| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/22/2014 | CN103534801A Semiconductor device and wiring substrate |
| 01/22/2014 | CN103534794A Device packaging with substrates having embedded lines and metal defined pads |
| 01/22/2014 | CN103534789A Al alloy film for semiconductor devices |
| 01/22/2014 | CN103532349A Gate driver circuit for inductive load and inverter module |
| 01/22/2014 | CN103531703A Self-temperature-measuring semiconductor chilling plate |
| 01/22/2014 | CN103531589A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/22/2014 | CN103531582A 半导体单元 Semiconductor unit |
| 01/22/2014 | CN103531581A 多芯片模块 A multi-chip module |
| 01/22/2014 | CN103531580A 芯片封装结构 Chip package structure |
| 01/22/2014 | CN103531579A Structure for improving packaging reliability of semiconductor chip and preparation method thereof |
| 01/22/2014 | CN103531578A Semiconductor devices and methods of manufacture thereof |
| 01/22/2014 | CN103531577A Metal wiring structure of integrated circuit |
| 01/22/2014 | CN103531576A Trimming resistance control device and wafer testing system using device |
| 01/22/2014 | CN103531575A Integrated circuit adopting multiple repairing structure |
| 01/22/2014 | CN103531574A 半导体单元 Semiconductor unit |
| 01/22/2014 | CN103531573A Substrate for semiconductor package and process for manufacturing |
| 01/22/2014 | CN103531572A Wafer-level packaged optical subassembly and transceiver module having same |
| 01/22/2014 | CN103531571A Electroless-nickel-bump structure of wafer die pads and manufacturing method thereof |
| 01/22/2014 | CN103531570A High-power split lead frame |
| 01/22/2014 | CN103531569A Plastic package lead frame with super-high power |
| 01/22/2014 | CN103531568A Full-plastic package lead frame with top opening |
| 01/22/2014 | CN103531567A Flat-belt lead frame |
| 01/22/2014 | CN103531566A Lead frame for MOS device |
| 01/22/2014 | CN103531565A Thermal leadless array package with die attach pad locking feature |
| 01/22/2014 | CN103531564A Power transistor with heat dissipation and forming method thereof |
| 01/22/2014 | CN103531563A Chip-bearing substrate structure |
| 01/22/2014 | CN103531562A Semiconductor packaging structure and lead frame thereof |
| 01/22/2014 | CN103531561A Chip package and method of manufacturing the same |
| 01/22/2014 | CN103531560A Chip packaging structure and manufacturing method thereof |
| 01/22/2014 | CN103531559A Flip chip bonding structure and forming method thereof |
| 01/22/2014 | CN103531558A Lead frame packages and methods of formation thereof |
| 01/22/2014 | CN103531557A Device and electronic apparatus |
| 01/22/2014 | CN103531556A Novel pad structure used for pressure welding of copper metal |
| 01/22/2014 | CN103531555A Power module comprising welding-free terminals |
| 01/22/2014 | CN103531554A 半导体组件及其制造方法 The method of manufacturing a semiconductor component and |
| 01/22/2014 | CN103531553A Substrate, method of manufacturing substrate, semiconductor device, and electronic apparatus |
| 01/22/2014 | CN103531552A 芯片结构及电路结构 Chip architecture and circuit structure |
| 01/22/2014 | CN103531551A Semiconductor packaging structure and forming method thereof |
| 01/22/2014 | CN103531550A Packaging structure and packaging method for improved small-space plastic package |
| 01/22/2014 | CN103531549A Semiconductor chip packaging structure and packaging method |
| 01/22/2014 | CN103531548A Semiconductor package structure having an air gap and method for forming |
| 01/22/2014 | CN103531547A Semiconductor packages and methods of forming the same |
| 01/22/2014 | CN103531546A Module structure with pierced substrate on chip |
| 01/22/2014 | CN103531545A Gallium-nitride element capable of restoring performance |
| 01/22/2014 | CN103531544A Explosion semiconductor module |
| 01/22/2014 | CN103531536A Component and method of manufacturing a component using an ultrathin carrier |
| 01/22/2014 | CN103531533A Method for manufacturing through substrate via (tsv), tsv structure of through silicon via and control method of tsv capacitance |
| 01/22/2014 | CN103531529A Semiconductor process and semiconductor structure thereof |
| 01/22/2014 | CN103531526A Metal interconnection structure and manufacturing method therefor |
| 01/22/2014 | CN103531525A Metal interconnection structure and manufacturing method thereof |
| 01/22/2014 | CN103531510A Transfer and alignment photoetching method of P+ epitaxy pattern of semiconductor circuit |
