Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2003
10/15/2003CN1449031A Semiconductor devices
10/15/2003CN1449030A Millimeter band module with built-in semiconductor
10/15/2003CN1449004A Method for coating metal on the surface of integrated circuit structure
10/15/2003CN1448762A In-plane switching mode liquid crystal display device
10/15/2003CN1124652C Semiconductor device mount structure and semiconductor device mount method
10/15/2003CN1124651C Lid air bridge line
10/15/2003CN1124650C Semiconductor device, method of manufacturing same, and lead frame used therefor
10/15/2003CN1124649C Semiconductor device
10/15/2003CN1124647C Interconnect structure in semiconductor device and method of formation
10/15/2003CN1124645C Method and device for producing chip-substrate-lin
10/15/2003CN1124644C Semiconductor device, method of its manufacture, circuit substrate, and film carrier tape
10/15/2003CN1124576C Semiconductor equipment with multi-layered coductor configuration
10/14/2003US6634013 Wiring failure analysis method using simulation of electromigration
10/14/2003US6633489 Dynamic isolating mount for processor packages
10/14/2003US6633485 Snap-in heat sink for semiconductor mounting
10/14/2003US6633484 Heat-dissipating devices, systems, and methods with small footprint
10/14/2003US6633421 A unit has an array of lasers having an emission surface through which beams can be emitted in a substantially vertical direction so as to define an emission side, drive electronics connected to a side opposite to the emission side of the array
10/14/2003US6633196 Device and method for limiting the extent to which circuits in integrated circuit dice electrically load bond pads and other circuit nodes in the dice
10/14/2003US6633183 Antifuse reroute of dies
10/14/2003US6633180 Methods of rerouting dies using antifuses
10/14/2003US6633174 Stepper type test structures and methods for inspection of semiconductor integrated circuits
10/14/2003US6633087 Low-capacitance bonding pad for semiconductor device
10/14/2003US6633085 Method of selectively alloying interconnect regions by ion implantation
10/14/2003US6633083 Barrier layer integrity test
10/14/2003US6633082 Semiconductor device and method for manufacturing the semiconductor device
10/14/2003US6633081 Semiconductor device on a packaging substrate
10/14/2003US6633080 Semiconductor device
10/14/2003US6633079 Wafer level interconnection
10/14/2003US6633078 Semiconductor device, method for manufacturing an electronic equipment, electronic equipment and portable information terminal
10/14/2003US6633077 Semiconductor device and method for manufacturing the same
10/14/2003US6633075 Heterojunction bipolar transistor and method for fabricating the same
10/14/2003US6633057 Non-volatile semiconductor memory and fabricating method therefor
10/14/2003US6633055 Electronic fuse structure and method of manufacturing
10/14/2003US6633005 Multilayer RF amplifier module
10/14/2003US6632996 Micro-ball grid array package tape including tap for testing
10/14/2003US6632893 Used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected
10/14/2003US6632881 Superior moisture-resistant adhesion and low-stress properties
10/14/2003US6632746 Etching method, semiconductor and fabricating method for the same
10/14/2003US6632739 Method for fabricating a semiconductor device
10/14/2003US6632738 Method of manufacturing semiconductor device
10/14/2003US6632737 Method for enhancing the adhesion of a barrier layer to a dielectric
10/14/2003US6632734 Parallel plane substrate
10/14/2003US6632733 Components and methods with nested leads
10/14/2003US6632732 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
10/14/2003US6632722 Fiducial mark bodies for charged-particle-beam (CPB) microlithography, methods for making same, and CPB microlithography apparatus comprising same
10/14/2003US6632716 Better stable operation performance by preventing an element isolating film being etched away
10/14/2003US6632710 Method for forming semiconductor device
10/14/2003US6632705 Memory modules and packages using different orientations and terminal assignments
10/14/2003US6632704 Molded flip chip package
10/14/2003US6632696 Manufacturing method of active matrix substrate plate and manufacturing method therefor
10/14/2003US6632575 Rapid, accurate alignment
10/14/2003US6632532 Particle material anisotropic conductive connection and anisotropic conductive connection material
10/14/2003US6632512 Ceramic substrate
10/14/2003US6632031 Shunt transient voltage regulator in a processor package, method of making same, and method of using same
