Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2003
11/12/2003EP1007308B1 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
11/12/2003CN2586250Y Radiating fin of integrated circuit
11/12/2003CN2586199Y Radiator with earthing function
11/12/2003CN1456037A Heatsink and heatsink device using the heatsink
11/12/2003CN1455961A System for conversion of water into non-oxidizing gases and electronic devices containing said system
11/12/2003CN1455956A Circuit board and production method therefor
11/12/2003CN1455955A Layout and process for a device with segmented ball limited metallurgy for the inputs and outputs
11/12/2003CN1455954A 电子装置 Electronic devices
11/12/2003CN1455953A 电子装置 Electronic devices
11/12/2003CN1455952A Electronics device
11/12/2003CN1455933A Composite particle for dielectrics, ultramicro particulate composite resin particle, composition for forming dielectrics and use thereof
11/12/2003CN1455823A Silver containing copper alloy
11/12/2003CN1455638A Electronic apparatus of display unit with heat radiator of radiation heating component
11/12/2003CN1455458A Semiconductor switch circuit device and making method therefor
11/12/2003CN1455455A Lamina ball grid array package piece of central welding-spot chip and mfg. method thereof
11/12/2003CN1455454A Electrostatic discharge protective circuit structure and manufacturing method thereof
11/12/2003CN1455453A Electrostatic discharge protective circuit structure and manufacturing method thereof
11/12/2003CN1455452A Zero cutting-angle curved-plate micro-heat tube
11/12/2003CN1455308A Pump-free liquid radiating method and apparatus for microelectronic device
11/12/2003CN1455194A Air conditioner radiating plate insulation structure
11/12/2003CN1127768C Semiconductor memory and manufacturing method thereof
11/12/2003CN1127764C wiring part and lead frame with same
11/12/2003CN1127763C Lead frame with pre-mold paddle for semiconductor chip package
11/12/2003CN1127762C Cooling plate
11/12/2003CN1127761C 半导体装置 Semiconductor device
11/12/2003CN1127759C Method for manufacturing semiconductor device
11/11/2003US6647320 Software-based temperature controller circuit in electronic apparatus
11/11/2003US6647311 Coupler array to measure conductor layer misalignment
11/11/2003US6647310 During pre-delivery testing; thermally conductive block
11/11/2003US6646881 Mounting assembly for heat sink
11/11/2003US6646880 Heat sink clip
11/11/2003US6646879 Spray evaporative cooling system and method
11/11/2003US6646875 Axle tube structure for a motor
11/11/2003US6646860 Capacitor and method for fabricating the same
11/11/2003US6646521 Connection for conducting high frequency signal between a circuit and a discrete electric component
11/11/2003US6646520 Integrated circuit interconnect system
11/11/2003US6646518 Balun and semiconductor device including the balun
11/11/2003US6646475 On-chip power supply with optimized electromagnetic compatibility
11/11/2003US6646462 Extraction of drain junction overlap with the gate and the channel length for ultra-small CMOS devices with ultra-thin gate oxides
11/11/2003US6646456 Conductive material for integrated circuit fabrication
11/11/2003US6646357 Semiconductor device and method of production of same
11/11/2003US6646356 Apparatus for providing mechanical support to a column grid array package
11/11/2003US6646353 Semiconductor device having reduced electromigration in copper lines with calcium-doped copper surfaces formed by using a chemical solution
11/11/2003US6646351 Semiconductor device and manufacturing method thereof
11/11/2003US6646350 Semiconductor device
11/11/2003US6646349 Ball grid array semiconductor package
11/11/2003US6646347 Semiconductor power device and method of formation
11/11/2003US6646346 Integrated circuit metallization using a titanium/aluminum alloy
11/11/2003US6646344 Composite material, and manufacturing method and uses of same
11/11/2003US6646343 Matched impedance bonding technique in high-speed integrated circuits
11/11/2003US6646342 Semiconductor chip and multi-chip module
11/11/2003US6646341 Heat sink apparatus utilizing the heat sink shroud to dissipate heat
11/11/2003US6646340 Computer
11/11/2003US6646339 Thin and heat radiant semiconductor package and method for manufacturing
11/11/2003US6646338 Film carrier tape, semiconductor assembly, semiconductor device, and method of manufacturing the same, mounted board, and electronic instrument
11/11/2003US6646336 Wearable silicon chip
11/11/2003US6646335 Electrical properties improved using thin wiring with a substantially symmetric wiring pattern with respect to the semiconductor chip, production is easy, and it is possible to improve heat radiation while being compact
11/11/2003US6646334 Stacked semiconductor package and fabricating method thereof
11/11/2003US6646332 Semiconductor package device
11/11/2003US6646331 Semiconductor device and semiconductor module
11/11/2003US6646330 Lead frame for semiconductor device, process for producing the same and semiconductor device using the same
11/11/2003US6646329 Power chip scale package
11/11/2003US6646328 Chip antenna with a shielding layer
11/11/2003US6646325 Semiconductor device having a step-like section on the back side of the substrate, and method for manufacturing the same
11/11/2003US6646321 Power transistor with internally combined low-pass and band-pass matching stages
11/11/2003US6646312 Semiconductor memory device with bit lines having reduced cross-talk
11/11/2003US6646309 Electrostatic discharge trigger
11/11/2003US6646291 Advanced optical module which enables a surface mount configuration
11/11/2003US6646289 optronic integrally packaged die.
