Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2003
11/05/2003CN1127202C Electronic component and producing method thereof
11/05/2003CN1127152C Surface mounting type light emitting diode
11/05/2003CN1127144C Integrated circuit device and process for its manufacture
11/05/2003CN1127139C Package for mating with a semiconductor chip and method of manufacture
11/05/2003CN1127138C Vacuum package shell and packaging method for full-metal low-temp micro-electromechanical system
11/05/2003CN1127132C Copper interconnect structure and method of formation
11/05/2003CN1127131C Improved substrate structure for covering holes in semiconductor device and forming method thereof
11/05/2003CN1127128C Semiconductor device having simple protective structure and process of fabrication thereof
11/05/2003CN1127127C Semiconductor chip device and its packaging method
11/05/2003CN1127126C Method of manufacturing thin film transistor
11/05/2003CN1127125C Method for manufacturing semiconductor device capable of effectively carrying out hydrogen passivation
11/05/2003CN1126919C Thermoelectric cooling equipment with dynamic switch of isolate heat transport mechanism and operating method thereof
11/04/2003US6643418 Electric or opto-electric component with a packaging of plastic and a method for varying the impedance of a terminal lead of the component by attaching a dielectric plate to at least one terminal lead
11/04/2003US6643142 Module having a lead frame equipped with components on both sides
11/04/2003US6643137 Heat-dissipating device with grounding capability
11/04/2003US6643136 Multi-chip package with embedded cooling element
11/04/2003US6643133 Buckling device of a heat dissipating module
11/04/2003US6643131 Wind guide device for CPU cooler
11/04/2003US6643129 Cooling unit including fan and plurality of air paths and electronic apparatus including the cooling unit
11/04/2003US6642808 High frequency package, wiring board, and high frequency module having a cyclically varying transmission characteristic
11/04/2003US6642735 Semiconductor package for chip with testing contact pad connected to outside
11/04/2003US6642727 Chip carrier device and method for the production of a chip carrier device with an electrical test
11/04/2003US6642627 Semiconductor chip having bond pads and multi-chip package
11/04/2003US6642626 Ball grid array IC package and manufacturing method thereof
11/04/2003US6642625 Sockets for “springed” semiconductor devices
11/04/2003US6642624 Ball grid array type semiconductor device
11/04/2003US6642623 Multi-layered copper bond pad for an integrated circuit
11/04/2003US6642622 Semiconductor device with protective layer
11/04/2003US6642620 Integrated circuits having low resistivity contacts and the formation thereof using an in situ plasma doping and clean
11/04/2003US6642619 System and method for adhesion improvement at an interface between fluorine doped silicon oxide and tantalum
11/04/2003US6642617 Semiconductor device
11/04/2003US6642615 Semiconductor device and method of manufacturing the same, circuit board and electronic instrument
11/04/2003US6642613 Techniques for joining an opto-electronic module to a semiconductor package
11/04/2003US6642612 Lead-bond type chip package and manufacturing method thereof
11/04/2003US6642611 Storage apparatus, card type storage apparatus, and electronic apparatus
11/04/2003US6642610 Wire bonding method and semiconductor package manufactured using the same
11/04/2003US6642609 Leadframe for a semiconductor device having leads with land electrodes
11/04/2003US6642604 An interlayer dielectric film covering the resistor layer has first and second embedded plugs providing the interconnection to reduce in temperature rise in resistor elements
11/04/2003US6642603 Same conductivity type highly-doped regions for antifuse memory cell
11/04/2003US6642601 Low current substantially silicide fuse for integrated circuits
11/04/2003US6642597 Inter-layer interconnection structure for large electrical connections
11/04/2003US6642584 Dual work function semiconductor structure with borderless contact and method of fabricating the same
11/04/2003US6642576 Power semiconductor device having layered structure of power semiconductor elements and terminal members
11/04/2003US6642559 Does not increase size of monolithic microwave integrated circuit or require additional circuitry
11/04/2003US6642551 Stable high voltage semiconductor device structure
11/04/2003US6642540 Semiconductor integrated circuit device
11/04/2003US6642512 Focused ion beam apparatus
11/04/2003US6642150 Method for testing for blind hole formed in wafer layer
