and device for encapsulating an electronic component in particular a semiconductor chip |
| 09/16/2003 | US6621156 Semiconductor device having stacked multi chip module structure |
| 09/16/2003 | US6621155 Integrated circuit device having stacked dies and impedance balanced transmission lines |
| 09/16/2003 | US6621154 Semiconductor apparatus having stress cushioning layer |
| 09/16/2003 | US6621152 Thin, small-sized power semiconductor package |
| 09/16/2003 | US6621151 Lead frame for an integrated circuit chip |
| 09/16/2003 | US6621150 Lead frame adaptable to the trend of IC packaging |
| 09/16/2003 | US6621141 Out-of-plane microcoil with ground-plane structure |
| 09/16/2003 | US6621140 Leadframe inductors |
| 09/16/2003 | US6621138 Zener-like trim device in polysilicon |
| 09/16/2003 | US6621133 Electrostatic discharge protection device |
| 09/16/2003 | US6621071 Microelectronic system with integral cryocooler, and its fabrication and use |
| 09/16/2003 | US6621011 Electronic chip component |
| 09/16/2003 | US6621010 Substrate comprising laminate body with ceramic green sheets, breaking grooves arranged in main surface in grid pattern, multilayer ceramic elements constructed in blocks sectioned by grooves, fracture preventing member crossing grooves |
| 09/16/2003 | US6620862 Sheet resin composition and process for manufacturing semiconductor device therewith |
| 09/16/2003 | US6620735 Method for processing substrates |
| 09/16/2003 | US6620731 Method for fabricating semiconductor components and interconnects with contacts on opposing sides |
| 09/16/2003 | US6620728 Top layers of metal for high performance IC's |
| 09/16/2003 | US6620724 Low resistivity deep trench fill for DRAM and EDRAM applications |
| 09/16/2003 | US6620721 Method of forming a self-aligning pad |
| 09/16/2003 | US6620720 Interconnections to copper IC's |
| 09/16/2003 | US6620706 Condensed memory matrix |
| 09/16/2003 | US6620703 Method of forming an integrated circuit using an isolation trench having a cavity formed by reflowing a doped glass mask layer |
| 09/16/2003 | US6620701 Method of fabricating a metal-insulator-metal (MIM) capacitor |
| 09/16/2003 | US6620652 Semiconductor device and method of making the same |
| 09/16/2003 | US6620651 Adhesive wafers for die attach application |
| 09/16/2003 | US6620650 Chip package and method for manufacturing the same |
| 09/16/2003 | US6620649 Method for selectively providing adhesive on a semiconductor device |
| 09/16/2003 | US6620648 Multi-chip module with extension |
| 09/16/2003 | US6620647 Method for producing a semiconductor component with a silicon carrier substrate |
| 09/16/2003 | US6620635 Damascene resistor and method for measuring the width of same |
| 09/16/2003 | US6620633 Method for testing bumped semiconductor components |
| 09/16/2003 | US6620554 Etching substrate material, etching process, and article obtained by etching |
| 09/16/2003 | US6620527 Aluminum multilayer formed on a substrate, aluminum crystal particles are substantially larger size in one layer, and more densely arranged also, the other layer has higher resist; interconnects on semiconductors |
| 09/16/2003 | US6620515 Comprising an organofunctional silicone wax and a thermally conductive filler; can be used as a thermal interface material |
| 09/16/2003 | US6620512 Anhydride polymers for use as curing agents in epoxy resin-based underfill material |
| 09/16/2003 | US6620345 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure |
| 09/16/2003 | US6619973 Chip socket assembly and chip file assembly for semiconductor chips |
| 09/16/2003 | US6619536 Containing indium, lead, silver and copper; integrated circuit board |
| 09/16/2003 | US6619385 Cooling apparatus for cooling electric element |
| 09/16/2003 | US6619381 Modular heat dissipating device |