Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2003
10/30/2003WO2002071471A3 Traceless flip chip assembly & method
10/30/2003WO2002069372A3 Self-coplanarity bumping shape for flip chip
10/30/2003WO2002068321A3 Forming tool for forming a contoured microelectronic spring mold
10/30/2003WO2002013265A3 Heat sink assembly with evenly distributed compression force
10/30/2003WO2001035718A3 System and method for product yield prediction
10/30/2003US20030204832 Automatic generation method of dummy patterns
10/30/2003US20030204743 Authentication of integrated circuits
10/30/2003US20030203663 Flexible circuit connector for stacked chip module
10/30/2003US20030203661 Connection terminals and manufacturing method of the same, semiconductor device and manufacturing method of the same
10/30/2003US20030203617 Process of forming copper structures
10/30/2003US20030203608 Fabrication of semiconductor devices with transition metal boride films as diffusion barriers
10/30/2003US20030203606 Method for manufacturing a semiconductor device
10/30/2003US20030203591 Laser marking techniques
10/30/2003US20030203589 Method of wafer marking for multi-layer metal processes
10/30/2003US20030203587 Vertical thermal nitride mask (anti-collar) and processing thereof
10/30/2003US20030203561 Dual-gate CMOS semiconductor device and dual-gate CMOS semiconductor device manufacturing method
10/30/2003US20030203548 Method of fabricating integrated circuitry, method of forming a local interconnect, and method of forming a conductive line.
10/30/2003US20030203542 Protected bond fingers
10/30/2003US20030203541 Lead frame and method for fabricating resin-encapsulated semiconductor device using the same
10/30/2003US20030203540 Stacked semiconductor package and fabricating method thereof
10/30/2003US20030203539 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
10/30/2003US20030203537 Method of fabricating stacked die configurations utilizing redistribution bond pads
10/30/2003US20030203536 Flip chip underfill process
10/30/2003US20030203535 Flip-chip package with optimized encapsulant adhesion and method
10/30/2003US20030203319 Method of fabricating sub-lithographic sized line and space patterns for nano-imprinting lithography
10/30/2003US20030203216 Bond pad structure comprising tungsten or tungsten compound layer on top of metallization level
10/30/2003US20030203188 Thermal management materials
10/30/2003US20030203181 Interstitial material with enhanced thermal conductance for semiconductor device packaging
10/30/2003US20030203170 Forming an insulating film by thermally curing the solder photoresist thermosetting resin, forming a small hole with a laser beam, electric plating a lead
10/30/2003US20030202398 High voltage switch circuitry
10/30/2003US20030202373 Semiconductor package with a controlled impedance bus and method of forming same
10/30/2003US20030202372 Semiconductor memory module
10/30/2003US20030202332 Second level packaging interconnection method with improved thermal and reliability performance
10/30/2003US20030202331 Integrated circuit with low-loss primary conductor strapped by lossy secondary conductor
10/30/2003US20030202330 Power delivery connector for integrated circuits utilizing integrated capacitors
10/30/2003US20030202328 Wrap- around cooling arrangement for printed circuit board
10/30/2003US20030202327 Heat dissipation module
10/30/2003US20030202326 Electromagnetic interference reduction air duct
10/30/2003US20030202312 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
10/30/2003US20030202309 Semiconductor integrated circuit device including protection circuit for preventing circuit breakdown by static electricity
10/30/2003US20030202306 Heat sink for semiconductor die employing phase change cooling
10/30/2003US20030202150 Liquid crystal display driver integrated circuit package and chip on glass type liquid crystal display device using the same
10/30/2003US20030201827 High frequency power amplifier module
10/30/2003US20030201819 Oxide anti-fuse structure utilizing high voltage transistors
10/30/2003US20030201548 Epoxy resin molding material for sealing
10/30/2003US20030201547 Integrated circuit device having reduced bow and method for making same
10/30/2003US20030201546 Resin-sealed semiconductor device
10/30/2003US20030201544 Flip chip package
10/30/2003US20030201543 Deep UV-resistant photoresist plug for via hole
10/30/2003US20030201542 Flexible lead surface-mount semiconductor package
