Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2003
10/28/2003US6638847 Method of forming lead-free bump interconnections
10/28/2003US6638845 Semiconductor device and manufacturing method of the same
10/28/2003US6638842 Methods of fabricating integrated circuitry
10/28/2003US6638831 Use of a reference fiducial on a semiconductor package to monitor and control a singulation method
10/28/2003US6638830 Method for fabricating a high-density capacitor
10/28/2003US6638810 Tantalum nitride CVD deposition by tantalum oxide densification
10/28/2003US6638808 Method of manufacturing gate driver with level shift circuit
10/28/2003US6638799 Method for manufacturing a semiconductor device having a silicon on insulator substrate
10/28/2003US6638796 Method of forming a novel top-metal fuse structure
10/28/2003US6638795 Semiconductor device and method of fabricating the same
10/28/2003US6638794 Method for fabricating an anti-fuse in programmable interconnections
10/28/2003US6638793 Methodology to pack standard staggered bond input-output buffer into linear input-output buffer
10/28/2003US6638792 Method for fabricating BOC semiconductor package
10/28/2003US6638790 Leadframe and method for manufacturing resin-molded semiconductor device
10/28/2003US6638638 Hollow solder structure having improved reliability and method of manufacturing same
10/28/2003US6638631 Stress relieving films comprising crosslinked mixtures of polysiloxanes, polyimides, polyamideimides copolymers and/or polyamides used as interfaces for semiconductors or printed circuits
10/28/2003US6638629 Semiconductor temperature monitor
10/28/2003US6638607 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
10/28/2003US6638592 Ceramic/metal substrate, especially composite substrate
10/28/2003US6638564 Method of electroless plating and electroless plating apparatus
10/28/2003US6638374 Device produced by a process of controlling grain growth in metal films
10/28/2003US6638352 For use in printed circuit boards; semiconductors
10/28/2003US6638077 Shielded carrier with components for land grid array connectors
10/28/2003US6637636 Apparatus of clamping semiconductor devices using sliding finger supports
10/28/2003US6637506 Multi-material heat spreader
10/28/2003US6637502 Heat sink with converging device
10/28/2003US6637501 Heat dissipation device
10/28/2003US6637231 Field replaceable packaged refrigeration heat sink module for cooling electronic components
10/28/2003US6637103 Method of tape bonding
10/23/2003WO2003088729A1 Board-level emi shield with enhanced thermal dissipation
10/23/2003WO2003088728A1 Power converter module
10/23/2003WO2003088724A1 Circuit board and method for manufacturing the same
10/23/2003WO2003088370A2 Hermetic encapsulation of organic electro-optical elements
10/23/2003WO2003088361A1 Nanowire devices and methods of fabrication
10/23/2003WO2003088356A1 Voltage variable material for direct application and devices employing same
10/23/2003WO2003088355A1 Semiconductor device and method for assembling the same
10/23/2003WO2003088354A2 Method for producing a copy protection for an electronic circuit and corresponding component
10/23/2003WO2003088347A2 Method for connecting substrates and composite element
10/23/2003WO2003088340A2 Method for the production of structured layers on substrates
10/23/2003WO2003088140A1 Module for a data carrier with improved bump counterparts
10/23/2003WO2003088139A1 Method for encapsulation of a chipcard and module obtained thus
10/23/2003WO2003088138A1 Single-layered multichip module
10/23/2003WO2003088022A1 Chipset cooling device of video graphic adapter card
10/23/2003WO2003087936A1 Method of treatment of porous dielectric films to reduce damage during cleaning
10/23/2003WO2003087850A1 Frequency characteristics measuring method and device for acceleration sensor
10/23/2003WO2003087590A2 Method of self-assembly and self-assembled structures
10/23/2003WO2003087424A1 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby
10/23/2003WO2003087423A1 Method for coating metal surfaces and substrate having a coated metal surface
10/23/2003WO2003087221A2 Thermally conductive phase change materials
10/23/2003WO2003086958A2 Method for producing a product having a structured surface
10/23/2003WO2003086677A1 Method of inserting metal heat dissipators
