Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2003
09/25/2003US20030178665 Semiconductor device with improved capacitive element and method of forming the same
09/25/2003US20030178657 Transimpedance amplifier assembly with separate ground leads and separate power leads for included circuits
09/25/2003US20030178649 Stress reduction in flip-chip pbga packaging by utilizing segmented chip carriers
09/25/2003US20030178644 Reinforced bond-pad substructure and method for fabricating the same
09/25/2003US20030178638 Semiconductor mounting system
09/25/2003US20030178632 Opto-electronic semiconductor component
09/25/2003US20030178474 Integrated circuit assemblies and assembly methods
09/25/2003US20030178403 Method and system for locally connecting microstructures and devices formed thereby
09/25/2003US20030178229 Multilayered printed wiring board
09/25/2003US20030178226 Clip for heat sink
09/25/2003US20030178190 Foil heat sink and a method for fabricating same
09/25/2003US20030178182 Apparatus and method for circuit board liquid cooling
09/25/2003US20030178181 Heat sink with fins
09/25/2003US20030178180 Bladed heat sink
09/25/2003US20030178179 Heat exchanger for electronic/electrical components
09/25/2003US20030178178 Cooling device for cooling components of the power electronics, said device comprising a micro heat exchanger
09/25/2003US20030178177 Heatsink buffer configuration
09/25/2003US20030178176 System and method for providing cooling systems with heat exchangers
09/25/2003US20030178174 Thermal pouch interface
09/25/2003US20030177774 Spray cooling system with cooling regime detection
09/24/2003EP1347515A1 Chip differentiation on the reticule level
09/24/2003EP1347514A2 Semiconductor device
09/24/2003EP1347513A2 Low voltage drop and high thermal performance ball grid array package
09/24/2003EP1347512A2 Improved heatsink buffer configuration
09/24/2003EP1347510A1 Wiring-inclusive structure and forming method thereof
09/24/2003EP1347474A1 Semiconductor device, and method and apparatus for manufacturing semiconductor device
09/24/2003EP1346791A1 Pipe preparing tool
09/24/2003EP1346618A2 Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher ic power delivery
09/24/2003EP1346617A2 Multilayered hybrid electronic module
09/24/2003EP1346615A1 A multi-chip integrated circuit carrier
09/24/2003EP1346613A1 Via-in-pad with off-center geometry and methods of manufacture
09/24/2003EP1346413A2 Circuit
09/24/2003EP1346412A2 Semiconductor device comprising an arrangement of an electrically programmable non-volatile memory element
09/24/2003EP1346411A2 Thermally and electrically enhanced ball grid array packaging
09/24/2003EP1346410A1 Flexible electronic device
09/24/2003EP1346409A2 Ic package pressure release apparatus and method
09/24/2003EP1346408A2 Interconnect structures and a method of electroless introduction of interconnect structures
09/24/2003EP1346407A2 Method for eliminating reaction between photoresist and organosilicate glass
09/24/2003EP1194886B1 Chip card with a flexible chip
09/24/2003EP1171912B1 Method for the vertical integration of electric components by reverse side contacting
09/24/2003EP1019762A4 Optical device having optical component isolated from housing
09/24/2003CN2575851Y Branch joint clip for branch cable
09/24/2003CN2575850Y Satellite antenna assembling structure
09/24/2003CN2575849Y Mobile phone antenna body
09/24/2003CN2575848Y Communication equipment antenna with strong connection
09/24/2003CN2575847Y Metal air fuel cell capable of changing supplementary fuel
09/24/2003CN2575846Y Diaphragm bag for chemical electric power battery
09/24/2003CN2575845Y Single electronic memory for carbon nanovalve transistor design using vertical structure at two ends
09/24/2003CN2575844Y Semiconductor integrated bubble
09/24/2003CN1444438A Electric parts device
09/24/2003CN1444436A Printed circuit board and making method thereof
09/24/2003CN1444432A Power supply module and mfg. method thereof
09/24/2003CN1444279A Semiconductor device and its mfg. method
09/24/2003CN1444276A Semiconductor device and method for making the same
09/24/2003CN1444275A Double mosaic process
09/24/2003CN1444274A Semiconductor device with punctured wiring and its production method
09/24/2003CN1444273A 电子装置 Electronic devices
09/24/2003CN1444272A Semiconductor device and method for making the same
09/24/2003CN1444271A Solid luminous device packaged radiating member and its making method
09/24/2003CN1444270A COF flexible printed circuit board and method for making said circuit board
09/24/2003CN1444269A Multi-layer semiconductor device and its mfg. method
09/24/2003CN1444192A Distributing structure, it mfg. method and optical equipment
09/24/2003CN1444176A System for providing package for opening hollow cavity low-profile packaged semiconductor
09/24/2003CN1443625A Soldering flux
09/24/2003CN1122309C 半导体装置 Semiconductor device
09/24/2003CN1122304C Resin sealed semiconductor device and method for manufacturing the same
09/24/2003CN1122300C Lead member for electronic part and process of producing the same
09/24/2003CN1122083C Thermally reworkable binders for flip chip devices
09/23/2003US6625050 Semiconductor memory device adaptable to various types of packages
09/23/2003US6625037 Printed circuit board and method manufacturing the same
09/23/2003US6625028 Heat sink apparatus that provides electrical isolation for integrally shielded circuit
09/23/2003US6625026 Heat-activated self-aligning heat sink
09/23/2003US6625025 Component cooling in electronic devices
09/23/2003US6625024 Power converter enclosure
09/23/2003US6625022 Direct heatpipe attachment to die using center point loading
09/23/2003US6625021 Heat sink with heat pipes and fan
09/23/2003US6625006 Fringing capacitor structure
09/23/2003US6625005 Semiconductor circuit device having power and ground lines adapted for high-frequency operation
09/23/2003US6624999 Electrostatic discharge protection using inductors
09/23/2003US6624869 In-plane switching type liquid crystal display device with central common feed line and a method for manufacturing the same
09/23/2003US6624714 Radiator capable of considerably suppressing a high-frequency current flowing in an electric component
09/23/2003US6624703 Terminal arrangement for an electrical device
09/23/2003US6624692 Radio frequency amplifier with a waveguide filter for isolating amplifying elements
09/23/2003US6624648 Probe card assembly
09/23/2003US6624524 Laser alignment target
09/23/2003US6624523 Structure and package of a heat spreader substrate
09/23/2003US6624522 Chip scale surface mounted device and process of manufacture
09/23/2003US6624521 Flip chip design on a coplanar waveguide with a pseudo-coaxial ground bump configuration
09/23/2003US6624520 Tape carrier, manufacturing method of tape carrier and package manufacturing method
09/23/2003US6624519 Aluminum based alloy bridge structure and method of forming same
09/23/2003US6624516 Structure for connecting interconnect lines with interposed layer including metal layers and metallic compound layer
09/23/2003US6624515 Microelectronic die including low RC under-layer interconnects
09/23/2003US6624514 Semiconductor device and manufacturing method thereof
09/23/2003US6624513 Semiconductor device with multilayer conductive structure formed on a semiconductor substrate
09/23/2003US6624512 Semiconductor integrated circuit device and printed wired board for mounting the same
09/23/2003US6624511 Hybrid integrated circuit device
09/23/2003US6624509 Semiconductor device
09/23/2003US6624508 High frequency, low cost package for semiconductor devices
09/23/2003US6624507 Miniature semiconductor package for opto-electronic devices
09/23/2003US6624506 Multichip semiconductor device and memory card
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