Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2003
11/13/2003US20030211721 Semiconductor device with a fluorinated silicate glass film as an interlayer metal dielectric film, and manufacturing method thereof
11/13/2003US20030211720 Method of wafer level chip scale packaging
11/13/2003US20030211719 Method of manufacturing a semiconductor device
11/13/2003US20030211717 Semiconductor device with a self-aligned contact and a method of manufacturing the same
11/13/2003US20030211709 Semiconductor wafer and method for manufacturing semiconductor devices
11/13/2003US20030211698 Encapsulated metal structures for semiconductor devices and MIM capacitors including the same
11/13/2003US20030211679 Flip chip interface circuit of a semiconductor memory device and method for interfacing a flip chip
11/13/2003US20030211677 Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials
11/13/2003US20030211676 Stacked local interconnect structure and method of fabricating same
11/13/2003US20030211675 Stacked local interconnect structure and method of fabricating same
11/13/2003US20030211661 Fuse for use in a semiconductor device, and semiconductor devices including the fuse
11/13/2003US20030211660 BOC BGA package for die with I-shaped bond pad layout
11/13/2003US20030211659 BOC BGA package for die with I-shaped bond pad layout
11/13/2003US20030211657 Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same
11/13/2003US20030211656 Method for fabricating multi-chip package semiconductor device
11/13/2003US20030211655 Stacked die module and techniques for forming a stacked die module
11/13/2003US20030211653 Apparatus for providing mechanical support to a column grid array package
11/13/2003US20030211644 Highly moisture-sensitive electronic device element and method for fabrication
11/13/2003US20030211641 Logic and memory elements; high clock speeds
11/13/2003US20030211327 Epoxy resin composition for semiconductor encapsulation, process for producing the same, and semiconductor device
11/13/2003US20030211302 High foaming ratio, thickness
11/13/2003US20030210534 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
11/13/2003US20030210533 Multi-chip package having improved heat spread characteristics and method for manufacturing the same
11/13/2003US20030210531 Method of forming an apparatus to reduce thermal fatigue stress on flip chip solder connections
11/13/2003US20030210528 Fastening device
11/13/2003US20030210526 Connection frame for fan
11/13/2003US20030210525 Side-exhaust heat dissipation module
11/13/2003US20030210524 Computer assembly for facilitating heat dissipation
11/13/2003US20030210121 Silicon-based inductor with varying metal-to-metal conductor spacing
11/13/2003US20030210103 Multi-level conductive lines with reduced pitch
11/13/2003US20030210101 MEMS-based, computer systems, clock generation and oscillator circuits and LC-tank apparatus for use therein
11/13/2003US20030210076 Contact ring architecture
11/13/2003US20030210062 Method of testing semiconductor device
11/13/2003US20030210058 Electrical print resolution test die
11/13/2003US20030209837 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography
11/13/2003US20030209815 Semiconductor device and its manufacturing method
11/13/2003US20030209814 Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials
11/13/2003US20030209813 Semiconductor device and manufacturing method of the same
11/13/2003US20030209812 Method of aligning a wafer and masks
11/13/2003US20030209810 Gold-silver bonding wire for semiconductor device
11/13/2003US20030209809 Power distribution design method for stacked flip-chip packages
11/13/2003US20030209808 Semiconductor device having semiconductor chips mounted on package substrate
11/13/2003US20030209807 Organic substrate for flip chip bonding
11/13/2003US20030209806 Method for manufacturing semiconductor device
11/13/2003US20030209805 Flourine doped SiO2 film and method of fabrication
11/13/2003US20030209804 Structure and method of forming a multiple leadframe semiconductor device
11/13/2003US20030209803 Semiconductor device and display panel module incorporating thereof
11/13/2003US20030209802 Semiconductor device and method for fabricating the same
11/13/2003US20030209801 Reactive solder material
11/13/2003US20030209800 Stacked fin heat sink and method of making
