Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2003
11/06/2003US20030205810 Semiconductor device and manufacturing method thereof
11/06/2003US20030205809 Barrier material encapsulation of programmable material
11/06/2003US20030205808 Semiconductor device
11/06/2003US20030205807 Each pad has conductive traces on the second surface extending therefrom and configured to increase the shear strength of the pad as compared to the pad alone.
11/06/2003US20030205806 Integrated power module with reduced thermal impedance
11/06/2003US20030205805 Partial slot cover for encapsulation process
11/06/2003US20030205804 Integrated chip package structure using ceramic substrate and method of manufacturing the same
11/06/2003US20030205802 Method of bonding a semiconductor die without an ESD circuit and a separate ESD circuit to an external lead, and a semiconductor device made thereby
11/06/2003US20030205801 Ball grid array package with stacked center pad chips and method for manufacturing the same
11/06/2003US20030205800 Chip on board package for optical mice and lens cover for the same
11/06/2003US20030205798 Semiconductor die package including carrier with mask
11/06/2003US20030205797 Method of manufacturing a semiconductor device and a semiconductor device
11/06/2003US20030205795 Alignment and orientation features for a semiconductor package
11/06/2003US20030205793 Wire-bonded chip on board package
11/06/2003US20030205792 Semiconductor device packaging assembly and method for manufacturing the same
11/06/2003US20030205791 Semiconductor device
11/06/2003US20030205790 Multi-part lead frame with dissimilar materials
11/06/2003US20030205789 Structure and method for securing bussing leads
11/06/2003US20030205788 Leadframe assembly
11/06/2003US20030205787 Semiconductor device having a fuse
11/06/2003US20030205782 Passivation integrity improvements
11/06/2003US20030205778 High performance RF inductors and transformers using bonding technique
11/06/2003US20030205777 Integrated fuse with regions of different doping within the fuse neck
11/06/2003US20030205761 Bi-directional silicon controlled rectifier for electrostatic discharge protection
11/06/2003US20030205746 Semiconductor device and method for fabricating the same
11/06/2003US20030205732 Microelectronic die including low RC under-layer interconnects
11/06/2003US20030205730 Semiconductor device and method for manufacturing the same, semiconductor wafer and semiconductor device manufactured thereby
11/06/2003US20030205725 Semiconductor device and its manufacturing method
11/06/2003US20030205723 Metal-to-metal antifuse employing carbon-containing antifuse material
11/06/2003US20030205699 Black composite particles for semiconductor sealing material, and semiconductor sealing material using the same
11/06/2003US20030205689 Aqueous mixture of chlorine- and fluorine-containing chemicals, especially hydrofluoric acid and potassium hypochlorite; the mixture reacts with the ruthenium silicide to produce water-soluble reaction products.
11/06/2003US20030205551 Method for the manufacture of printed circuit boards with plated resistors
11/06/2003US20030205369 Heat-radiating structure with low height
11/06/2003US20030205368 Adhesive to attach a cooling device to a thermal interface
11/06/2003US20030205364 Method and apparatus for dissipating heat from an electronic device
11/06/2003US20030205240 For cleaning of semiconductor wafers
11/06/2003US20030205054 High efficiency cooling system and heat absorbing unit
11/06/2003DE29924554U1 Chip size package has all its silicon layer doped regions connected by structured conductor lines at the side at which the doped regions are introduced
11/06/2003CA2518614A1 Manufacturing method for a wireless communication device and manufacturing apparatus
11/06/2003CA2427401A1 Heat sink attachment clip
11/05/2003EP1359667A2 Low-impedance decoupling device
11/05/2003EP1359644A2 Leadframe assembly
11/05/2003EP1359619A2 Heatsink for surface mounting technology
11/05/2003EP1359618A2 Semiconductor device
11/05/2003EP1359617A1 Process of fabrication of electronic modules
11/05/2003EP1359616A2 Method and apparatus for improving adhesion between layers in integrated devices
11/05/2003EP1359607A2 Adjustable 3D capacitor and method of manufacture
11/05/2003EP1359589A2 Conductor structure for a magnetic memory
