Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2003
09/23/2003US6624505 Packaged integrated circuits and methods of producing thereof
09/23/2003US6624504 Semiconductor device and method for manufacturing the same
09/23/2003US6624503 Electromagnetic filtering structure
09/23/2003US6624501 Capacitor and semiconductor device
09/23/2003US6624500 Thin-film electronic component and motherboard
09/23/2003US6624499 System for programming via electromigration comprising semiconductor fuse structure having electrodes coupled by conductive fuse link, current supply adapted to initiate electromigration in fuse link, temperature gradient device
09/23/2003US6624492 Semiconductor circuit device having gate array area and method of making thereof
09/23/2003US6624484 Insulated gate field effect transistor comprising source, drain and surrounding region, gate electrode over channel between source and drain and boundary with surrounding region, which has means for connection to alternating current ground
09/23/2003US6624481 ESD robust bipolar transistor with high variable trigger and sustaining voltages
09/23/2003US6624454 Semiconductor device having a flip-chip construction
09/23/2003US6624448 Semiconductor device with multiple supporting points
09/23/2003US6624224 Mixing liquid gallium and/or indium alloy, solid boron nitride to encapsulate; combining paste with silicone oil and triethoxyoctylsilane to form mass; surface treatment
09/23/2003US6624216 Contains an epoxy resin, a fluxing agent, a linear polyanhydride and a catalyst; to protect and reinforce interconnections between an electronic component and a substrate in a microelectronic device
09/23/2003US6624078 Methods for analyzing the effectiveness of wafer backside cleaning
09/23/2003US6624075 Method of reducing electromigration in a copper line by Zinc-Doping of a copper surface from an electroplated copper-zinc alloy thin film and a semiconductor device thereby formed
09/23/2003US6624074 Method of fabricating a semiconductor device by calcium doping a copper surface using a chemical solution
09/23/2003US6624073 Optimized TaCN thin film diffusion barrier for copper metallization
09/23/2003US6624068 Polysilicon processing using an anti-reflective dual layer hardmask for 193 nm lithography
09/23/2003US6624066 Reliable interconnects with low via/contact resistance
09/23/2003US6624063 Semiconductor device having low dielectric layer and method of manufacturing thereof
09/23/2003US6624062 Wiring structure in semiconductor device and method for forming the same
09/23/2003US6624061 Semiconductor device and method of manufacturing the same capable of reducing deterioration of low dielectric constant film
09/23/2003US6624060 Method and apparatus for pretreating a substrate prior to electroplating
09/23/2003US6624058 Semiconductor device and method for producing the same
09/23/2003US6624056 Methods and apparatus for providing improved physical designs and routing with reduced capacitive power dissipation
09/23/2003US6624054 Multi-layer structure for reducing capacitance and manufacturing method thereof
09/23/2003US6624053 Damascene-type interconnection structure and its production process
09/23/2003US6624050 Method of manufacturing semiconductor device
09/23/2003US6624046 Three dimensional processor using transferred thin film circuits
09/23/2003US6624045 Thermal conducting trench in a seminconductor structure and method for forming the same
09/23/2003US6624039 Alignment mark having a protective oxide layer for use with shallow trench isolation
09/23/2003US6624031 Test structure and methodology for semiconductor stress-induced defects and antifuse based on same test structure
09/23/2003US6624010 Method of manufacturing semiconductor device having thin film SOI structure
09/23/2003US6624008 Semiconductor chip installing tape, semiconductor device and a method for fabricating thereof
09/23/2003US6624007 Method of making leadframe by mechanical processing
09/23/2003US6624006 Methods of attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip
09/23/2003US6624005 Semiconductor memory cards and method of making same
09/23/2003US6624004 Flip chip interconnected structure and a fabrication method thereof
09/23/2003US6623996 Method of measuring contact alignment in a semiconductor device including an integrated circuit
09/23/2003US6623995 Optimized monitor method for a metal patterning process
09/23/2003US6623992 System and method for determining a subthreshold leakage test limit of an integrated circuit
09/23/2003US6623911 Method to form code marks on mask ROM products
09/23/2003US6623843 Resin composition for wiring circuit board, substrate for wiring circuit board, and wiring circuit board
09/23/2003US6623842 Surface electrode structure on ceramic multi-layer substrate and process for producing the same
09/23/2003US6623663 Contains copper; for forming via hole conductors to be converted to external electrode terminals
