Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2003
10/22/2003CN1450638A Bidirectional overvoltage and electrostatic discharge protector
10/22/2003CN1450637A Low-impedance olecoupling device
10/22/2003CN1450636A Wiring structure in semiconductor device
10/22/2003CN1450635A Inner storage node and making method thereof
10/22/2003CN1450634A Screen pattern medium layer and structure for protecting component under contact pad
10/22/2003CN1450633A Semiconductor device
10/22/2003CN1450632A Double-enclosure protective-ring structure for semiconductor chip
10/22/2003CN1450624A Method for forming low dielectric constant dielectric layer and conductive interconnector structure
10/22/2003CN1450614A Method for making ceramic chip package
10/22/2003CN1450593A Semiconductor device and mfg method thereof
10/22/2003CN1450592A Method for making wafer identifying label
10/22/2003CN1450433A Chipset cooling device of video graphic adapter card
10/22/2003CN1449990A Post-package technology for microelectromechinical system
10/22/2003CN1125491C Multi-layer plated lead frame
10/22/2003CN1125490C Heat sinking unit
10/22/2003CN1125489C Heat dissipated semiconducror device
10/22/2003CN1125488C Liquid epoxy composite for packaging semiconductor and its appliaction
10/22/2003CN1125484C Method for forming protective layer on semiconductor chip
10/22/2003CN1125392C Fixing fixture
10/22/2003CN1125198C Lead frame manufacturing method
10/22/2003CN1125135C Epoxy resin composition
10/21/2003US6636429 EMI reduction in power modules through the use of integrated capacitors on the substrate level
10/21/2003US6636424 Heat dissipation device
10/21/2003US6636423 Composite fins for heat sinks
10/21/2003US6636416 Electronic assembly with laterally connected capacitors and manufacturing method
10/21/2003US6636406 Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning
10/21/2003US6636064 Dual probe test structures for semiconductor integrated circuits
10/21/2003US6635970 Power distribution design method for stacked flip-chip packages
10/21/2003US6635969 Semiconductor device having chip-on-chip structure, and semiconductor chip used therefor
10/21/2003US6635968 Semiconductor device having improved alignment of an electrode terminal on a semiconductor chip and a conductor coupled to the electrode terminal
10/21/2003US6635964 Part of a structure used to interconnect electronic components or devices
10/21/2003US6635963 Semiconductor package with a chip connected to a wiring substrate using bump electrodes and underfilled with sealing resin
10/21/2003US6635962 Chip on chip semiconductor device
10/21/2003US6635961 Electronic component of a high frequency current suppression type and bonding wire for the same
10/21/2003US6635959 Thermally conductive silk-screenable interface material
10/21/2003US6635958 Surface mount ceramic package
10/21/2003US6635957 Leadless plastic chip carrier with etch back pad singulation and die attach pad array
10/21/2003US6635956 Semiconductor device, semiconductor module and hard disk
10/21/2003US6635955 Molded electronic component
10/21/2003US6635954 Stress reduction feature for LOC lead frame
10/21/2003US6635953 IC chip package
10/21/2003US6635952 Semiconductor device
10/21/2003US6635949 Symmetric inducting device for an integrated circuit having a ground shield
10/21/2003US6635948 Inductors arranged so that different pairs of inductors are electrically coupled to one another; power splitters and combiners using such coupled inductors
10/21/2003US6635939 Boron incorporated diffusion barrier material
10/21/2003US6635931 Bonding pad-oriented all-mode ESD protection structure
10/21/2003US6635829 Circuit board having side attach pad traces through buried conductive material
10/21/2003US6635819 Electronic component comprising a metallic case provided with a magnetic loss material
10/21/2003US6635603 Magnets and transmission lines; M2M'Cu3O9 in which M ions are divalent, M' ions are trivalent but are not solely Sc ions; mixed copper oxide
10/21/2003US6635583 Silicon carbide deposition for use as a low-dielectric constant anti-reflective coating
10/21/2003US6635572 Method of substrate silicon removal for integrated circuit devices
10/21/2003US6635567 Method of producing alignment marks
10/21/2003US6635564 Semiconductor structure and method of fabrication including forming aluminum columns
