Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2003
10/02/2003US20030183954 Magnetic resin composition and method of processing
10/02/2003US20030183953 Vertically staggered bondpad array
10/02/2003US20030183951 Flip-chip bonding method
10/02/2003US20030183950 Semiconductor die packages with standard ball grid array footprint and method for assembling the same
10/02/2003US20030183949 Conductive material for integrated circuit fabrication
10/02/2003US20030183948 Golden unit
10/02/2003US20030183946 Semiconductor device
10/02/2003US20030183945 Chip size stack package and method of fabricating the same
10/02/2003US20030183944 Semiconductor device and manufacturing method for the same, circuit board, and electronic device
10/02/2003US20030183943 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
10/02/2003US20030183942 Semiconductor device having damascene interconnection structure that prevents void formation between interconnections
10/02/2003US20030183940 Improved dielectric breakdown strength between copper interconnects and reduced capacitance between the copper interconnects.
10/02/2003US20030183939 Semiconductor device with copper wirings
10/02/2003US20030183938 Methods of forming metal-containing films over surfaces of semiconductor substrates; and semiconductor constructions
10/02/2003US20030183937 Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics
10/02/2003US20030183933 Semiconductor chip having a bump electrode over its main surface. The bump electrode has at least one protrusion on the top surface thereof. A lead is electrically connected to the top surface of the bump electrode, and is positioned
10/02/2003US20030183932 Semiconductor element, manufacturing method thereof and BGA-type semiconductor device
10/02/2003US20030183931 Semiconductor apparatus, fixture for measuring characteristics therefor, and semiconductor device characteristics measuring apparatus
10/02/2003US20030183928 High-frequency switch device and electronic device using the same
10/02/2003US20030183927 Microwave integrated circuit
10/02/2003US20030183926 Semiconductor device and semiconductor packaging device
10/02/2003US20030183925 Semiconductor module
10/02/2003US20030183924 High speed switching mosfets using multi-parallel die packages with/without special leadframes
10/02/2003US20030183923 Semiconductor device and method of forming a semiconductor device
10/02/2003US20030183922 A diode coupling-based arrangement back-biases each of the semiconductor substrates of a plurality of integrated circuits at the maximum (e.g., most negative) DC voltage applied to any individual circuit, irrespective of a potential variation
10/02/2003US20030183921 Electronic device and method for manufacturing the same
10/02/2003US20030183920 Hermetic electric component package
10/02/2003US20030183919 Integrated circuit and method of manufacturing an integrated circuit and package
10/02/2003US20030183918 Tape Carrier Package
10/02/2003US20030183917 Stacked semiconductor packaging device
10/02/2003US20030183916 Packaging microelectromechanical systems
10/02/2003US20030183913 Method of eliminating back-end rerouting in ball grid array packaging
10/02/2003US20030183911 Electronic package and method
10/02/2003US20030183910 Encapsulation method of leadless semiconductor package. The method comprises the steps of: (a) attaching a plurality of dice to the die pads on the cavities of a lead frame, the lead frame having a plurality of cavities arranged in matrix
10/02/2003US20030183909 Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device
10/02/2003US20030183908 Semiconductor device and method of manufacturing the same
10/02/2003US20030183907 Resin-molded device and manufacturing apparatus thereof
10/02/2003US20030183905 Interconnection structure and interconnection structure formation method
10/02/2003US20030183898 Semiconductor device and method for manufacturing the same
10/02/2003US20030183884 Interdigital capacitor and method for adjusting the same
10/02/2003US20030183883 Non-volatile semiconductor memory device having memory cell array suitable for high density and high integration
10/02/2003US20030183879 Bonding pad-oriented all-mode esd protection structure
10/02/2003US20030183863 Semiconductor device and transceiver apparatus
10/02/2003US20030183862 Semiconductor device having metal-insulator-metal capacitor and fabrication method thereof
10/02/2003US20030183860 Semiconductor integrated circuit device including dummy patterns located to reduce dishing
10/02/2003US20030183843 Semiconductor apparatus with improved esd withstanding voltage
10/02/2003US20030183841 Semiconductor device
