| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/23/2014 | WO2013128348A3 Packaged electronic device comprising integrated electronic circuits having transceiving antennas |
| 01/23/2014 | US20140024177 Semiconductor device and manufacturing method thereof |
| 01/23/2014 | US20140022563 Periodic Patterns and Technique to Control Misalignment Between Two Layers |
| 01/23/2014 | US20140022020 Semiconductor package design providing reduced electromagnetic coupling between circuit components |
| 01/23/2014 | US20140021641 Microelectronic packages having cavities for receiving microelectronic elements |
| 01/23/2014 | US20140021640 Method for electrically connecting vertically positioned substrates |
| 01/23/2014 | US20140021639 Vertical System Integration |
| 01/23/2014 | US20140021638 Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package |
| 01/23/2014 | US20140021637 Semiconductor device |
| 01/23/2014 | US20140021636 Semiconductor package with single sided substrate design and manufacturing methods thereof |
| 01/23/2014 | US20140021635 Microelectric package utilizing multiple bumpless build-up structures and through-silicon vias |
| 01/23/2014 | US20140021634 Method of Manufacturing a Semiconductor Device with a Carrier Having a Cavity and Semiconductor Device |
| 01/23/2014 | US20140021633 Integrated Circuit Device Having Through-Silicon-Via Structure and Method of Manufacturing the Same |
| 01/23/2014 | US20140021631 Semiconductor device and manufacturing method thereof |
| 01/23/2014 | US20140021630 High performance ic chip having discrete decoupling capacitors attached to its ic surface |
| 01/23/2014 | US20140021629 Semiconductor package and method of fabricating the same |
| 01/23/2014 | US20140021628 Method for forming interlayer connectors in a three-dimensional stacked ic device |
| 01/23/2014 | US20140021627 Semiconductor device and method for manufacturing semiconductor device |
| 01/23/2014 | US20140021626 Liquid crystal display device and method of manufacturing a liquid crystal display device |
| 01/23/2014 | US20140021625 Wiring substrate, method for manufacturing the wiring substrate, and semiconductor package |
| 01/23/2014 | US20140021624 Mounting structure of semiconductor device and method of manufacturing the same |
| 01/23/2014 | US20140021623 Method of forming electric contact interface regions of an electronic device |
| 01/23/2014 | US20140021622 Optimization metallization for prevention of dielectric cracking under controlled collapse chip connections |
| 01/23/2014 | US20140021621 Packaged semiconductor die with power rail pads |
| 01/23/2014 | US20140021620 Power device and power device module |
| 01/23/2014 | US20140021619 Pad structure and integrated circuit chip with such pad structure |
| 01/23/2014 | US20140021618 Semiconductor device and manufacturing method of same |
| 01/23/2014 | US20140021617 Semiconductor substrate and method of fabricating the same |
| 01/23/2014 | US20140021616 Semiconductor structure |
| 01/23/2014 | US20140021615 Multi-layer barrier layer stacks for interconnect structures |
| 01/23/2014 | US20140021614 Hybrid interconnect scheme including aluminum metal line in low-k dielectric |
| 01/23/2014 | US20140021613 Multi-layer barrier layer for interconnect structure |
| 01/23/2014 | US20140021612 Semiconductor device and fabricating process for the same |
| 01/23/2014 | US20140021611 Novel Copper Etch Scheme for Copper Interconnect Structure |
| 01/23/2014 | US20140021610 Chip package and a method for manufacturing a chip package |
| 01/23/2014 | US20140021609 Wiring substrate, method for manufacturing wiring substrate, electronic device and method for manufacturing electronic device |
| 01/23/2014 | US20140021608 Semiconductor package and method of fabricating the same |
| 01/23/2014 | US20140021607 Solder volume compensation with c4 process |
| 01/23/2014 | US20140021606 Control of silver in c4 metallurgy with plating process |
| 01/23/2014 | US20140021605 Package on Package Devices and Methods of Packaging Semiconductor Dies |
| 01/23/2014 | US20140021604 Integrated circuit devices with bump structures that include a protection layer |
| 01/23/2014 | US20140021603 Using an interconnect bump to traverse through a passivation layer of a semiconductor die |
| 01/23/2014 | US20140021602 Substrate for semiconductor package and semiconductor package having the same |
| 01/23/2014 | US20140021601 Semiconductor manufacturing method and semiconductor structure thereof |
| 01/23/2014 | US20140021600 Redistribution layer (rdl) with variable offset bumps |
| 01/23/2014 | US20140021599 Three-dimensional integrated circuits and fabrication thereof |
| 01/23/2014 | US20140021598 Methods and arrangements relating to semiconductor packages including multi-memory dies |
| 01/23/2014 | US20140021597 High Speed Signal Conditioning Package |
| 01/23/2014 | US20140021596 Wafer-level device packaging |
| 01/23/2014 | US20140021595 Semiconductor component support and semiconductor device |
| 01/23/2014 | US20140021594 Packaging Structures and Methods for Semiconductor Devices |
| 01/23/2014 | US20140021593 Lower semiconductor molding die, semiconductor package, and method of manufacturing the semiconductor package |
| 01/23/2014 | US20140021591 Emi shielding semiconductor element and semiconductor stack structure |
| 01/23/2014 | US20140021581 Low cost anti-fuse structure |
| 01/23/2014 | US20140021580 Semiconductor devices having e-fuse structures and methods of fabricating the same |
