Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2003
10/23/2003US20030197282 Low profile stack semiconductor package
10/23/2003US20030197281 Integrated circuit package having reduced interconnects
10/23/2003US20030197280 Unique feature design enabling structural integrity for advanced low K semiconductor chips
10/23/2003US20030197279 Integrated circuit with self-aligned line and via and manufacturing method therefor
10/23/2003US20030197278 Structure of integrated trace of chip package
10/23/2003US20030197277 Semiconductor device and a method of manufacturing the same
10/23/2003US20030197276 Damascene resistor and method for measuring the width of same
10/23/2003US20030197275 Semiconductor device and method for manufacturing same
10/23/2003US20030197274 Semiconductor device and method of manufacturing the same
10/23/2003US20030197272 Semiconductor integrated circuit device
10/23/2003US20030197271 Module assembly for stacked BGA packages
10/23/2003US20030197270 Semiconductor device and method of fabrication of the same
10/23/2003US20030197267 Ultrathin leadframe BGA circuit package
10/23/2003US20030197266 Cooling of optoelectronic elements
10/23/2003US20030197265 Automotive diode; gradient thickness of connector frame; solder dies
10/23/2003US20030197263 Semiconductor chip package with direction-flexible mountability
10/23/2003US20030197262 Dual-chip integrated circuit package and method of manufacturing the same
10/23/2003US20030197261 Memory card
10/23/2003US20030197259 Socket with low inductance side contacts for a microelectronic device package
10/23/2003US20030197258 Integrated circuit device packaging structure and packaging method
10/23/2003US20030197257 IC package, optical transmitter, and optical receiver
10/23/2003US20030197254 Package for enclosing a laser diode module
10/23/2003US20030197252 Semiconductor package with integrated conical vapor chamber
10/23/2003US20030197251 Semiconductor device with staggered hexagonal electrodes and increased wiring width
10/23/2003US20030197250 Semiconductor device and method of fabricating the same
10/23/2003US20030197249 Contactable integrated circuit and method of producing such a circuit
10/23/2003US20030197246 ESD protection circuit sustaining high ESD stress
10/23/2003US20030197243 Low noise inductor using electrically floating high resistive and grounded low resistive patterned shield
10/23/2003US20030197242 Structure and fabrication method of electrostatic discharge protection circuit
10/23/2003US20030197239 Clock distribution networks and conductive lines in semiconductor integrated circuits
10/23/2003US20030197226 Structure and fabrication method of electrostatic discharge protection circuit
10/23/2003US20030197225 Structure and fabrication method of electrostatic discharge protection circuit
10/23/2003US20030197209 CCD wafers with titanium refractory metal
10/23/2003US20030197200 TAB tape for semiconductor package
10/23/2003US20030197199 Semiconductor device and semiconductor module
10/23/2003US20030197198 Thermal management of power delivery systems for integrated circuits
10/23/2003US20030197195 Heat spreader interconnect methodology for thermally enhanced PBGA packages
10/23/2003US20030197175 Test structure for evaluating antenna effects
10/23/2003US20030197173 Solid image pickup device and method for producing the same
10/23/2003US20030197167 Ferroelectric capacitor plasma charging monitor
10/23/2003US20030197159 Red phosphorus overcoated with thermosetting resins
10/23/2003US20030197004 Microprocessor controlled heater/cooloer system
10/23/2003US20030196825 Metal matrix composite structure and method
10/23/2003US20030196787 Passive thermal regulator for temperature sensitive components
10/23/2003US20030196780 High performance cooling device with side mount fan
10/23/2003US20030196779 Heatsink device
10/23/2003US20030196516 Methods for manufacturing capacitors and electrodes using ultrafine nickel powder
10/23/2003CA2505014A1 Hermetic encapsulation of organic electro-optical elements
10/23/2003CA2485022A1 Method for connecting substrates and composite element
10/23/2003CA2480854A1 Method for producing a product having a structured surface
10/23/2003CA2480797A1 Method for producing a copy protection for an electronic circuit and corresponding component
10/23/2003CA2480737A1 Method for coating metal surfaces and substrate having a coated metal surface
10/23/2003CA2480691A1 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby
10/23/2003CA2479823A1 Method for the production of structured layers on substrates
10/22/2003EP1355522A2 Multilayered wiring board, method of producing multilayered wiring board, electronic device and electronic apparatus
10/22/2003EP1355359A1 Self-adjusting series connection of thin and thick films and method of fabrication
10/22/2003EP1355351A1 Semiconductor device
10/22/2003EP1355350A2 Chip scale marker and marking method
10/22/2003EP1355349A2 Integrated circuit assembly with bar bond attachment
10/22/2003EP1354916A1 Self-hardening epoxy resin for the manufacture of electric insulators
10/22/2003EP1354503A1 A method for the implementation of electronic components in via-holes of a multi-layer multi-chip module
10/22/2003EP1354381A1 Mounting of optical device on heat sink
10/22/2003EP1354358A2 Design of lithography alignment and overlay measurement marks on damascene surface
10/22/2003EP1354357A1 Semiconductor device with an improved transmission line
10/22/2003EP1354356A2 Semiconductor package and method
10/22/2003EP1354355A1 Planarizers for spin etch planarization of electronic components and methods of use thereof
10/22/2003EP1354354A2 Microelectronic package having an integrated heat sink and build-up layers
10/22/2003EP1354353A1 Clean release, phase change thermal interface
10/22/2003EP1354352A2 Refrigeration device and a method for producing the same
10/22/2003EP1354351A2 Direct build-up layer on an encapsulated die package
10/22/2003EP1354350A2 Plastic encapsulated semiconductor devices with improved corrosion resistance
10/22/2003EP1354349A2 Area efficient stacking of antifuses in semiconductor device
10/22/2003EP1354348A2 Self-aligned conductive line for cross-point magnetic memory integrated circuits
10/22/2003EP1354347A2 Viscous protective overlayers for planarization of integrated circuits
10/22/2003EP1354237A2 Fat conductor
10/22/2003EP1353693A2 Pharmaceutical combination containing a 4-quinazolineamine and another anti-neoplastic agent for the treatment of cancer
10/22/2003EP1287566B1 Thermoelectric element
10/22/2003EP0792517B1 Electrical contact structures from flexible wire
10/22/2003CN2582335Y Stable and shock-proof type radiation apparatus
10/22/2003CN2582207Y Electric connector assembly
10/22/2003CN2582177Y Flip structure
10/22/2003CN2582176Y Flow guiding device for radiating fan
10/22/2003CN2582175Y Bottom heating block type fast radiator
10/22/2003CN2582174Y Radiating device combination
10/22/2003CN2582173Y Efficient radiator device
10/22/2003CN2582172Y Radiator
10/22/2003CN2582171Y Draught CPU radiator
10/22/2003CN2582170Y Radiator fastener
10/22/2003CN2582169Y Radiator fastener
10/22/2003CN2582168Y Radiating device
10/22/2003CN2582050Y Radiator for computer central processor
10/22/2003CN2582047Y Radiator device combination
10/22/2003CN1451180A Planar hybrid diode rectifier bridge
10/22/2003CN1451179A Shaped springs and methds of fabricating and using shaped springs
10/22/2003CN1451178A Improved flip-chip package
10/22/2003CN1451177A Improved flourine deped silicon dioxide film
10/22/2003CN1451091A Notched finned heat sink
10/22/2003CN1450671A Method for raising anti-elactrostatic break-down ability of Hall device
10/22/2003CN1450647A Semiconductor device
10/22/2003CN1450639A Circuit structure for connecting weld-pad and electrostatic protective circuit