10/23/2003WO2003046980A3 Forming defect prevention trenches in dicing streets
10/23/2003WO2003041158A3 Semiconductor package device and method of formation and testing
10/23/2003WO2003038492A3 Hybrid integration of electrical and optical chips
10/23/2003WO2003019657A3 Integrated circuit device with bump bridges and method for making the same
10/23/2003WO2002099930B1 Socket connector and contact for use in a socket connector
10/23/2003WO2002095825A3 Laser-assisted silicide fuse programming
10/23/2003WO2002093637A3 Product comprising a substrate and a chip attached to the substrate
10/23/2003WO2002087292A3 Pin grid array package socket
10/23/2003WO2002071447A8 Ruthenium silicide wet etch
10/23/2003WO2002001632A3 Interconnection for accomodating thermal expansion for low elastic modulus dielectrics
10/23/2003US20030200509 Semiconductor IC with an inside capacitor for a power supply circuit and a method of automatically designing the same
10/23/2003US20030199391 Thermosetting resin composition, epoxy resin molding material and semiconductor device respectively using latent catalyst
10/23/2003US20030199172 Methods of nanotube films and articles
10/23/2003US20030199169 Method of forming dual damascene interconnection using low-k dielectric
10/23/2003US20030199161 Semiconductor integrated circuit device and method for making the same
10/23/2003US20030199160 Use of palladium in IC manufacturing with conductive polymer bump
10/23/2003US20030199159 Novel method for dual-layer polyimide processing on bumping technology
10/23/2003US20030199152 Method of forming a conductive contact
10/23/2003US20030199146 Insulating layer, semiconductor device and methods for fabricating the same
10/23/2003US20030199131 Wafer alignment mark for image processing, image processing alignment method and method of manufacturing semiconductor device
10/23/2003US20030199125 Fabrication method and wafer structure of semiconductor device using low-k film
10/23/2003US20030199123 Clock distribution networks and conductive lines in semiconductor integrated
10/23/2003US20030199122 Method of manufacturing a semiconductor device
10/23/2003US20030199121 Wafer scale thin film package
10/23/2003US20030199120 Semiconductor device and fabrication process therefor
10/23/2003US20030199118 Wire bonding method for a semiconductor package
10/23/2003US20030199109 Wafer-level test structure for edge-emitting semiconductor lasers
10/23/2003US20030198109 Semiconductor memory device with series-connected antifuse-components
10/23/2003US20030198095 Memory device and manufacturing method thereof
10/23/2003US20030198073 Bi-level digit line architecture for high density DRAMS
10/23/2003US20030198034 Multi-chip module and fabricating method thereof
10/23/2003US20030198032 Integrated circuit assembly and method for making same
10/23/2003US20030198022 Power converter package with enhanced thermal management
10/23/2003US20030198021 Substrate with fullerenes coating
10/23/2003US20030198020 Vertical surface mount apparatus with thermal carrier and method
10/23/2003US20030198019 Radiator plate and process for manufacturing the same
10/23/2003US20030198017 Electronic device
10/23/2003US20030198016 Active heat sink utilizing hot plug fans
10/23/2003US20030198006 Multi-layer capacitor, wiring board, and high-frequency circuit
10/23/2003US20030197764 Method of manufacturing semiconductor device, semiconductor device, narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink jet head, ink jet printer, micromachine, liquid crystal panel, and electronic device
10/23/2003US20030197586 Parallel spiral stacked inductor on semiconductor material
10/23/2003US20030197430 Chip/package resonance damping using controlled package series resistance
10/23/2003US20030197291 Semiconductor device and method of manufacturing the same
10/23/2003US20030197290 Stackable semiconductor package and method for manufacturing same
10/23/2003US20030197289 Controlling spacings; separating detector and bonding zones
10/23/2003US20030197288 Positioning to reduce axial displacement of wire bonding
10/23/2003US20030197285 High density substrate for the packaging of integrated circuits
10/23/2003US20030197284 Semiconductor package
10/23/2003US20030197283 Multi-chip package and method for manufacturing the same
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