11/05/2003EP1359550A1 Regeneration of a secret number by using an identifier of an integrated circuit
11/05/2003EP1358676A2 Screening device for integrated circuits
11/05/2003EP1358675A2 Electronic assembly comprising substrate with embedded capacitors and methods of manufacture
11/05/2003EP1358672A1 Method and apparatus for removing a carrier part from a carrier, and a productremoved from a carrier
11/05/2003EP1358664A2 High power radiation emitter device and heat dissipating package for electronic components
11/05/2003EP1358537A2 Active cooling system for cpu and semiconductors
11/05/2003EP1358489A1 Accelerometer protected by caps applied at the wafer scale
11/05/2003EP1358124A2 Metal-carbon composite powders, methods for producing powders and devices fabricated from same
11/05/2003EP1233372A9 Circuit and method for protecting a chip arrangement against manipulation and/or against abuse
11/05/2003EP1153980B1 Epoxy resin composition
11/05/2003EP0934687B1 Assembly consisting of a substrate for power components and a cooling element and method for the production thereof
11/05/2003EP0895486B1 Grafted thermoplastic elastomer barrier layer
11/05/2003CN2585488Y Multi-functional base pin circuit
11/05/2003CN2585416Y Semiconductor chip and wiring substrate, semiconductor wafer, semiconductor device, wire substrate and electronic machine
11/05/2003CN2585415Y Convenient and high efficiency heat sink
11/05/2003CN2585414Y Heat sink having even temp. channel
11/05/2003CN2585413Y Plate type heat pipe structure
11/05/2003CN2585412Y Honey-comb like heat sink structure
11/05/2003CN2585411Y Radiating wind flow type high efficiency heat sink
11/05/2003CN2585410Y Mechanism for fixing sink components
11/05/2003CN2585409Y Structure of heat sink
11/05/2003CN2585408Y Improved structure of CPU heat sink
11/05/2003CN2585407Y Substrate used for improving stream wire packagnig, and packaging body mfg. therewith
11/05/2003CN2585406Y Conducting wire frame packaging structure
11/05/2003CN2585305Y Circulating liquid/air cooling type heat sink for desk computer CPU
11/05/2003CN1454394A Multiphase low dielectric constant material and method of deposition
11/05/2003CN1454164A Method for marking device using a green laser
11/05/2003CN1453933A System and method for reducing noise of mixed integrated circuit
11/05/2003CN1453875A Semiconductor device with analog capacitor
11/05/2003CN1453871A Chip semiconductor device mixed formed with store and logic circuit and producing method thereof
11/05/2003CN1453870A Semiconductor integrated circuit apparatus and mounting base plate apparatus and wiring cut-off method thereof
11/05/2003CN1453869A 半导体存储器模块 Semiconductor memory module
11/05/2003CN1453868A Multi-chip package and producing method thereof
11/05/2003CN1453867A 树脂密封型半导体器件 Resin-sealed type semiconductor device
11/05/2003CN1453865A Semiconductor device and producing method thereof
11/05/2003CN1453864A Power semiconductor device produced with package in chip size
11/05/2003CN1453863A Connection terminal and producing method thereof, semiconductor device and producing method thereof
11/05/2003CN1453862A Cooling apparatus for semiconductor element
11/05/2003CN1453861A Cooling device with fan equiped at side surface
11/05/2003CN1453860A Electronic circuit apparaus
11/05/2003CN1453859A Mixed integrated circuit apparatus
11/05/2003CN1453858A Semiconductor device and producing method thereof
11/05/2003CN1453849A Virtual pattern automatic generating method
11/05/2003CN1453847A Semiconductor device and producing method thereof, circuit substrate and electronic instrument
11/05/2003CN1453834A Semiconductor device and producing method and electroplating liquid
11/05/2003CN1453791A Conductor structure of magnetic storing device
11/05/2003CN1453676A Electronic apparatus
11/05/2003CN1453638A Method for producing sub-photoetching dimensional line and space pattern of pressing & printing nano-photoetching
11/05/2003CN1453127A Composite film and lead wire frame covered with the same composite film
11/05/2003CN1453126A Composite film and lead wire frame covered with the same composite film
11/05/2003CN1127285C Sealing structure and sealing method for sealing electronic component
11/05/2003CN1127203C Method for producing electronic elements
1 ... 1590 1591 1592 1593 1594 1595 1596 1597 1598 1599 1600 1601 1602 1603 1604 1605 1606 1607 1608 1609 1610 ... 2262