Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2003
10/09/2003US20030189439 Semiconductor inspection apparatus
10/09/2003US20030189263 Semiconductor module
10/09/2003US20030189262 Method and apparatus for attaching microelectronic substrates and support members
10/09/2003US20030189261 Under-bump-metallurgy layer
10/09/2003US20030189260 Flip-chip bonding structure and method thereof
10/09/2003US20030189258 Semiconductor device
10/09/2003US20030189255 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same
10/09/2003US20030189252 Physically deposited layer to electrically connect circuit edit connection targets
10/09/2003US20030189251 Semiconductor device
10/09/2003US20030189250 Semiconductor package including a double-faced semiconductor chip having integrated circuitry on both sides thereof and a method of fabricating the semiconductor package
10/09/2003US20030189249 Chip structure and wire bonding process suited for the same
10/09/2003US20030189248 Supporting gate contacts over source region on mosfet devices
10/09/2003US20030189247 Low-impedance decoupling device
10/09/2003US20030189246 Semiconductor built -in millimeter-wave band module
10/09/2003US20030189245 Flip chip assembly and method for producing the same
10/09/2003US20030189244 Semiconductor device with fuse box and method for fabricating the same
10/09/2003US20030189243 Microelectronic package with reduced underfill and methods for forming such packages
10/09/2003US20030189240 Semiconductor device
10/09/2003US20030189233 Semiconductor device including low-resistance wires electrically connected to impurity layers
10/09/2003US20030189231 Method and structure for providing improved thermal conduction for silicon semiconductor devices
10/09/2003US20030189230 Semiconductor device with substrate-triggered esd protection
10/09/2003US20030189224 Wiring structure for an integrated circuit
10/09/2003US20030189222 Semiconductor device
10/09/2003US20030189219 Heat spreader with down set leg attachment feature
10/09/2003US20030189214 Techniques for joining an opto-electronic module to a semiconductor package
10/09/2003US20030189204 Structure and method for evaluating an integrated electronic device
10/09/2003US20030189202 Nanowire devices and methods of fabrication
10/09/2003US20030189032 Laser processing
10/09/2003US20030188881 Hermetically sealed micro-device package using cold-gas dynamic spray material deposition
10/09/2003US20030188858 Cooling unit
10/09/2003US20030188849 Heat sink with multiple surface enhancements
10/09/2003US20030188848 Complex heat-radiator
10/09/2003US20030188538 Two stage cooling system employing thermoelectric modules
10/08/2003EP1351302A2 Power semiconductor module
10/08/2003EP1351301A2 Semiconductor built-in millimeter-wave band module
10/08/2003EP1351300A2 Semiconductor device and transceiver apparatus
10/08/2003EP1351299A2 Fexible and thin circuit construction
10/08/2003EP1351298A2 Verfahren zur Herstellung eines Halbleiterwafers
10/08/2003EP1351297A2 Semiconductor device, method of manufacturing the same, and phase shift mask
10/08/2003EP1351296A1 Electronic parts mounting substrate and process for manufacturing the same
10/08/2003EP1351295A2 Preplated stamped small outline no-lead leadframes having etched profiles
10/08/2003EP1351294A2 System and method for providing a redistribution metal layer in an integrated circuit
10/08/2003EP1351293A2 Die-up ball grid array package with two substrates and method for making the same
10/08/2003EP1351292A2 Semiconductor device comprising a flexible region and method for manufacturing the same
10/08/2003EP1351291A2 Copper doped transition layer for improving copper interconnection reliability
10/08/2003EP1351289A1 Method and apparatus for forming fine circuit interconnects
10/08/2003EP1351288A1 Process for manufacturing a through insulated interconnection in a body of semiconductor material
10/08/2003EP1351287A2 Semiconductor device and method for manufacturing the same
