Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2003
10/01/2003CN1445859A Mounting structure and method of integrated circuit device
10/01/2003CN1445851A Light-thin laminated packaged semiconductor device and manufacturing process thereof
10/01/2003CN1445848A Semiconductor device and its manufacturing method and phase-shift mask
10/01/2003CN1445847A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
10/01/2003CN1445846A Chip ratio package and manufacturing method thereof
10/01/2003CN1445845A Chip ratio package and manufacturing method thereof
10/01/2003CN1445844A Chip ratio package and manufacturing method thereof
10/01/2003CN1445843A Semiconductor package with non-oxide copper-wire
10/01/2003CN1445842A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/01/2003CN1445841A Heat sink with snakelike slit fin
10/01/2003CN1445840A Cooling system for integrated circuit chip
10/01/2003CN1445837A 半导体集成电路 The semiconductor integrated circuit
10/01/2003CN1445832A Connecting lines structure in multiple metal layers and method for testing intensity of dielectric layer between metal layers
10/01/2003CN1445829A Wafer type encapsulation and its preparing method
10/01/2003CN1445819A Folded vernier pattern and measurement method for measuring alignment accuracy rating between overlapped multiple layers
10/01/2003CN1123070C Grid unit of turn off SCR hard exciting grating
10/01/2003CN1123069C Encapsulation of phtoelectric element and manufacturing method thereof
10/01/2003CN1123068C Lead frame manufacturing method
10/01/2003CN1123067C Semiconductor device having semiconductor chip electrically connected to wiring substrate
10/01/2003CN1123066C Apparatus and method for manufacturing electronic components with project electrodes
10/01/2003CN1123063C Towered organisator and towered forming method
10/01/2003CN1122942C Carrier element for semiconductor chip for installing in chip cards
09/2003
09/30/2003US6629292 Method for forming graphical images in semiconductor devices
09/30/2003US6629013 System and method to reduce bond program errors of integrated circuit bonders
09/30/2003US6628538 Memory module including module data wirings available as a memory access data bus
09/30/2003US6628527 Mounting structure for electronic parts and manufacturing method thereof
09/30/2003US6628526 Electronic device manufacturing method, electronic device and resin filling method
09/30/2003US6628503 Gas cooled electrostatic pin chuck for vacuum applications
09/30/2003US6628358 Method for processing conductive layer structures and devices including such conductive layer structures
09/30/2003US6628349 Thin film transistors (TFTs) comprising current passageways patterns made of semiconductors on dielectric surfaces having pixel electrodes and doped junctions; switches
09/30/2003US6628178 Radio frequency module parts including surface acoustic wave elements and manufacturing method thereof
09/30/2003US6628138 Increasing decoupling capacitance using preferential shields
09/30/2003US6628043 Electronic component and method of production thereof
09/30/2003US6628002 Heat transfer system with supracritical fluid
09/30/2003US6628001 Multilayer semiconductor wafers having circuit patterns and electronics such as transistors
09/30/2003US6628000 Coupling electrical and electro-optical apparatus such as optical fibers using ceramic fixtures plates having apertures and high temperature polyimide tapes; efficiency
09/30/2003US6627999 Flip-chip with matched signal lines, ground plane and ground bumps adjacent signal bumps
09/30/2003US6627998 Wafer scale thin film package
09/30/2003US6627997 Semiconductor module and method of mounting
09/30/2003US6627996 Semiconductor device having fluorine containing silicon oxide layer as dielectric for wiring pattern having anti-reflective layer and insulating layer thereon
09/30/2003US6627995 Microelectronic interconnect material with adhesion promotion layer and fabrication method
09/30/2003US6627994 Semiconductor device and film carrier tape
09/30/2003US6627993 Semiconductor device having an electrical contact and a dielectric lining in a contact region
09/30/2003US6627992 Millimeter wave (MMW) transceiver module with transmitter, receiver and local oscillator frequency multiplier surface mounted chip set
09/30/2003US6627991 High performance multi-chip flip package
09/30/2003US6627990 Thermally enhanced stacked die package
09/30/2003US6627989 Semiconductor device and method for manufacturing same
09/30/2003US6627988 Semiconductor device and method for manufacturing the same
09/30/2003US6627987 Ceramic semiconductor package and method for fabricating the package
09/30/2003US6627986 Substrate for semiconductor device and semiconductor device fabrication using the same
09/30/2003US6627984 Chip stack with differing chip package types
09/30/2003US6627983 Stacked package structure of image sensor
