Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2003
09/18/2003US20030176019 Method of manufacturing LOC semiconductor assembled with room temperature adhesive
09/18/2003US20030176016 Methods for providing support for conductive structures protruding from semiconductor device components
09/18/2003US20030176015 Chip scale package and method of fabricating the same
09/18/2003US20030176014 Methods of forming patterns for semiconductor constructions; and molds configured to pattern masses associated with semiconductor constructions
09/18/2003US20030176013 Integrated circuit capable of operating in multiple orientations
09/18/2003US20030175531 Composite structure with a uniform crystal orientation and the method of controlling the crystal orientation of one such structure
09/18/2003US20030175454 Electromagnetic radiation shield; heat dissipation; mixture of thermoplastic resin and conductivity particles
09/18/2003US20030174879 Overlay vernier pattern for measuring multi-layer overlay alignment accuracy and method for measuring the same
09/18/2003US20030174557 High permeability composite films to reduce noise in high speed interconnects
09/18/2003US20030174484 Lamination of high-layer-count substrates
09/18/2003US20030174483 Wiring board and method of fabricating tape-like wiring substrate
09/18/2003US20030174482 Chip scale package and method of fabricating the same
09/18/2003US20030174480 Electronic device
09/18/2003US20030174479 High-frequency integrated circuit module
09/18/2003US20030174478 Ball grid array module
09/18/2003US20030174477 Circuit board with lead frame
09/18/2003US20030174475 Chip with passive electrical contacts
09/18/2003US20030174468 Cooling system for integrated circuit chip
09/18/2003US20030174455 Thermal dissipation assembly for electronic components
09/18/2003US20030174031 Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly
09/18/2003US20030173942 Apparatus for conditioning power and managing thermal energy in an electronic device
09/18/2003US20030173720 Methods for forming articles having very small channels therethrough, and such articles, and methods of using such articles
09/18/2003US20030173684 Wafer-level coated copper stud bumps
09/18/2003US20030173682 Supporting control gate connection on a package using additional bumps
09/18/2003US20030173681 Supporting control gate connection on a package using additional bumps
09/18/2003US20030173680 Semiconductor device and fabrication method of the same
09/18/2003US20030173679 Stacked dice standoffs
09/18/2003US20030173678 Semiconductor device and method for fabricating the same
09/18/2003US20030173676 Multi-layered semiconductor device and method of manufacturing same
09/18/2003US20030173675 Semiconductor device, method of manufacturing the same, and phase shift mask
09/18/2003US20030173674 Semiconductor device and method for fabricating the same
09/18/2003US20030173673 Inserting between each component a separating plane of a thin sheet of dielectric, one face of which is metallized to constitute capacitor planes and connected to ground to shield the adjacent component; easy decoupling
09/18/2003US20030173671 Semiconductor device and manufacturing method for the same
09/18/2003US20030173670 Memory device and method for forming a passivation layer thereon
09/18/2003US20030173668 Semiconductor device having a bond pad and method therefor
09/18/2003US20030173667 Semiconductor device having a bond pad and method therefor
09/18/2003US20030173666 Semiconductor device
09/18/2003US20030173665 Support ring for use with a contact pad and semiconductor device compoents including the same
09/18/2003US20030173664 Semiconductor package and production method thereof
09/18/2003US20030173663 Semiconductor device
09/18/2003US20030173661 Contact structure and production method thereof and probe contact assembly using same
09/18/2003US20030173660 Ceramic circuit board and power module
09/18/2003US20030173659 Semiconductor package having oxidation-free copper wire
09/18/2003US20030173658 Semiconductor device, manufacturing method for semiconductor device and mounting method for the same
09/18/2003US20030173657 Portable electronic device
09/18/2003US20030173656 Semiconductor device and method of manufacturing the same
