Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2003
10/16/2003WO2002103782A3 Barrier enhancement process for copper interconnects
10/16/2003WO2002097890A3 Bitline contacts in a memory cell array
10/16/2003WO2002073685A3 Multi-layer circuit assembly and process for preparing the same
10/16/2003WO2002071472A3 Method and structure of in-situ wafer scale polymer stud grid array contact formation
10/16/2003WO2002059966A8 Planarizers for spin etch planarization of electronic components and methods of use thereof
10/16/2003WO2002058139A3 Diamondoid-containing materials in microelectronics
10/16/2003US20030196178 Trough adjusted optical proximity correction for vias
10/16/2003US20030194978 System and method for coarse/fine PLL adjustment
10/16/2003US20030194949 Method for defect reduction
10/16/2003US20030194860 Semiconductor device manufacturing method and electronic equipment using same
10/16/2003US20030194855 Method of manufacturing semiconductor device package
10/16/2003US20030194854 Mask repattern process
10/16/2003US20030194840 Method of manufacturing semiconductor device with reduced number of process steps for capacitor formation
10/16/2003US20030194837 Methods for making semiconductor packages with leadframe grid arrays
10/16/2003US20030194835 Method for fabricating ceramic chip packages
10/16/2003US20030194834 Semiconductor device and method for the fabrication thereof
10/16/2003US20030194832 Power delivery system for integrated circuits utilizing discrete capacitors
10/16/2003US20030194830 Semiconductor chip package and manufacturing method thereof
10/16/2003US20030194822 Early response to plasma/charging damage by special pattern design of active region
10/16/2003US20030194820 Balancing planarization of layers and the effect of underlying structure on the metrology signal
10/16/2003US20030194537 Silicone-organic block copolymer, and a thermally conductive filler.
10/16/2003US20030194483 A base unit, a cap unit and a slider unit; applying a controlled thickness of semi-viscous material to a surface, especially high performance processor integrated circuit
10/16/2003US20030193794 Board-level EMI shield with enhanced thermal dissipation
10/16/2003US20030193791 Power delivery and other systems for integrated circuits
10/16/2003US20030193545 Electronic devices having an inorganic film
10/16/2003US20030193286 Hermetic encapsulation of organic, electro-optical elements
10/16/2003US20030193096 Wafer-level package with a cavity and fabricating method thereof
10/16/2003US20030193094 Semiconductor device and method for fabricating the same
10/16/2003US20030193093 Dielectric interposer for chip to substrate soldering
10/16/2003US20030193092 Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods
10/16/2003US20030193091 Semiconductor packages with leadframe grid arrays and components and methods for making the same
10/16/2003US20030193090 Semiconductor device and method of manufacturing the semiconductor device
10/16/2003US20030193089 Solder ball landpad design to improve laminate performance
10/16/2003US20030193088 Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
10/16/2003US20030193086 Composition for sealing a semiconductor device, semiconductor device and method of manufacturing the same
10/16/2003US20030193082 Substrate with dam bar structure
10/16/2003US20030193081 Interdigitated leads-over-chip lead frame and device for supporting an integrated circuit die
10/16/2003US20030193080 Robust leaded molded packages and methods for forming the same
10/16/2003US20030193078 Controlled impedance transmission lines in a redistribution layer
10/16/2003US20030193076 Elevated plug ends bond wafers; mating bonding pads; resistant to chemical mechanical polishing
10/16/2003US20030193075 Fuse structure
10/16/2003US20030193071 Circuit structure for connecting bonding pad and ESD protection circuit
10/16/2003US20030193051 Metal oxide semiconductor field effect transistor having a drain; junction diode with terminal connected to gate; integrated circuits; capacitor charged via the forward-biased diode
10/16/2003US20030193050 Test patterns and methods of controlling CMP process using the same
10/16/2003US20030192943 Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bonding
10/16/2003US20030192866 Chip scale marker and making method
10/16/2003US20030192674 Heat transport device
10/16/2003US20030192672 Clip for heat sink
10/16/2003US20030192670 Heat sink with converging device
10/16/2003US20030192636 Embedded hermetic cavity formation in low temperature cofired ceramic