09/23/2003US6623592 Methods for application of adhesive tape to semiconductor devices
09/23/2003US6623279 Separable power delivery connector
09/23/2003US6622907 Sacrificial seed layer process for forming C4 solder bumps
09/23/2003US6622786 Heat sink structure with pyramidic and base-plate cut-outs
09/23/2003US6622782 Device for cooling of electronic components
09/23/2003CA2276376C Power module board and power module using the board
09/23/2003CA2273125C Microwave integrated circuit multi-chip-module and microwave integrated circuit multi-chip-module mounting structure
09/23/2003CA2057744C Multichip module
09/18/2003WO2003077618A2 Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive
09/18/2003WO2003077411A2 Improved emitter turn-off thyristors and their drive circuits
09/18/2003WO2003077317A1 Integrated circuit device and method for manufacturing the same
09/18/2003WO2003077316A1 Impedance matching
09/18/2003WO2003077315A2 Multi-row leadframe
09/18/2003WO2003077314A2 Csp-type hyperfrequency circuit
09/18/2003WO2003077313A2 Multilayered ceramic substrate for integrated power components and method for the production of said substrate
09/18/2003WO2003077312A1 Semiconductor device using semiconductor chip
09/18/2003WO2003077311A1 Method and resulting structure for manufacturing semiconductor substrate
09/18/2003WO2003077308A1 Mold release layer transferring film and laminate film
09/18/2003WO2003077089A1 Cpu heat sink
09/18/2003WO2003049149A3 Apparatus and method for inter-chip or chip-to-substrate connection with a sub-carrier
09/18/2003WO2003041117A3 Integrated semiconductor component for conducting high-frequency measurements and the use thereof
09/18/2003WO2003034493A3 High frequency power amplifier having an integrated passive adapter
09/18/2003WO2003017323A3 Millimeter wave module (mmw) for microwave monolithic integrated circuit (mmic)
09/18/2003WO2003010813A3 Grid interposer
09/18/2003WO2003007371A3 Transistor cell
09/18/2003WO2003003456A3 Electronic assembly with vertically connected capacitors and manufacturing method
09/18/2003WO2002099873A3 Dual damascene multi-level metallization
09/18/2003WO2002097886A3 Semiconductor structure comprising an electrostatic discharge (esd) protection device
09/18/2003WO2002093644A8 Heat exchanger
09/18/2003WO2002078054A3 Integrated circuit package with a capacitor
09/18/2003WO2002063684A3 Single layer surface mount package
09/18/2003WO2002049103A3 Microelectronic package having bumpless laminated interconnection layer
09/18/2003WO2002048701A9 Nanosensors
09/18/2003US20030177468 Method of verifying IC mask sets
09/18/2003US20030177464 Intergrated circuit layout method and program thereof permitting wire delay adjustment
09/18/2003US20030176623 Poly-o-hydroxyamides, polybenzoxazoles, processes for producing poly-o-hydroxyamides, processes for producing polybenzoxazoles, dielectrics including a polybenzoxazole, electronic components including the dielectrics, and processes for manufacturing the electronic components
09/18/2003US20030176598 Thermosetting resin composition
09/18/2003US20030176063 Lamination structure with copper wiring and its manufacture method
09/18/2003US20030176054 Method for contact-connecting a semiconductor component
09/18/2003US20030176053 High permeability thin films and patterned thin films to reduce noise in high speed interconnections
09/18/2003US20030176052 High permeability thin films and patterned thin films to reduce noise in high speed interconnections
09/18/2003US20030176051 High permeability thin films and patterned thin films to reduce noise in high speed interconnections
09/18/2003US20030176050 High permeability thin films and patterned thin films to reduce noise in high speed interconnections
09/18/2003US20030176045 Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate
09/18/2003US20030176035 Analog capacitor in dual damascene process
09/18/2003US20030176034 Flexible hybrid memory element
09/18/2003US20030176028 High permeability composite films to reduce noise in high speed interconnects
09/18/2003US20030176027 High permeability composite films to reduce noise in high speed interconnects
09/18/2003US20030176026 High permeability composite films to reduce noise in high speed interconnects
09/18/2003US20030176025 High permeability composite films to reduce noise in high speed interconnects
09/18/2003US20030176024 High permeability composite films to reduce noise in high speed interconnects
09/18/2003US20030176023 High permeability composite films to reduce noise in high speed interconnects
09/18/2003US20030176022 Tool and method for welding to IC frames
09/18/2003US20030176021 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same
09/18/2003US20030176020 Grooved heat spreader for stress reduction in IC package
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