11/04/2003US6642145 Method of manufacturing an integrated circuit with a dielectric diffusion barrier layer formed between interconnects and interlayer dielectric layers
11/04/2003US6642144 Method of forming memory device having capacitor including layer of high dielectric constant
11/04/2003US6642138 Process of making dual damascene structures using a sacrificial polymer
11/04/2003US6642137 Method for manufacturing a package structure of integrated circuits
11/04/2003US6642136 Method of making a low fabrication cost, high performance, high reliability chip scale package
11/04/2003US6642135 Method for forming semiconductor memory device having a fuse
11/04/2003US6642126 Process for manufacturing a semiconductor wafer with passivation layer mask for etching with mechanical removal
11/04/2003US6642114 Semiconductor device and method for fabricating the same
11/04/2003US6642102 Barrier material encapsulation of programmable material
11/04/2003US6642083 Semiconductor device and manufacturing method thereof
11/04/2003US6642082 Method for manufacturing a resin-sealed semiconductor device
11/04/2003US6642081 Interlocking conductor method for bonding wafers to produce stacked integrated circuits
11/04/2003US6642080 Chip-on-chip interconnections of varied characterstics
11/04/2003US6642079 Process of fabricating flip chip interconnection structure
11/04/2003US6642078 Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators
11/04/2003US6642072 Light-emitting element, semiconductor light-emitting device, and manufacturing methods therefor
11/04/2003US6642064 Method of making a high density programmable logic device in a multichip module package
11/04/2003US6641982 Methodology to introduce metal and via openings
11/04/2003US6641928 Adhesives and electric devices
11/04/2003US6641861 Heatsink and fabrication method thereof
11/04/2003US6641705 Apparatus and method for reducing differential sputter rates
11/04/2003US6641411 Low cost high speed connector
11/04/2003US6641254 Electronic devices having an inorganic film
11/04/2003US6641030 Method and apparatus for placing solder balls on a substrate
11/04/2003US6640888 Heat sink
11/04/2003US6640884 Heat sink fastener
11/04/2003US6640883 Computer heat sink
11/04/2003US6640882 Removable mounting clip attaches a motorized fan to an active heat sink and then the entire assembly to a part to be cooled
11/04/2003US6640432 Method of fabricating shaped springs
11/04/2003US6640429 Method of making multilayer circuit board
11/03/2003CA2422609A1 Leadframe assembly
10/2003
10/30/2003WO2003090497A2 Microprocessor controlled heater/cooler system
10/30/2003WO2003090287A1 Modular thermoelectric couple and stack
10/30/2003WO2003090284A1 Self-assembled nanobump array structures and a method to fabricate such structures
10/30/2003WO2003090283A2 Semiconductor component comprising an integrated capacitor structure that has a plurality of metallization planes
10/30/2003WO2003090280A1 Semiconductor component having an integrated capacitance structure and method for producing the same
10/30/2003WO2003090279A1 Semiconductor component comprising an integrated latticed capacitance structure
10/30/2003WO2003090277A1 Circuit board, process for producing the same and power module
10/30/2003WO2003090259A2 Authentication of integrated circuits
10/30/2003WO2003090245A1 Thermionic vacuum diode device with adjustable electrodes
10/30/2003WO2003089564A1 Substrate and method for measuring the electrophysiological properties of cell membranes
10/30/2003WO2003067648A3 Semiconductor device and method of manufacturing the same
10/30/2003WO2003055803A3 Particulate alumina, method for producing particulate alumina and composition containing particulate alumina
10/30/2003WO2003052824A3 Method for determining the esd/latch-up resistance of an integrated circuit
10/30/2003WO2003046979A3 Method of using ternary copper alloy to obtain a low resistance and large grain size interconnect
10/30/2003WO2003038899A3 Semiconductor structure with a coil underneath the first wiring layer or between two wiring layers
10/30/2003WO2003030255A3 Multiple die interconnect system
10/30/2003WO2003027003A3 Methods of nanotube films and articles
10/30/2003WO2002100769A3 A circuit encapsulation technique utilizing electroplating
10/30/2003WO2002095801A3 Improved connection assembly for integrated circuit sensors
10/30/2003WO2002095796A3 Optical semiconductor housing with incorporated lens and shielding
10/30/2003WO2002084746A3 Optoelectronic component array and method for the production of an optoelectronic component array
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