10/21/2003US6635560 Method for implementing selected functionality on an integrated circuit device
10/21/2003US6635553 Microelectronic assemblies with multiple leads
10/21/2003US6635548 Capacitor and method for forming same
10/21/2003US6635536 Method for manufacturing semiconductor memory device
10/21/2003US6635527 Metal-insulator-metal capacitor
10/21/2003US6635515 Method of manufacturing a semiconductor device having signal line above main ground or main VDD line
10/21/2003US6635514 Compliant package with conductive elastomeric posts
10/21/2003US6635510 Method of making a parylene coating for soldermask
10/21/2003US6635501 Low temperature cobalt silicidation process monitor
10/21/2003US6635407 Two pass process for producing a fine pitch lead frame by etching
10/21/2003US6635406 Integrated circuits, consisting substantially of organic insulators and conductors
10/21/2003US6635348 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
10/21/2003US6635333 Stereolithographically marked semiconductor devices and methods
10/21/2003US6635209 Method of encapsulating a substrate-based package assembly without causing mold flash
10/21/2003US6635099 Forming uniform copper formulation comprising gel forming polysaccharide binder, copper particles; molding; sintering to form heat sink
10/21/2003US6634890 Spring-loaded heat sink assembly for a circuit assembly
10/21/2003US6634421 High performance cold plate for electronic cooling
10/16/2003WO2003086037A1 Method of manufacturing an electronic device
10/16/2003WO2003086034A1 Electrically insulating body, and electronic device
10/16/2003WO2003085739A1 Circuit module and method for manufacturing the same
10/16/2003WO2003085738A2 Power module comprising two substrates and method for producing the same
10/16/2003WO2003085736A1 Electronic device and method of manufacturing same
10/16/2003WO2003085735A1 Beol process for cu metallizations free from al-wirebond pads
10/16/2003WO2003085733A1 Thermosetting adhesive sheet with electroconductive and thermoconductive properties
10/16/2003WO2003085731A1 Semiconductor device and method of manufacturing same
10/16/2003WO2003085730A1 Method of manufacturing an electronic device, and electronic device
10/16/2003WO2003085729A1 Method of manufacturing an electronic device
10/16/2003WO2003085728A1 Carrier, method of manufacturing a carrier and an electronic device
10/16/2003WO2003085727A2 Semiconductor chip comprising a protective layer and a corresponding production method
10/16/2003WO2003085726A1 Semiconductor device and its manufacturing method
10/16/2003WO2003085725A2 In package power supplies for integrated circuits
10/16/2003WO2003085723A1 Alignment method and mounting method using the alignment method
10/16/2003WO2003085719A2 Process for making air gap containing semiconducting devices and resulting semiconducting device
10/16/2003WO2003085703A2 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for the production thereof
10/16/2003WO2003085563A1 Inter-dice wafer level signal transfer methods for integrated circuits
10/16/2003WO2003085410A1 Method and arrangement for protecting a chip and checking its authenticity
10/16/2003WO2003084861A2 Method of manufacturing an electronic device in a cavity with a cover
10/16/2003WO2003084780A2 Electrochromic rearview mirror assembly incorporating a display/signal light
10/16/2003WO2003058714A3 Device and method for package warp compensation in an integrated heat spreader
10/16/2003WO2003052798A3 Method for improving electromigration performance of metallization features through multiple depositions of binary alloys
10/16/2003WO2003034799B1 Power delivery connector for integrated circuits with capacitor
10/16/2003WO2003030248A3 Method of mounting an electronic device on a substrate by a laser beam
10/16/2003WO2003019619A3 A low-k pre-metal dielectric semiconductor structure
10/16/2003WO2003015166A3 Sheet for sealing electric wiring
10/16/2003WO2003009372A3 Low resistivity tantalum nitride/tantalum bilayer stack
10/16/2003WO2003005450A9 Nanoscale wires and related devices
10/16/2003WO2003005443A3 Composite structure with a uniform crystal orientation and the method of controlling the crystal orientation of one such structure
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