10/16/2003US20030192181 Method of making an electronic contact
10/16/2003US20030192176 Re-assembly process for MEMS structures
10/16/2003US20030192163 Method of inserting metal heat dissipaters into electronics enclosures
10/16/2003DE10237561C1 Power semiconductor circuit device has DC and AC terminal leads extending parallel to substrate and/or connector paths and provided with surface elements for bonding wire connections
10/15/2003EP1353542A2 Multilayered wiring board, and process for its production
10/15/2003EP1353378A1 Alternating invertors for capacitive coupling reduction in transmission lines
10/15/2003EP1353377A2 Semiconductor device having pad electrode connected to wire
10/15/2003EP1353376A2 Heat sink with multiple surface enhancements
10/15/2003EP1353375A1 A thermally enhanced IC chip package
10/15/2003EP1353374A1 Semiconductor chip assemblies, methods of making same and components for same
10/15/2003EP1353373A2 Hermetically sealed package for an electronic component
10/15/2003EP1353365A2 Pre-cleaning of copper surfaces during Cu/Cu or Cu/Metal bonding using hydrogen plasma
10/15/2003EP1353187A2 Measuring junction leakage
10/15/2003EP1352930A2 Black composite particles for semiconductor sealing material, and semiconductor sealing material using the same
10/15/2003EP1352552A2 Interference mitigation through conductive thermoplastic composite materials
10/15/2003EP1352434A1 System for the conversion of water into non-oxidizing gases and electronic devices containing said systems
10/15/2003EP1352426A2 Methods and apparatus for making integrated circuit package including opening exposing portion of the ic
10/15/2003EP1352425A2 Integrated circuit package including opening exposing portion of an ic
10/15/2003EP1352424A1 Method for mounting a semiconductor component in a housing
10/15/2003EP1352419A2 Contact hump construction for the production of a connector construction for substrate connecting surfaces
10/15/2003EP1352403A2 Integrated transformer
10/15/2003EP1352185A1 Hydraulic motor-vehicle gearbox control device with a plastic hydraulic distribution plate and conductors integrated therein
10/15/2003EP1352107A2 An ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device, a method for fabricating the same, and an electronic device containing the same
10/15/2003EP1352027A2 Curing agent for epoxy resins and epoxy resin composition
10/15/2003EP1352008A2 Epoxy resin composition for semiconductor encapsulation
10/15/2003EP1351805A1 Injection molded heat dissipation device
10/15/2003EP1195811B1 Semiconductor device
10/15/2003EP1007249B1 Method for producing a cooling element, and a cooling element
10/15/2003CN2580605Y Integrated circuit with static discharge protective function
10/15/2003CN2580604Y Anti-high voltage strain and curvable plate heat pipe
10/15/2003CN2580603Y Curved fin type heat radiator
10/15/2003CN2580602Y Side blowing type heat radiator
10/15/2003CN2580601Y Heat radiator and its connection structure
10/15/2003CN2580510Y External magnetic circular ring multi-pole heat radiation fan
10/15/2003CN2580509Y Locking device for heat radiation module unit
10/15/2003CN2580507Y Heat radiation device
10/15/2003CN1449583A Plastic package base, air cavity type package and their manufacturing methods
10/15/2003CN1449582A Electronic assembly comprising solderable thermal interface and methods of manufacture
10/15/2003CN1449581A 半导体集成电路器件 The semiconductor integrated circuit device
10/15/2003CN1449580A Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators
10/15/2003CN1449579A Dram fabricated on a silicon-on-insulator (soi) substrate having bi-level digit lines
10/15/2003CN1449239A Cooling arrangement and electrical apparatus with cooling arrangement
10/15/2003CN1449233A Design method for plating of printed circuit board strip and manufacturing method of semiconductor chip package using the same
10/15/2003CN1449232A Circuit component built-in module and method of manufacturing the same
10/15/2003CN1449039A Semi-conductor integrated circuit equipment
10/15/2003CN1449036A Resin moulded devices and manufacturing installation therefor
10/15/2003CN1449035A Electrostatic discharge protective circuit having high trigger current
10/15/2003CN1449034A Semiconductor device with copper wirings
10/15/2003CN1449033A Metal welding pad of integrated circuit and method for making the same
10/15/2003CN1449032A Metal pad structure adapted for connecting pad and checking pad
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