| 01/22/2014 | CN103531496A Integrated defect detection and location systems and methods in semiconductor chip devices |
| 01/22/2014 | CN103531493A Semiconductor device package and manufacture method thereof |
| 01/22/2014 | CN103531491A Semiconductor technology, semiconductor structure and package structure thereof |
| 01/22/2014 | CN103531490A Packaging structure for recessed surface structure provided with controllable curvature, and manufacturing method thereof |
| 01/22/2014 | CN103531488A Semiconductor device, method of manufacturing the same, and camera |
| 01/22/2014 | CN103531483A Bearing part and manufacturing method of coreless packaging substrate |
| 01/22/2014 | CN103531443A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/22/2014 | CN103531430A Novel thermionic device and manufacturing method thereof |
| 01/22/2014 | CN103530679A Semiconductor device and method of manufacturing the same |
| 01/22/2014 | CN103525338A Adhesive composition for semiconductor device, adhesive film for semiconductor device, adhesive film with dicing film, method for manufacturing semiconductor device and semiconductor device |
| 01/22/2014 | CN103525322A Sealing resin sheet, method for producing electronic component package and electronic component package |
| 01/22/2014 | CN103525089A Special packaging material for insulated gate bipolar transistor (IGBT) and preparation method thereof |
| 01/22/2014 | CN102569249B A three dimensional inductor |
| 01/22/2014 | CN102543937B Flip chip on-chip package and manufacturing method thereof |
| 01/22/2014 | CN102543907B Package and manufacture method for thermal enhanced quad flat no-lead flip chip |
| 01/22/2014 | CN102479726B Manufacturing method of semiconductor packaging component |
| 01/22/2014 | CN102326251B Method for bonding high heat conductive insulating resin |
| 01/22/2014 | CN102181168B Polymer matrix composite material and production method of polymer matrix composite material |
| 01/22/2014 | CN102064151B Lead frame for manufacturing discrete semiconductor and manufacturing method thereof |
| 01/22/2014 | CN102056457B Water-cooling type radiating device |
| 01/22/2014 | CN101901798B Semiconductor device and manufacturing method of the same |
| 01/22/2014 | CN101864268B Thermal conductive adhesive |
| 01/22/2014 | CN101768412B CMP slurry composition for barrier polishing for manufacturing copper interconnects, polishing method using the composition, and semiconductor device manufactured by the method |
| 01/21/2014 | US8634170 Semiconductor integrated circuit |
| 01/21/2014 | US8634063 Wafer with design printed outside active region and spaced by design tolerance of reticle blind |
| 01/21/2014 | US8633603 Semiconductor device and a method of manufacturing the same |
| 01/21/2014 | US8633602 Semiconductor device, and method and apparatus for manufacturing the same |
| 01/21/2014 | US8633601 Interconnect assemblies and methods of making and using same |
| 01/21/2014 | US8633600 Device and method for manufacturing a device |
| 01/21/2014 | US8633599 Semiconductor chip with underfill anchors |
| 01/21/2014 | US8633598 Underfill contacting stacking balls package fabrication method and structure |
| 01/21/2014 | US8633597 Thermal vias in an integrated circuit package with an embedded die |
| 01/21/2014 | US8633596 Semiconductor package with bonding wires of reduced loop inductance |
| 01/21/2014 | US8633595 Semiconductor device having groove-shaped via-hole |
| 01/21/2014 | US8633594 Semiconductor device having groove-shaped via-hole |
| 01/21/2014 | US8633592 Hybrid interconnect technology |
| 01/21/2014 | US8633591 Electronic device |
| 01/21/2014 | US8633590 Semiconductor device and method for manufacturing the same |
| 01/21/2014 | US8633589 Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques |
| 01/21/2014 | US8633588 Semiconductor package |
| 01/21/2014 | US8633587 Package structure |
| 01/21/2014 | US8633586 Mock bump system for flip chip integrated circuits |
| 01/21/2014 | US8633584 Electronic assembly with electronic compontent and interconnection assembly connected via conductive bump and mating well |
| 01/21/2014 | US8633583 Semiconductor package substrate and methods for forming same, in particular for MEMS devices |
| 01/21/2014 | US8633582 Chip package and fabrication method thereof |
| 01/21/2014 | US8633581 Semiconductor device |
| 01/21/2014 | US8633579 Multi-chip package and method of manufacturing the same |
| 01/21/2014 | US8633578 Integrated circuit package system with laminate base |
| 01/21/2014 | US8633577 Integrated circuit device |