Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2003
10/07/2003US6630734 Composite material, and manufacturing method and uses of same
10/07/2003US6630733 Integrated circuit package electrical enhancement
10/07/2003US6630732 Lead frames including inner-digitized bond fingers on bus bars and semiconductor device package including same
10/07/2003US6630731 Semiconductor device
10/07/2003US6630730 Semiconductor device assemblies including interposers with dams protruding therefrom
10/07/2003US6630729 Low-profile semiconductor package with strengthening structure
10/07/2003US6630728 Plastic integrated circuit package and leadframe for making the package
10/07/2003US6630727 Modularly expandable multi-layered semiconductor component
10/07/2003US6630726 Power semiconductor package with strap
10/07/2003US6630725 Electronic component and method of manufacture
10/07/2003US6630724 Gate dielectric antifuse circuits and methods for operating same
10/07/2003US6630723 Laser adjustment or laser programming of laser fuses of an integrated circuit on a chip, with laser light, the integrated circuit having a plurality of laser fuses and being connected to a plurality of contact pads on the chip, and the
10/07/2003US6630718 Transistor gate and local interconnect
10/07/2003US6630704 Semiconductor device
10/07/2003US6630688 Contact structures of wirings and methods for manufacturing the same, and thin film transistor array panels including the same and methods for manufacturing the same
10/07/2003US6630685 Semiconductor substrate, probe card, and methods for stressing and testing dies on a semiconductor substrate are provided. The semiconductor substrate, typically a semiconductor wafer, comprises dies disposed thereon and a redistribution layer for
10/07/2003US6630643 Method and structure for forming metallic interconnections using directed thermal diffusion
10/07/2003US6630629 Wiring substrate
10/07/2003US6630628 High-performance laminate for integrated circuit interconnection
10/07/2003US6630623 Electrically-conductive grid shield for semiconductors
10/07/2003US6630425 Oxides of copper and barium as well as yttrium, europium or lanthnum and other elements; perovskite structure
10/07/2003US6630412 Multilayer structure containing dielectric; overcoating copper wires
10/07/2003US6630402 Integrated circuit resistant to the formation of cracks in a passivation layer
10/07/2003US6630399 Titanium disilicide resistance in pinched active regions of semiconductor devices
10/07/2003US6630396 Use of a silicon carbide adhesion promoter layer to enhance the adhesion of silicon nitride to low-k fluorinated amorphous carbon
10/07/2003US6630395 Methods for fabricating electrical connections to semiconductor structures incorporating low-k dielectric materials
10/07/2003US6630391 Boron incorporated diffusion barrier material
10/07/2003US6630373 Ground plane for exposed package
10/07/2003US6630372 Method for routing die interconnections using intermediate connection elements secured to the die face
10/07/2003US6630371 Chip on board and heat sink attachment methods
10/07/2003US6630368 Substrate for mounting a semiconductor chip and method for manufacturing a semiconductor device
10/07/2003US6630360 Advanced process control (APC) of copper thickness for chemical mechanical planarization (CMP) optimization
10/07/2003US6630203 Electroless process for the preparation of particle enhanced electric contact surfaces
10/07/2003US6629553 Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card
10/07/2003US6629425 MEMS heat pumps for integrated circuit heat dissipation
10/07/2003US6629366 Method of producing a multilayer wiring board
10/02/2003WO2003081973A1 Electromagnetic wave shielding sheet, electromagnetic wave shielding transmission cable and electromagnetic wave shielding lsi
10/02/2003WO2003081971A1 Simple constant temperature device for electronic device and method for controlling the constant temperature device
10/02/2003WO2003081725A2 A miniaturized contact spring
10/02/2003WO2003081670A1 Power amplifier device
10/02/2003WO2003081669A1 Integrated circuit module and method for making same
10/02/2003WO2003081668A1 Semiconductor device with a protective security coating and method of manufacturing the same
10/02/2003WO2003081661A1 Bonding wire and integrated circuit device using the same
10/02/2003WO2003081654A1 On-wafer monitoring system
10/02/2003WO2003081641A2 Support clip
10/02/2003WO2003081616A1 Coil on a semiconductor substrate and method for production thereof
10/02/2003WO2003081339A2 Patterning semiconductor layers using phase shifting and assist features
10/02/2003WO2003081269A1 Scatterometry structure with embedded ring oscillator, and methods of using same
10/02/2003WO2003080726A1 Epoxy resin molding material for encapsulation and electronic components and devices