10/14/2003US6631756 High performance passive cooling device with ducting
10/14/2003US6631755 Thermal module with temporary heat storage
10/14/2003US6631662 Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions
10/14/2003US6631555 Method of thin film deposition as an active conductor
10/14/2003US6631540 Method of forming a low inductance high capacitance capacitor
10/09/2003WO2003084297A1 Wiring structure and its manufacturing method
10/09/2003WO2003084065A1 Integrated circuit, integrated circuit device, method for structuring integrated circuit device, and method for manufacturing integrated circuit device
10/09/2003WO2003083956A2 Enhanced thermal dissipation integrated circuit package and method of manufacturing enhanced thermal dissipation integrated circuit package
10/09/2003WO2003083942A2 Semiconductor device with components embedded in backside diamond layer
10/09/2003WO2003083941A2 Heat sink and method of removing heat from power electronics components
10/09/2003WO2003083940A1 Method of manufacturing heat conductive substrate
10/09/2003WO2003083939A1 Magnetic shield package and seal material of magnetic non-volatile memory element
10/09/2003WO2003083938A1 Hermetically sealed micro-device package with window
10/09/2003WO2003083927A1 Methods for manufacturing compound semiconductor and compound insulator using chemical reaction and diffusion by heating, compound semiconductor and compound insulator manufactured using the method, and photocell, electronic circuit, transistor, and memory using the same
10/09/2003WO2003083916A1 Memory wordline hard mask extension
10/09/2003WO2003083914A1 Position detection mark, mark identification method, position detection method, exposure method, and position information detection method
10/09/2003WO2003083908A2 Packaging system for semiconductor devices
10/09/2003WO2003083883A2 Packaging microelectromechanical structures
10/09/2003WO2003083770A1 Communication device and package thereof
10/09/2003WO2003083497A1 Zoom in pin nest structure, test vehicule having the structure, and method of fabricating the structure
10/09/2003WO2003083398A1 Method for assembling heat absorption block and heat pipe and the assembly of the same
10/09/2003WO2003082977A1 Resin containing dielectric filler for formation of built-in capacitor layer of printed wiring board, copper double clad laminate having dielectric layer formed with resin containing dielectric filler, and process for producing copper double clad laminate
10/09/2003WO2003082976A1 Thermosetting resin composition and epoxy resin molding material using the composition and semiconductor device
10/09/2003WO2003082955A1 Polyarylene sulfide resin and sealing agent for electronic parts
10/09/2003WO2003082732A2 Packaging microelectromechanical systems
10/09/2003WO2003063243B1 Thin films, structures having thin films, and methods of forming thin films
10/09/2003WO2003046989A3 Multi-chip module semiconductor devices
10/09/2003WO2003030247A3 Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces
10/09/2003WO2003022020A3 Sheet material and its use in circuit boards
10/09/2003WO2002095821A3 Housing for a photoactive semiconductor chip and a method for the production thereof
10/09/2003WO2002017391A3 Method of manufacturing a semiconductor device and a support plate, and a semiconductor device obtained by means of said method
10/09/2003WO2002015268A3 Cooling device
10/09/2003WO2002003183A3 Cooling device for a computer
10/09/2003US20030190829 Dual damascene barrier structures and preferential etching method
10/09/2003US20030190826 Test fixture for semiconductor packages and test method of using the same
10/09/2003US20030190801 Method for forming a metal extrusion free via
10/09/2003US20030190795 Method of manufacturing a semiconductor device
10/09/2003US20030190774 Sub-milliohm on-chip interconnection
10/09/2003US20030190769 Method of supporting a substrate film
10/09/2003US20030190498 Electromagnetic wave absorber, method of manufacturing the same and appliance using the same
10/09/2003US20030190479 Thermosetting resin compositions comprising epoxy resins, adhesion promoters and curatives based on the combination of nitrogen compounds and transition metal complexes
10/09/2003US20030190477 Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
10/09/2003US20030189816 Semiconductor module
10/09/2003US20030189815 Chipset cooling device of video graphic adapter card
10/09/2003US20030189814 Electronic device
10/09/2003US20030189813 High performance heat sink configurations for use in high density packaging applications
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