Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2003
10/29/2003EP1357595A1 Ball grid array semiconductor package with resin coated core
10/29/2003EP1357594A1 Power semiconductor device manufactured using a chip-size package
10/29/2003EP1357593A2 Embedded hermetic cavity formation in low temperature cofired ceramic
10/29/2003EP1357592A2 Side flow cooling device
10/29/2003EP1357591A2 Method of mounting electrical components on a base plate in a radio frequency terminal unit
10/29/2003EP1357433A2 Method of fabricating sub-lithographic sized line and space patterns
10/29/2003EP1356718A2 Packaged integrated circuits and methods of producing thereof
10/29/2003EP1356521A1 Power transistor with internally combined low-pass and band-pass matching stages
10/29/2003EP1356520A2 Microelectronic substrate with integrated devices
10/29/2003EP1356519A2 Integrated core microelectronic package
10/29/2003EP1356518A2 Substrate for an electric component and method for the production thereof
10/29/2003EP1356516A2 Enhanced die-up ball grid array packages and method for making the same
10/29/2003EP1356515A1 Molding assembly for wafer scale molding of protective caps
10/29/2003EP1356514A1 Use of infrared radiation in molding of protective caps
10/29/2003EP1356513A1 Molding of protective caps
10/29/2003EP1356512A2 Direct heatpipe attachment to die using center point loading
10/29/2003EP1356511A1 Use of protective caps as masks at a wafer scale
10/29/2003EP1356510A1 Wafer scale molding of protective caps
10/29/2003EP1356508A1 Inkjet device encapsulated at the wafer scale
10/29/2003EP1356498A1 Chromium adhesion layer for copper vias in low-k technology
10/29/2003EP1356477A1 Compliant and crosslinkable thermal interface materials
10/29/2003EP1355745A1 Bond enhancement antitarnish coatings
10/29/2003CN2583935Y Air cooled radiator for electric power electronic device
10/29/2003CN2583718Y Heat conducting pipe multi layer capillary improvement structure
10/29/2003CN2583600Y Radiator
10/29/2003CN1452787A Clamping heat sinks to circuit boards over processors
10/29/2003CN1452451A Multilayer wiring substrate, method for mfg. same, electronic device and electronic machine
10/29/2003CN1452317A Semiconductor switch circuit device
10/29/2003CN1452244A 半导体器件 Semiconductor devices
10/29/2003CN1452243A Semiconductor IC device
10/29/2003CN1452241A Semiconductor device with soldering pad electrode connected to wire
10/29/2003CN1452240A Integrated circuit element installation structure and method
10/29/2003CN1452239A Infrared element air tight chamber packaging base table and configuration
10/29/2003CN1452230A High sensitivity testing structure for evaluating plasma antenna effect
10/29/2003CN1452229A Image sensor single-layer conductor rest secondary semi-etching mfg. method and packaging structure thereof
10/29/2003CN1452226A Forming of embedded seal cavity in low-temp. co-sintered ceramic
10/29/2003CN1452217A Wafer form packaging and mfg. method thereof
10/29/2003CN1451954A Geothermal heat exchanger heating assaying method and device
10/29/2003CN1451931A Non-freezing liquid circulation type geothermal energy use device
10/29/2003CN1126172C Spherical grid array package
10/29/2003CN1126171C Semiconductor wafer with solder layer
10/29/2003CN1126170C Solder terminal and making method thereof
10/29/2003CN1126169C Cooler
10/29/2003CN1126168C Electronic element assembly having package material and formation method therefor
10/29/2003CN1126167C Semiconductor chip mounting board and mounting method for semiconductor chip
10/29/2003CN1126163C Film carrier tape and semiconductor device, and method for manufacturing them
10/29/2003CN1126162C Method for mounting semiconductor chips on basic board with circuit trace and its products
10/29/2003CN1126161C package method of semiconductor chip and its finished products
10/29/2003CN1126160C Method for packing semiconductor chip and its products
10/29/2003CN1126155C Improved silica insulation film with reduced dielectric constant and method of forming same
10/29/2003CN1126119C Method of making electronic device
10/29/2003CN1126103C Fuse circuit and redundant decoder
10/29/2003CN1126064C Method for making contactless card with antenna connected with soldered wires
10/29/2003CN1125850C Crosslindable elastomer composition and formed article prepared from said composition
10/29/2003CN1125841C Epoxy resin composition and process for producing silane modified epoxy resin
10/28/2003US6639863 Semiconductor integrated circuit device having link element
10/28/2003US6639804 Adjustable device for heat sink retention module
10/28/2003US6639803 Compliant heat sink device/mounting system interconnect and a method of implementing same
10/28/2003US6639802 Heat sink with interlocked fins
10/28/2003US6639800 Heat sink subassembly
10/28/2003US6639799 Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
10/28/2003US6639797 Computer having cooling device
10/28/2003US6639360 High power radiation emitter device and heat dissipating package for electronic components
10/28/2003US6639324 Flip chip package module and method of forming the same
10/28/2003US6639323 Semiconductor device and its manufacturing method
10/28/2003US6639322 Flip-chip transition interface structure
10/28/2003US6639321 Balanced coefficient of thermal expansion for flip chip ball grid array
10/28/2003US6639320 Reticle for creating resist-filled vias in a dual damascene process
10/28/2003US6639319 Conductive structure in an integrated circuit
10/28/2003US6639318 Integrated circuit device and its manufacturing method
10/28/2003US6639317 Semiconductor device in trench
10/28/2003US6639315 Semiconductor device and mounted semiconductor device structure
10/28/2003US6639314 Solder bump structure and a method of forming the same
10/28/2003US6639312 Comprising a protective layer on the surface of the wafer and a layer of silicon covering it to increase the wafer's resistance to breaking during semiconductor processing; impact strength; durability; vapor disposition
10/28/2003US6639311 Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component
10/28/2003US6639310 Pin arrangement for high frequency integrated circuit
10/28/2003US6639308 Near chip size semiconductor package
10/28/2003US6639306 Semiconductor package having a die pad with downward-extended tabs
10/28/2003US6639305 Single layer surface mount package
10/28/2003US6639304 Ball grid array module
10/28/2003US6639303 Integrated circuits and methods for their fabrication
10/28/2003US6639302 Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carries
10/28/2003US6639299 Semiconductor device having a chip size package including a passive element
10/28/2003US6639298 Multi-layer inductor formed in a semiconductor substrate
10/28/2003US6639297 Fuse structure
10/28/2003US6639288 Semiconductor device with a particular conductor arrangement
10/28/2003US6639285 Method for fabricating a semiconductor device
10/28/2003US6639284 Compensated-well electrostatic discharge protection structure
10/28/2003US6639283 Semiconductor device with substrate-triggered ESD protection
10/28/2003US6639263 Semiconductor device with copper wiring connected to storage capacitor
10/28/2003US6639242 Monolithically integrated solid-state SiGe thermoelectric energy converter for high speed and low power circuits
10/28/2003US6639177 Method and system for processing one or more microstructures of a multi-material device
10/28/2003US6639155 High performance packaging platform and method of making same
10/28/2003US6638894 Devices and systems based on novel superconducting material
10/28/2003US6638870 Forming a structure on a wafer
10/28/2003US6638867 Method for forming a top interconnection level and bonding pads on an integrated circuit chip
10/28/2003US6638863 Electropolishing metal layers on wafers having trenches or vias with dummy structures
10/28/2003US6638854 Semiconductor device and method for manufacturing the same
10/28/2003US6638852 Structure and method for preventing barrier failure
10/28/2003US6638848 Method of etching insulating film and method of forming interconnection layer
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