| 01/23/2014 | US20140021579 Integrated circuit with a fin-based fuse, and related fabrication method |
| 01/23/2014 | US20140021578 Vertical electronic fuse |
| 01/23/2014 | US20140021559 Semiconductor device and a method of increasing a resistance value of an electric fuse |
| 01/23/2014 | US20140021522 Chip packages with power management integrated circuits and related techniques |
| 01/23/2014 | US20140021469 Integrated circuit including sensor structure, related method and design structure |
| 01/23/2014 | US20140021427 Semiconductor device |
| 01/23/2014 | US20140020926 Lead frame, lead frame assembly and method of cutting lead frame assembly |
| 01/23/2014 | US20140020827 Anti-bleed compounds, compositions and methods for use thereof |
| 01/23/2014 | DE102013214043A1 Ladegerät Charger |
| 01/23/2014 | DE102013107787A1 Chipbaugruppe und verfahren zum herstellen einer chipbaugruppe Chip package and method of fabricating a chip package |
| 01/23/2014 | DE102013107593A1 Eingebetteter ic-baustein und verfahren zur herstellung eines eingebetteten ic-bausteins Embedded IC module and process for the preparation of an embedded IC module |
| 01/23/2014 | DE102013107164A1 Halbleiterpackages mit mehreren Leadframes und Verfahren zu ihrer Herstellung Semiconductor packages including a plurality of lead frames and methods for their preparation |
| 01/23/2014 | DE102012211143A1 Carrier e.g. circuit board, for e.g. organic LED of headlight for automobile, has guidance bodies linked with components at front side and exposed with respect to carrier at rear side, where bodies are projected over carrier at rear side |
| 01/23/2014 | DE102012204085B4 Halbleitervorrichtung mit Wärmeverteiler und Lotlage und Verfahren zum Herstellen einer solchen A semiconductor device comprising heat spreader and brazing filler metal sheet and method for producing such |
| 01/23/2014 | DE102012111786A1 Hybrid-Verbindungsaufbau und Verfahren zur Herstellung desselben Of the same hybrid connection setup and process for preparing |
| 01/23/2014 | DE102012106641A1 Sensor chip for use in instrumentation application areas, has functional layer applied on ceramic carrier, and carrier plate comprising recesses at side that is formed opposite to carrier, where recesses are produced by etching process |
| 01/23/2014 | DE102012106615A1 Electronic component e.g. semiconductor component has heat sink that is provided between attachment portions to produce working contact pressure |
| 01/23/2014 | DE102010041917B4 Schaltungsanordnung und Verfahren zu deren Herstellung Circuit arrangement and method for their preparation |
| 01/23/2014 | DE102009030958B4 Halbleiteranordnung mit einem Verbindungselement und Verfahren zur Herstellung einer solchen A semiconductor device comprising a connecting element and methods for producing such |
| 01/23/2014 | DE10159175B4 Halbleiterbauelement mit einem Fühlemitter und einer Schutzvorrichtung Semiconductor component with a probe Mitter and a protective device |
| 01/22/2014 | EP2688100A1 Semiconductor module and manufacturing method therefor |
| 01/22/2014 | EP2688099A2 Wiring substrate, method for manufacturing wiring substrate, electronic device and method for manufacturing electronic device |
| 01/22/2014 | EP2688098A1 Semiconductor device and method for manufacturing semiconductor device |
| 01/22/2014 | EP2688097A1 Liquid-cooled led illuminating lamp |
| 01/22/2014 | EP2688096A1 Pressure unit |
| 01/22/2014 | EP2688095A2 Semiconductor component support and semiconductor device |
| 01/22/2014 | EP2688094A1 Sensor package |
| 01/22/2014 | EP2688092A1 Semiconductor die with a through silicon via and corresponding manufacturing process |
| 01/22/2014 | EP2687573A1 Polyester resin composition for electrical / electronic part-sealing material, sealed product and production method therefor |
| 01/22/2014 | EP2686879A1 Thermally conductive film for cooling and fastening electronic components |
| 01/22/2014 | EP2686875A2 Methods of forming at least one conductive element, methods of forming a semiconductor structure, methods of forming a memory cell and related semiconductor structures |
| 01/22/2014 | EP2686752A1 Liquid cooling device for electronic cards |
| 01/22/2014 | EP1329953B1 Carbon nanotube thermal interface structures |
| 01/22/2014 | EP1266402B1 Semiconductor element and method for producing the same |
| 01/22/2014 | CN203406292U High-reverse-voltage bipolar power transistor |
| 01/22/2014 | CN203406289U Bipolar power transistor |
| 01/22/2014 | CN203406281U Three-dimensionally packaged MRAM memory with capacity of 512K x 40bit |
| 01/22/2014 | CN203406280U Three-dimensionally packaged SDRAM memory with capacity of 512M x 8bit |
| 01/22/2014 | CN203406279U Integrated circuit chip upper inductor with substrate shielding layer formed by PN junctions and metal strips |
| 01/22/2014 | CN203406278U IC (integrated circuit) packaging mounting piece |
| 01/22/2014 | CN203406277U Radiating fin, source electrode driving chip heat dissipation structure and liquid crystal display apparatus |
| 01/22/2014 | CN203406276U TO-CAN optical communication detector pedestal |
| 01/22/2014 | CN103535121A Ceramic electronic component and manufacturing method thereof |
| 01/22/2014 | CN103534803A Radio- and electromagnetic interference through-silicon vias for stacked-die packages, and methods of making same |
| 01/22/2014 | CN103534802A Low temperature co-fired ceramic structure for high frequency applications and process for making same |