| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/29/2014 | CN103545268A Power device with bottom source electrode and preparation method |
| 01/29/2014 | CN103545267A Semiconductor package and method of manufacturing the same |
| 01/29/2014 | CN103545266A Semiconductor package and method of fabricating the same |
| 01/29/2014 | CN103545265A Semiconductor device and manufacture method thereof |
| 01/29/2014 | CN103545264A Packaging structure with supporting protection structure |
| 01/29/2014 | CN103545263A Integrated circuit package cover plate and assembly method thereof |
| 01/29/2014 | CN103545250A Self-aligned via interconnect using relaxed patterning exposure |
| 01/29/2014 | CN103545226A Wafer-level semiconductor device and method for packaging same |
| 01/29/2014 | CN103545225A Electronic element encapsulation structure and method |
| 01/29/2014 | CN103545223A Method of manufacturing semiconductor device |
| 01/29/2014 | CN103545175A Semiconductor device and manufacturing method of same |
| 01/29/2014 | CN103543568A Electrochromic rearview mirror assembly incorporating a display/signal light |
| 01/29/2014 | CN103543365A Test structure and test method for minimum distances of interconnection structures |
| 01/29/2014 | CN103537793A Manufacturing method of liquid-cooled jacket |
| 01/29/2014 | CN102540725B 正性光敏树脂组合物 A positive photosensitive resin composition |
| 01/29/2014 | CN102437103B Method for manufacturing integrated circuit with partially-redundant through holes and integrated circuit |
| 01/29/2014 | CN102341895B Semiconductor chip and semiconductor device |
| 01/29/2014 | CN102256452B Circuit board with built-in semiconductor chip and method of manufacturing the same |
| 01/29/2014 | CN102194802B Electronic assembly body |
| 01/29/2014 | CN102174299B Circuit-connecting material, and connection structure for circuit member |
| 01/29/2014 | CN102146277B Silicone resin composition and a cured product thereof |
| 01/29/2014 | CN102132638B Mitigation of whiskers in sn-films |
| 01/29/2014 | CN102110673B Wafer level MMCM (microwave multichip module) packaging structure using photosensitive BCB (benzocyclobutene) as dielectric layer and method |
| 01/29/2014 | CN102054812B Device and manufacturing method |
| 01/29/2014 | CN101803010B Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use |
| 01/29/2014 | CN101728389B Method for passively eliminating substrate noise in buck converter |
| 01/28/2014 | US8638589 Operating method for non-volatile memory unit |
| 01/28/2014 | US8638382 Solid-state imaging device and electronic apparatus |
| 01/28/2014 | US8638001 Adhesive sheet for producing semiconductor device |
| 01/28/2014 | US8638000 Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip |
| 01/28/2014 | US8637999 Low-noise flip-chip packages and flip chips thereof |
| 01/28/2014 | US8637998 Semiconductor chip and semiconductor device |
| 01/28/2014 | US8637997 Semiconductor device and method of manufacturing the same |
| 01/28/2014 | US8637996 Perforation patterned electrical interconnects |
| 01/28/2014 | US8637995 Bonded semiconductor structures including two or more processed semiconductor structures carried by a common substrate |
| 01/28/2014 | US8637993 3D integrated circuit system with connecting via structure and method for forming the same |
| 01/28/2014 | US8637992 Flip chip package for DRAM with two underfill materials |
| 01/28/2014 | US8637991 Microelectronic package with terminals on dielectric mass |
| 01/28/2014 | US8637990 Semiconductor device and method for fabricating the same |
| 01/28/2014 | US8637989 Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodes |
| 01/28/2014 | US8637988 Semiconductor device and method of testing the same |
| 01/28/2014 | US8637987 Semiconductor assemblies with multi-level substrates and associated methods of manufacturing |
| 01/28/2014 | US8637986 Semiconductor device and method for manufacturing thereof |
| 01/28/2014 | US8637985 Anti-tamper wrapper interconnect method and a device |
| 01/28/2014 | US8637984 Multi-chip package with pillar connection |
| 01/28/2014 | US8637983 Face-to-face (F2F) hybrid structure for an integrated circuit |
| 01/28/2014 | US8637982 Split loop cut pattern for spacer process |
| 01/28/2014 | US8637981 Dual compartment semiconductor package with temperature sensor |
| 01/28/2014 | US8637980 Adhesive applications using alkali silicate glass for electronics |