10/08/2003EP1351285A2 Electrical device comprising two substrates bonded together and method of making same
10/08/2003EP1351254A2 An integrated fuse with regions of different doping within the fuse neck
10/08/2003EP1350815A1 Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polyimide film, film for tab, and prepreg
10/08/2003EP1350271A2 Interconnection of active and passive components in substrate
10/08/2003EP1350270A1 Stacked die package
10/08/2003EP1350269A2 Self-passivating cu laser fuse
10/08/2003EP1350265A1 Method of etching tungsten or tungsten nitride electrode gates in semiconductor structures
10/08/2003EP1350233A1 Process for the manufacture of novel, inexpensive radio frequency identification devices
10/08/2003EP1350043A1 Plastic control plate for the gearbox control device of a hydraulic motor vehicle
10/08/2003CN2578983Y Blowing radiator
10/08/2003CN2578982Y Radiator
10/08/2003CN2578981Y Radiator
10/08/2003CN2578980Y Radiator
10/08/2003CN2578979Y Radiating fins
10/08/2003CN2578978Y Radiator
10/08/2003CN2578977Y Improved structure of radiating fins
10/08/2003CN2578976Y Aluminium radiating board of water-cooled frequency convertor module
10/08/2003CN2578879Y Radiation fin fixer
10/08/2003CN2578878Y Buckle connected radiation fins
10/08/2003CN2578877Y Radiator
10/08/2003CN1447864A 溅射靶 Sputtering target
10/08/2003CN1447456A Piezoelectric device and its cap sealing method cap sealing appts. portable telephone set utilizing piezoelectric device and electronic device utilizing piezoelectric device
10/08/2003CN1447450A Thermoelectric modular
10/08/2003CN1447441A Semiconductor device with built-in optical receiving component, its mfg. method and optical pick-up device
10/08/2003CN1447428A Electrostatic discharge protection circuit by using transisitor with double contact faces
10/08/2003CN1447427A Electrostatic discharge protection circuit
10/08/2003CN1447426A Capsulation body of semiconductor ship
10/08/2003CN1447425A Preparation method for capsulation of output and input end points as well as its structure
10/08/2003CN1447424A Combination of side blowing type heat radiation fins for electronic components
10/08/2003CN1447423A Diaphragm bearing belt for mounting electronic device and its mfg. method
10/08/2003CN1447422A Semiconductor device, image read assembly and image forming appts.
10/08/2003CN1447390A Semiconductor device and its mfg. method
10/08/2003CN1447206A Heat sink for CPU
10/08/2003CN1446768A Dielectric material and dielectric material sintered body and wiring board using such ceramic
10/08/2003CN1123931C Electronic module
10/08/2003CN1123930C Semiconductor device having multilayer interconnection structure
10/08/2003CN1123926C Laser based method and system for integrated circuit repair or reconfigration
10/08/2003CN1123925C Improved cavity type ball-shaped grid array circuit encapsulation
10/08/2003CN1123924C Soldering material for chip
10/07/2003US6631078 Electronic package with thermally conductive standoff
10/07/2003US6631077 Heat spreader with oscillating flow
10/07/2003US6630748 Load control apparatus and method having single temperature detector
10/07/2003US6630746 Semiconductor device and method of making the same
10/07/2003US6630745 An epoxy resin, a phenolic resin curing agent, a molybdenum compound, an organopolysiloxane, an organopolysiloxane cured product, or a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an
10/07/2003US6630744 Multichip module
10/07/2003US6630743 Copper plated PTH barrels and methods for fabricating
10/07/2003US6630742 Method for forming bumps, semiconductor device, and solder paste
10/07/2003US6630741 Method of reducing electromigration by ordering zinc-doping in an electroplated copper-zinc interconnect and a semiconductor device thereby formed
10/07/2003US6630740 Semiconductor device
10/07/2003US6630738 Deflectable interconnect
10/07/2003US6630737 Integrated circuit package, ball-grid array integrated circuit package
10/07/2003US6630736 Light barrier for light sensitive semiconductor devices
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