10/30/2003US20030201540 Insulating layers in semiconductor devices having a multi-layer nanolaminate structure of SiNx thin film and BN thin film and methods for forming the same
10/30/2003US20030201539 Multilayer wires laminated to integrated circuit chip; applying electrode, dielectric; pressurization
10/30/2003US20030201537 Barrier material for copper structures
10/30/2003US20030201536 Semiconductor device and manufacturing process therefor as well as plating solution
10/30/2003US20030201535 Image sensor semiconductor package
10/30/2003US20030201534 Dielectric supports surfaces; electrically connecting structures; overcoating projections with metal
10/30/2003US20030201532 Connection device and method for producing the same
10/30/2003US20030201531 Semiconductor devices including protective layers on active surfaces thereof
10/30/2003US20030201530 Heat and stress resistance; copper oxide dispersed in copper matrix; aluminum nitride substrate; heat dissipation
10/30/2003US20030201529 Package stacked semiconductor device having pin linking means
10/30/2003US20030201528 Flip-chip die and flip-chip package substrate
10/30/2003US20030201527 Semiconductor device and method of manufacturing same
10/30/2003US20030201526 Packages for semiconductor die
10/30/2003US20030201525 Standoffs for centralizing internals in packaging process
10/30/2003US20030201524 Tape automated bonding with strip carrier frame assembly
10/30/2003US20030201523 Semiconductor device and communication terminal using thereof
10/30/2003US20030201522 Semiconductor device having improved alignment of an electrode terminal on a semiconductor chip and a conductor coupled to the electrode terminal
10/30/2003US20030201521 Semiconductor packaging device and manufacture thereof
10/30/2003US20030201520 Structure and method of forming a multiple leadframe semiconductor device
10/30/2003US20030201519 Semiconductor package with conductor impedance selected during assembly
10/30/2003US20030201518 Suppressing radiation charges from reaching dark signal sensor
10/30/2003US20030201514 MOS antifuse with low post-program resistance
10/30/2003US20030201498 ESD parasitic bipolar transistors with high resistivity regions in the collector
10/30/2003US20030201490 Semiconductor device having an improved local interconnect structure and a method for forming such a device
10/30/2003US20030201484 Semiconductor capacitive element, method for manufacturing same and semiconductor device provided with same
10/30/2003US20030201476 Adjustable 3D capacitor
10/30/2003US20030201472 Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device
10/30/2003US20030201470 Multi-level shielded multi-conductor interconnect bus for MEMS
10/30/2003US20030201465 Semiconductor manufacturing method for low-k insulating film
10/30/2003US20030201457 Gate-coupled MOSFET ESD protection circuit
10/30/2003US20030201452 Method producing a contact connection between a semiconductor chip and a substrate and the contact connection
10/30/2003US20030201451 Light emitting diode
10/30/2003US20030201440 Thin film transistor formed on a transparent substrate
10/30/2003US20030201122 Flip-chip package substrate
10/30/2003US20030201113 Lead-less semiconductor device with improved electrode pattern structure
10/30/2003US20030201095 Water cooled heat dissipation device
10/30/2003US20030201093 Heat sink
10/30/2003US20030201092 Liquid cooling system for processors
10/30/2003US20030200762 Cooling device for semiconductor elements
10/30/2003US20030200758 Semiconductor cooling device and method of controlling same
10/30/2003US20030200654 Silicon substrate; etching aperture, channels; overcoating with dielectrics
10/30/2003CA2482668A1 Microprocessor controlled heater/cooler system
10/30/2003CA2482635A1 Authentication of integrated circuits
10/29/2003EP1357771A1 Electronic parts
10/29/2003EP1357610A1 Light emitting diode, optical semiconductor elemet and epoxy resin composition suitable for optical semiconductor element and production methods therefor
10/29/2003EP1357606A1 Image sensor semiconductor package
10/29/2003EP1357601A2 Power integrated circuit with distributed gate driver
10/29/2003EP1357599A2 Parallel spiral stacked inductor on semiconductor material
10/29/2003EP1357597A1 Voltage conversion module
10/29/2003EP1357596A2 Semiconductor device and method of fabricating the same
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