09/30/2003US6627982 Electrical and electronic apparatus comprising semiconductor bodies housing integrated circuits having terminals, supports and electrodes; radio or high frequency oscillators
09/30/2003US6627981 Resin-packaged semiconductor device
09/30/2003US6627979 Semiconductor package and fabrication method of the same
09/30/2003US6627978 Chip package enabling increased input/output density
09/30/2003US6627977 Semiconductor package including isolated ring structure
09/30/2003US6627976 Leadframe for semiconductor package and mold for molding the same
09/30/2003US6627975 Minitab rectifying diode package with two different types of diodes for alternators
09/30/2003US6627970 Integrated semiconductor circuit, in particular a semiconductor memory circuit, having at least one integrated electrical antifuse structure, and a method of producing the structure
09/30/2003US6627969 Metal-to-metal antifuse having improved barrier layer
09/30/2003US6627968 Integrated capacitor and fuse
09/30/2003US6627966 To protect chip component within ceramic main body, first and second sealing are carried out between a metal case and ceramic main body so as to prevent contamination, toimprove shielding effect against external electromagnetic fields
09/30/2003US6627952 Silicon oxide insulator (SOI) semiconductor having selectively linked body
09/30/2003US6627926 Electrical and electronic apparatus having conductor wires and shape patterns to improve smoothness; visual detection
09/30/2003US6627922 Chip-type semiconductor light emitting device
09/30/2003US6627872 Semiconductor optical sensing apparatus with reliable focusing means and casing structure
09/30/2003US6627824 Support circuit with a tapered through-hole for a semiconductor chip assembly
09/30/2003US6627823 Multilayered connection plate
09/30/2003US6627822 Electronic assembly with separate power and signal connections
09/30/2003US6627814 Hermetically sealed micro-device package with window
09/30/2003US6627813 Bent metal plate for use in an electronic device
09/30/2003US6627683 Curing cyclic hydrocarbon including oxirane or thiirane moiety joined by (thio)ester by exposure to heat and decomposition; polyepoxides and polythioepoxides
09/30/2003US6627560 Method of manufacturing semiconductor device
09/30/2003US6627557 Semiconductor device and method for manufacturing the same
09/30/2003US6627555 Method and circuit for minimizing the charging effect during manufacture of semiconductor devices
09/30/2003US6627548 Process for treating semiconductor substrates
09/30/2003US6627542 Continuous, non-agglomerated adhesion of a seed layer to a barrier layer
09/30/2003US6627539 Method of forming dual-damascene interconnect structures employing low-k dielectric materials
09/30/2003US6627537 Bit line and manufacturing method thereof
09/30/2003US6627536 Semiconductor blocking layer for preventing UV radiation damage to MOS gate oxides
09/30/2003US6627535 Methods and apparatus for forming a film on a substrate
09/30/2003US6627533 Method of manufacturing an insulation film in a semiconductor device
09/30/2003US6627532 Method of decreasing the K value in SiOC layer deposited by chemical vapor deposition
09/30/2003US6627530 Patterning three dimensional structures
09/30/2003US6627529 Capacitance reduction by tunnel formation for use with semiconductor device
09/30/2003US6627528 Semiconductor device and its manufacturing process
09/30/2003US6627518 Method for making three-dimensional device
09/30/2003US6627517 Semiconductor package with improved thermal cycling performance, and method of forming same
09/30/2003US6627513 Method of measuring resistance in deep trench
09/30/2003US6627507 Integrated circuit and method of using porous silicon to achieve component isolation in radio frequency applications
09/30/2003US6627483 Method for mounting an electronic component
09/30/2003US6627481 Method of manufacturing a semiconductor package with a lead frame having a support structure
09/30/2003US6627480 Stacked semiconductor package and fabricating method thereof
09/30/2003US6627479 Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer
09/30/2003US6627478 Method of making a microelectronic assembly with multiple lead deformation using differential thermal expansion/contraction
09/30/2003US6627462 Semiconductor device having a capacitor and method for the manufacture thereof
09/30/2003US6627328 Naphthalene epoxide, curing agent, activator and silica-titania filler; sealing material for optical semiconductor; cured products having high transparency at various temperatures
09/30/2003US6627115 Electroluminescent phosphor powders, methods for making phosphor powders and devices incorporating same
09/30/2003US6627093 Method of manufacturing a vertical metal connection in an integrated circuit
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