10/02/2003US20030183839 Thermoelectric module
10/02/2003US20030183823 Semiconductor device with components embedded in backside diamond layer
10/02/2003US20030183822 Process for forming metalized contacts to periphery transistors
10/02/2003US20030183786 Method and apparatus for making and using a beacon fiducial for an integrated circuit
10/02/2003US20030183677 Micro C-4 semiconductor die and method for depositing connection site thereon
10/02/2003US20030183521 Conductive material for integrated circuit fabrication
10/02/2003US20030183510 Conductive material for integrated circuit fabrication
10/02/2003US20030183419 Ball assignment for ball grid array package
10/02/2003US20030183418 Electrical circuit and method of formation
10/02/2003US20030183416 Method of electrically coupling an electronic component to a substrate
10/02/2003US20030183407 Packaging microelectromechanical structures
10/02/2003US20030183405 Electrical circuit and substrate therefor
10/02/2003US20030183404 Simplifying the layout of printed circuit boards
10/02/2003US20030183379 Optimized heat sink using high thermal conducting base and low thermal conducting fins
10/02/2003US20030183373 Video game console cooler
10/02/2003US20030183370 Pump type heat radiator
10/02/2003US20030183369 Heat sink and method of removing heat from power electronics components
10/02/2003US20030183368 Diamond heat sink
10/02/2003US20030183318 Shrinkage inhibition, dimemsional accuracy
10/02/2003US20030183307 Electrical device and method of making
10/02/2003US20030183269 Power generation using heat from a heat-generating component and cooling of the heat-generating component is provided. The cooling device has a heat-receiving part which receives heat conducted from a CPU, which is an external heat-generating
10/02/2003US20030182959 Apparatus and method to substantially minimize low-cycle fatigue of electrical connections
10/02/2003US20030182799 Method for forming heat conductive device of superconductive metal block
10/02/2003DE20309460U1 Heat sink for cooling a heat generating electronic circuit such as a central processing unit uses a number of wire loops to dissipate heat energy
10/02/2003DE10222443C1 Surface heat exchanger has alternating feed and discharge slits across separator embedded in distributor body for providing uniform medium flow
10/02/2003DE10213881C1 Memory module has two semiconductor chips stacked on top of one another with underlying chip received in recess in surface of electronic circuit board
10/01/2003EP1349268A2 Large gain range, high linearity, low noise MOS VGA
10/01/2003EP1349212A2 Semiconductor integrated circuit with a shield wiring
10/01/2003EP1349211A2 Rotary cooler of CPU
10/01/2003EP1349210A1 Heat sink and electronic device with heat sink
10/01/2003EP1349207A2 Semiconductor device with copper wirings
10/01/2003EP1349206A2 Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof
10/01/2003EP1348235A2 Cu-pad bonded to cu-wire with self-passivating cu-alloys
10/01/2003EP1204691B1 Solvent-free, room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings
10/01/2003EP1173859B1 Power electronics component with improved thermal properties
10/01/2003EP1112125A4 Metallization structures for microelectronic applications and process for forming the structures
10/01/2003EP1105191B1 Safety unit
10/01/2003EP1036489B1 Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method
10/01/2003EP0643883B1 Sub-nanoscale electronic circuit and process for manufacturing the same
10/01/2003CN2577443Y Double-surface water-cooled power semiconductor device module
10/01/2003CN2577442Y Vertical double-surface water-cooled power semiconductor device module
10/01/2003CN2577441Y Water-cooled fully-closed radiating apparatus
10/01/2003CN2577440Y Improved fastener structure of radiator for integrated circuit
10/01/2003CN2577338Y CPU radiating seat
10/01/2003CN2577337Y Computer radiating and air-inducing cover
10/01/2003CN2577335Y Automatic or manual speed-regulating type radiating fan
10/01/2003CN1446377A Electronic component and method of manufacture
10/01/2003CN1446376A Vibration and shock resistant heat sink assembly
10/01/2003CN1446375A Ball limiting mtallurgy for input/outputs and methods of fabrication
10/01/2003CN1446374A Low-dielectric silicon nitride film and method of making the same, seimiconductor device and fabrication process thereof
10/01/2003CN1446028A Distribution base plate, electronic device, electrooptics device and electronic instrument
10/01/2003CN1445870A Semiconductor luminous device
10/01/2003CN1445868A Light-emitting diode evenly emitting light around
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