11/11/2003US6646081 Polyarylene compositions with enhanced modulus profiles
11/11/2003US6646064 Reacting epoxy resin with p-containing dihydric phenol or naphthol
11/11/2003US6646063 Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition
11/11/2003US6645883 Vapor deposition using diluent gas
11/11/2003US6645873 Etching silicon oxide doped with fluorine with hydrogen fluoride; forming hollow structures in semiconductor
11/11/2003US6645863 Method of manufacturing semiconductor device and semiconductor device
11/11/2003US6645858 Method of catalyzing copper deposition in a damascene structure by plasma treating the barrier layer and then applying a catalyst such as iodine or iodine compounds to the barrier layer
11/11/2003US6645855 Exposing a connection formed on the wafer front surface, applying a protective layer, such as silicon nitride to the wafer front surface, and chemical mechanical polishing to access the connection again
11/11/2003US6645853 Interconnects with improved barrier layer adhesion
11/11/2003US6645852 Process for fabricating a semiconductor device having recess portion
11/11/2003US6645849 Method for manufacturing semiconductor device for suppressing detachment of conductive layer
11/11/2003US6645848 Method of improving the fabrication of etched semiconductor devices
11/11/2003US6645847 Microelectronic interconnect material with adhesion promotion layer and fabrication method
11/11/2003US6645844 Methods for high density direct connect LOC assembly
11/11/2003US6645842 Semiconductor integrated circuit device, semiconductor integrated circuit wiring method, and cell arranging method
11/11/2003US6645832 Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack
11/11/2003US6645821 Method of producing a thin film resistor in an integrated circuit
11/11/2003US6645810 Method to fabricate MIM capacitor using damascene process
11/11/2003US6645794 Method of manufacturing a semiconductor device by monolithically forming a sealing resin for sealing a chip and a reinforcing frame by transfer molding
11/11/2003US6645792 Lead frame and method for fabricating resin-encapsulated semiconductor device
11/11/2003US6645791 Semiconductor die package including carrier with mask
11/11/2003US6645790 System and method for prototyping and fabricating complex microwave circuits
11/11/2003US6645786 Integrated circuit device having a built-in thermoelectric cooling mechanism
11/11/2003US6645643 For plastic packaging material for microelectronic applications
11/11/2003US6645632 Blend of polyimide and epoxy resin
11/11/2003US6645631 Flame retardant phosphorus element-containing epoxy resin compositions
11/11/2003US6645612 Mixture containing boron nitride powder and surfactant
11/11/2003US6645606 Electrical device having metal pad bonded with metal wiring and manufacturing method thereof
11/11/2003US6645398 Sulfur-containing phosphor powders, methods for making phosphor powders and devices incorporating same
11/11/2003US6644982 Method and apparatus for the transport and tracking of an electronic component
11/11/2003US6644397 Combination sink
1 ... 1588 1589 1590 1591 1592 1593 1594 1595 1596 1597 1598 1599 1600 1601 1602 1603 1604 1605 1606 1607 1608 ... 2262