10/02/2003WO2003080233A1 Micro-reactor and micro-channel heat exchanger
10/02/2003WO2003079752A2 Unit cell architecture for electrical interconnects
10/02/2003WO2003043084A3 Semiconductor package having multi-signal bus bars
10/02/2003WO2003041127A3 Process for forming metallized contacts to periphery transistors
10/02/2003WO2003040338A3 Micro-scale interconnect device with internal heat spreader and method for fabricating same
10/02/2003WO2003023847A3 Integrated circuit, portable device and method for manufacturing an integrated circuit
10/02/2003WO2002103789A3 Electronic assembly with laterally connected capacitors and manufacturing method
10/02/2003WO2002078076A3 Method for realizing wiring options in an integrated circuit and a corresponding integrated circuit
10/02/2003WO2002056377B1 Electrical connection method, display module and chip card using said method
10/02/2003US20030187630 Shunt transient voltage regulator in a processor package, method of making same, and method of using same
10/02/2003US20030187338 Analyte monitoring device and methods of use
10/02/2003US20030187248 Using an aromatic isothiocyanate; forming adduct
10/02/2003US20030187116 Thermal interface pad utilizing low melting metal with retention matrix
10/02/2003US20030186559 Method of manufacturing a compound semiconductor by heating a layered structure including rare earth transition metal
10/02/2003US20030186548 Semiconductor configuration and method for fabricating the configuration
10/02/2003US20030186543 Copper transition layer for improving copper interconnection reliability
10/02/2003US20030186541 Gradient barrier layer for copper back-end-of-line technology
10/02/2003US20030186540 Method and apparatus for forming fine circuit interconnects
10/02/2003US20030186535 Method of making semiconductor device using a novel interconnect cladding layer
10/02/2003US20030186513 Wafer thinning using magnetic mirror plasma
10/02/2003US20030186498 Method for fabricating metal interconnection with reliability using ionized physical vapor deposition
10/02/2003US20030186497 Methods of polishing, interconnect-fabrication, and producing semiconductor devices
10/02/2003US20030186494 Thin films and methods for the preparation thereof
10/02/2003US20030186487 Method for producing a semiconductor wafer, semiconductor chip, and intermediate semiconductor product
10/02/2003US20030186486 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
10/02/2003US20030186485 Micro C-4 semiconductor die and method for depositing connection sites thereon
10/02/2003US20030186484 Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them
10/02/2003US20030186483 Electrically isolated power device package
10/02/2003US20030186482 Integrated sensor packages and methods of making the same
10/02/2003US20030186473 Electrical print resolution test die
10/02/2003US20030186472 Semiconductor device manufacturing method capable of reliable inspection for hole opening and semiconductor devices manufactured by method
10/02/2003US20030186470 Structure and method for determining edges of regions in a semiconductor wafer
10/02/2003US20030186173 Forming a high melting-point metal on an SOI (Silicon-on-Insulator) layer; transforming a layer of the high melting-point metal into a metal silicide layer by heat treatment; forming an interlayer insulating film; dry etching
10/02/2003US20030186087 Gradient barrier layer for copper back-end-of-line technology
10/02/2003US20030186071 Used in oil wells; core of carbon steel coated with a copper alloy
10/02/2003US20030185086 Semiconductor memory device including ferroelectric memory formed using ferroelectric capacitor
10/02/2003US20030185033 Interconnection structure and methods
10/02/2003US20030184985 Electronic device manufacturing method, electronic device and resin filling method
10/02/2003US20030184980 Circuit board with integrated circuit
10/02/2003US20030184972 Computer having cooling device
10/02/2003US20030184971 Heat sink assembly with fixing members
10/02/2003US20030184970 Cooling arrangement and electrical apparatus with cooling arrangement
10/02/2003US20030184969 Electronic control unit
10/02/2003US20030184963 Providing in package power supplies for integrated circuits
10/02/2003US20030184953 Structure of an interleaving striped capacitor substrate
10/02/2003US20030184951 Low impedance inter-digital capacitor and method of using
10/02/2003US20030184941 Cooling device
10/02/2003US20030184699 In-plane switching mode liquid crystal display device
10/02/2003US20030184426 Inductor element having a high quality factor
10/02/2003US20030184333 Electrical component with a contact and method for forming a contact on a semiconductor material
10/02/2003US20030184311 Circuit structure and semiconductor integrated circuit
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