11/13/2003US20030209799 Copper plated PTH barrels and methods for fabricating
11/13/2003US20030209798 Apparatus for providing mechanical support to a column grid array package
11/13/2003US20030209797 Direct alignment of contacts
11/13/2003US20030209795 Semiconductor device package
11/13/2003US20030209793 IC card
11/13/2003US20030209792 Spherical shaped semiconductor device, a flexible printed wiring substrate, and mounting method thereof
11/13/2003US20030209791 Semiconductor structure having stacked semiconductor devices
11/13/2003US20030209790 Semiconductor memory module
11/13/2003US20030209788 Semiconductor device with chamfered substrate and method of making the same
11/13/2003US20030209787 Package for mounting a solid state image sensor
11/13/2003US20030209786 High speed IC package configuration
11/13/2003US20030209785 Semiconductor package having solder joint of improved reliability
11/13/2003US20030209784 Package for integrated circuit with internal matching
11/13/2003US20030209783 Assembly structure for electronic power integrated circuit formed on a semiconductor die and corresponding manufacturing process
11/13/2003US20030209779 Multiple thickness semiconductor interconnect and method therefor
11/13/2003US20030209777 Low stress integrated circuit fusible link
11/13/2003US20030209776 Semiconductor device having an interconnect that electrically connects a conductive material and a doped layer, and a method of manufacture therefor
11/13/2003US20030209775 Methods and structures for metal interconnections in integrated circuits
11/13/2003US20030209772 Integrated circuits; connecting contactor pads; protective coatings
11/13/2003US20030209740 Semiconductor device
11/13/2003US20030209738 Semiconductor device having silicon-including metal wiring layer and its manufacturing method
11/13/2003US20030209734 Fuse structure for semiconductor device
11/13/2003US20030209732 Apparatus for routing signals
11/13/2003US20030209731 Circuit component placement
11/13/2003US20030209730 Leadframe inductors
11/13/2003US20030209727 Semiconductor integrated circuit
11/13/2003US20030209702 Internal hydrogen sources for heat conductive packaging of low dielectric constant semiconductor chips, and method of providing hydrogen therefor
11/13/2003US20030209465 Resin-molded package with cavity structure
11/13/2003US20030209343 Pump system for use in a heat exchange application
11/13/2003US20030209342 Cooler assembly
11/13/2003US20030209341 Heat sink attachment clip
11/13/2003US20030208900 High density multi-layer microcoil and method for fabricating the same
11/12/2003EP1361612A2 Organic substrate for flip chip bonding
11/12/2003EP1361611A2 Ball grid array package with stepped stiffener layer
11/12/2003EP1361610A1 Carburetor, various types of devices using the carburetor, and method of vaporization
11/12/2003EP1361609A2 Housing for potting electrical and electronical components, resulting device and method for the production thereof
11/12/2003EP1361608A2 Providing electrical connection between an active region and a conductive layer in a semiconductor device using carbon nanotubes
11/12/2003EP1361294A1 Plasma CVD apparatus
11/12/2003EP1360882A1 A stackable microcircuit layer formed from a plastic encapsulated microcircuit and method of making the same
11/12/2003EP1360726A2 Semiconductor component comprising ESD protection
11/12/2003EP1360724A2 Method of fabricating integrated circuits, providing improved so-called "saw bow" conductive tracks
11/12/2003EP1360723A2 High performance silicon contact for flip chip
11/12/2003EP1360722A2 Method of manufacturing a semiconductor device and a semiconductor device obtained by means of said method
11/12/2003EP1360721A2 Electronic package having embedded capacitors and method of fabrication therefor
11/12/2003EP1360720A2 Process for the manufacture of printed circuit boards with plated resistors
11/12/2003EP1360719A1 Molds for wafer scale molding of protective caps
11/12/2003EP1360718A2 Integrated circuit arrangement consisting of a flat substrate
11/12/2003EP1360717A1 Lead-free solder structure and method for high fatigue life
11/12/2003EP1360716A2 Bonded structure using reacted borosilicate mixture
11/12/2003EP1360714A1 Wafer scale fiber optic termination
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