| 01/28/2014 | US8637979 Semiconductor device |
| 01/28/2014 | US8637978 System-in-a-package based flash memory card |
| 01/28/2014 | US8637977 Semiconductor device and method of packaging a semiconductor device with a clip |
| 01/28/2014 | US8637976 Semiconductor device with lead terminals having portions thereof extending obliquely |
| 01/28/2014 | US8637975 Semiconductor device having lead wires connecting bonding pads formed on opposite sides of a core region forming a shield area |
| 01/28/2014 | US8637974 Integrated circuit packaging system with tiebar-less design and method of manufacture thereof |
| 01/28/2014 | US8637973 Packaged microelectronic components with terminals exposed through encapsulant |
| 01/28/2014 | US8637972 Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel |
| 01/28/2014 | US8637971 Semiconductor device and method of manufacturing semiconductor device |
| 01/28/2014 | US8637969 Stacked chips in a semiconductor package |
| 01/28/2014 | US8637968 Stacked microelectronic assembly having interposer connecting active chips |
| 01/28/2014 | US8637967 Method for fabricating a semiconductor chip and semiconductor chip |
| 01/28/2014 | US8637966 Semiconductor device |
| 01/28/2014 | US8637965 Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device |
| 01/28/2014 | US8637963 Radiation-shielded semiconductor device |
| 01/28/2014 | US8637961 MEMS actuator device |
| 01/28/2014 | US8637950 Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium |
| 01/28/2014 | US8637937 Through silicon via for use in integrated circuit chips |
| 01/28/2014 | US8637779 Electronic component including micro balls |
| 01/28/2014 | US8637774 Tracer wire connector kits |
| 01/28/2014 | US8637765 Single junction type cigs thin film solar cell and method for manufacturing the thin film solar cell |
| 01/28/2014 | US8637593 Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate |
| 01/28/2014 | US8637400 Interconnect structures and methods for back end of the line integration |
| 01/28/2014 | US8637394 Integrated circuit package system with flex bump |
| 01/28/2014 | US8637349 Method and apparatus for integrated-circuit battery devices |
| 01/28/2014 | US8636912 Package for an electronic device |
| 01/24/2014 | CA2821742A1 Thinned and flexible semiconductor elements on three dimensional surfaces |
| 01/23/2014 | WO2014015316A2 Thermal management of tightly integrated semiconductor device, system and/or package |
| 01/23/2014 | WO2014014066A1 Method for bending semiconductor module terminal |
| 01/23/2014 | WO2014014054A1 Heat dissipation device and semiconductor device |
| 01/23/2014 | WO2014014012A1 Power semiconductor module |
| 01/23/2014 | WO2014013984A1 Light-reflective anisotropic electro-conductive adhesive agent, and light-emitting device |
| 01/23/2014 | WO2014013970A1 Epoxy resin composition for semiconductor encapsulation and method for manufacturing semiconductor device |
| 01/23/2014 | WO2014013941A1 Method for manufacturing semiconductor device |
| 01/23/2014 | WO2014013883A1 Semiconductor device and semiconductor device fabrication method |
| 01/23/2014 | WO2014013780A1 Liquid sealing material and electronic component using same |
| 01/23/2014 | WO2014013711A1 Graphite composite material |
| 01/23/2014 | WO2014013705A1 Semiconductor module |
| 01/23/2014 | WO2014013697A1 Electronic device and method for manufacturing same |
| 01/23/2014 | WO2014013593A1 Heat sink and power conditioner |
| 01/23/2014 | WO2014013581A1 Semiconductor device |
| 01/23/2014 | WO2014013573A1 Heat sink and power conditioner |
| 01/23/2014 | WO2014013339A1 Overcoming multiple reflections in packages and connectors at high speed broadband signal routing |
| 01/23/2014 | WO2014013078A1 Semiconductor die with a through silicon via and manufacturing process of a such via |
| 01/23/2014 | WO2014012490A1 Large sized silicon interposers overcoming the reticle area limitations |
| 01/23/2014 | WO2014012370A1 Chip package and packaging method |
| 01/23/2014 | WO2013173302A8 Soft error resistant circuitry |
| 01/23/2014 | WO2013171084A3 Electric contact structure for semiconductors |
| 01/23/2014 | WO2013154497A4 Cte matched interposer and method of making |
| 01/23/2014 | WO2013153518A3 Hot side management of thermoelectric cooling module |
| 01/23/2014 | WO2013140295A3 Thermal interface material |