09/18/2003US20030173655 Component assembly and method for producing the same
09/18/2003US20030173654 Shielded multi-conductor interconnect bus for MEMS
09/18/2003US20030173653 High permeability thin films and patterned thin films to reduce noise in high speed interconnections
09/18/2003US20030173652 High permeability thin films and patterned thin films to reduce noise in high speed interconnections
09/18/2003US20030173649 Unit cell architecture for electrical interconnects
09/18/2003US20030173643 Silicide-silicon oxide-semiconductor antifuse device and method of making
09/18/2003US20030173640 Semiconductor device
09/18/2003US20030173637 Semiconductor device having a wire bond pad and method therefor
09/18/2003US20030173633 Multi-level shielded multi-conductor interconnect bus for mems
09/18/2003US20030173631 Semiconductor device for providing a noise shield
09/18/2003US20030173630 ESD protection devices and methods for reducing trigger voltage
09/18/2003US20030173623 Semiconductor integrated circuit device
09/18/2003US20030173597 Semiconductor device
09/18/2003US20030173592 Antifuse structure and method of making
09/18/2003US20030173589 Contact for integrated circuit, and corresponding fabrication method
09/18/2003US20030173587 Assembly of semiconductor device and wiring substrate
09/18/2003US20030173577 Chip scale package and method of fabricating the same
09/18/2003US20030173565 Method of alloying a semiconductor device
09/18/2003US20030173329 Polishing slurry for aluminum-based metal, and method of manufacturing semiconductor device
09/18/2003US20030173112 Interconnect bus crossover for MEMS
09/18/2003US20030173111 Printed circuit board housing clamp
09/18/2003US20030173108 Semiconductor device and method of manufacturing the same, circuit board and electronic equipment
09/18/2003US20030173107 Microelectronic packages having an array of resilient leads
09/18/2003US20030173065 Method for producing a structural member from plates stacked on top of each other and soldered together
09/18/2003US20030173064 Plate-type heat pipe and method for manufacturing the same
09/18/2003US20030173063 Boiling and condensing apparatus
09/18/2003US20030173061 Heat dissipation device with working liquid received in circulatory route
09/18/2003US20030173060 Heat sink with cooling channel
09/18/2003US20030172669 Spray cooling system for transverse thin-film evaporative spray cooling
09/18/2003US20030172660 Cooling apparatus and SQUID microscope using same
09/18/2003US20030172525 Interconnect structure and method of making same
09/18/2003DE4345413C2 Mfg. semiconductor component with first film on substrate
09/17/2003EP1345480A2 Ceramic circuit board and power module
09/17/2003EP1345270A2 Semiconductor device and manufacturing method for the same
09/17/2003EP1345269A2 Cooling device for electronic/electrical components
09/17/2003EP1345268A2 Thermal dissipation assembly for electronic components
09/17/2003EP1345267A2 Serpentine, slit fin heat sink device
09/17/2003EP1345266A1 Heat sink with extended surface area
09/17/2003EP1345264A1 Integral-type ceramic circuit board and method of producing same
09/17/2003EP1345263A1 Electronic device and method of manufacturing the electronic device
09/17/2003EP1345241A1 Electrical insulating plate, prepreg laminate and method for producing them
09/17/2003EP1345233A2 Electrical signal supply circuit and semiconductor memory device
09/17/2003EP1344440A2 Electromagnetic noise reduction device
09/17/2003EP1344435A2 Parallel plane substrate
09/17/2003EP1344433A1 Interconnect
09/17/2003EP1344252A2 Gate length control for semiconductor chip design
09/17/2003EP1344251A2 A high-performance fin configuration for air-cooled heat dissipation device
09/17/2003EP1344232A2 Capacitor with extended surface lands and method of fabrication therefor
09/17/2003EP1070350B1 Integrated circuit package having a thermoelectric cooling element therein
09/17/2003EP1029386B1 Converter socket terminal
09/17/2003EP0960439B1 Antifuse based on silicided polysilicon bipolar transistor
09/17/2003CN2574221Y Heat sink
09/17/2003CN2574220Y Radiator
09/17/2003CN2574219Y Water-cooled IC radiator
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