Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2003
11/20/2003US20030214026 Enhancement of wire bondability in semiconductor device package
11/20/2003US20030214025 Semiconductor device
11/20/2003US20030214024 Electronic part and its manufacturing method
11/20/2003US20030214023 Semiconductor device having multi-chip package
11/20/2003US20030214022 Bit line landing pad and borderless contact on bit line stud with localized etch stop layer formed in void region, and manufacturing method thereof
11/20/2003US20030214021 Molded integrated circuit package with exposed active area
11/20/2003US20030214020 Embedded package for power semiconductor device
11/20/2003US20030214019 Packaging system for semiconductor devices
11/20/2003US20030214017 Method of manufacturing a semiconductor device
11/20/2003US20030214016 Compact layout for a semiconductor device
11/20/2003US20030214015 Semiconductor device
11/20/2003US20030214014 Semiconductor integrated circuit having anti-fuse, method of fabricating, and method of writing data in the same
11/20/2003US20030214010 Semiconductor device and method of manufacturing the same
11/20/2003US20030214008 Semiconductor integrated circuit with shortened pad pitch
11/20/2003US20030214007 Wafer-level package with bump and method for manufacturing the same
11/20/2003US20030214005 A-C:H ISFET device, manufacturing method, and testing methods and apparatus thereof
11/20/2003US20030214002 Integrated circuit with reverse engineering protection
11/20/2003US20030213999 ESD protection scheme for outputs with resistor loading
11/20/2003US20030213998 Variable resistor structure and method for forming and programming a variable resistor for electronic circuits
11/20/2003US20030213995 Substrate pump ESD protection for silicon-on-insulator technologies
11/20/2003US20030213989 Trench capacitor in a substrate with two floating electrodes independent from the substrate
11/20/2003US20030213985 Ferroelectric capacitor, method of manufacturing same, and semiconductor memory device
11/20/2003US20030213982 Semiconductor memory device and method for manufacturing the same
11/20/2003US20030213981 Semiconductor device, circuit board, and electronic instrument
11/20/2003US20030213980 Semiconductor device
11/20/2003US20030213979 Power semiconductor device
11/20/2003US20030213958 Material for forming insulating film with low dielectric constant, low dielectric insulating film method for forming low dielectric insulating film and semiconductor device
11/20/2003US20030213954 Defective cell remedy method capable of automatically cutting capacitor fuses within the fabrication process
11/20/2003US20030213953 Integrated circuit chips and wafers including on-chip test element group circuits, and methods of fabricating and testing same
11/20/2003US20030213832 Solder ball attaching system and method
11/20/2003US20030213773 Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof
11/20/2003US20030213617 Method and structure of a reducing intra-level and inter-level capacitance of a semiconductor device
11/20/2003US20030213616 Printed wiring board and electronic device using the same
11/20/2003US20030213589 Radiator (1)
11/20/2003US20030213582 Radiator with heat dissipation pieces connected in series
11/20/2003CA2484653A1 Method and apparatus for two dimensional assembly of particles
11/19/2003EP1363331A2 Semiconductor switching circuit device and manufacturing method thereof
11/19/2003EP1363326A2 Heat-dissipating module
11/19/2003EP1363325A1 Member for electronic circuit, method for manufacturing the member, and electronic part
11/19/2003EP1363317A2 Ferroelectric capacitor, method of manufacturing same, and semiconductor memory device
11/19/2003EP1363179A1 Architecture for controlling dissipated power in a system on a chip and related system
11/19/2003EP1362501A1 Electronic device and method of manufacturing the same
11/19/2003EP1362500A1 An electronic device and a circuit arrangement
11/19/2003EP1362489A1 Wireless local loop antenna
11/19/2003EP1362377A2 Multilayer capacitor structure having an array of concentric ring-shaped plates for deep sub-micron cmos
11/19/2003EP1362372A2 Electromigration test structure for determining the reliability of wiring
11/19/2003EP1362371A1 A cooling arrangement for an integrated circuit
11/19/2003EP1362370A2 Electronic device using evaporative micro-cooling and associated methods
11/19/2003EP1362369A2 Electroconductive connection between a chip and a coupling element in addition to a security element, security document and a valuable document containing a connection of said type
11/19/2003EP1362368A2 Method for making electronic devices including silicon and ltcc and devices produced thereby
11/19/2003EP1362364A2 Semiconductor package and method of preparing same
11/19/2003EP1362005A2 Method for forming microelectronic spring structures on a substrate
11/19/2003EP1285104B1 Electrolyte and method for depositing tin-silver alloy layers
11/19/2003EP1224849B1 Electric module structure formed with a polymer shrunk material
11/19/2003EP1016140B1 Method for wiring semi-conductor components in order to prevent product piracy and manipulation, semi-conductor component made according to this method and use of said semi-conductor component in a chip card
11/19/2003CN2587135Y Radiator fastener structure
11/19/2003CN2587129Y Heat radiating device
11/19/2003CN2587085Y Electric connector component
11/19/2003CN2587061Y High heat rejection image sensory element
11/19/2003CN2587014Y Water-cooled heat abstractor
11/19/2003CN2586953Y Radiator fin
11/19/2003CN1457535A 模块和电子装置 Module and electronic apparatus
11/19/2003CN1457513A Enhanced leadless chip carrier
11/19/2003CN1457504A Method of making electronic materials
11/19/2003CN1457450A 显示器装置 Display device
11/19/2003CN1457423A Infrared detection element and method for fabricating the same and equipment for measuring temperature
11/19/2003CN1457220A Active matrix organic electrogenerated luminescent device and manufacturing method thereof
11/19/2003CN1457098A Semiconductor arrangement and producing method thereof
11/19/2003CN1457097A Bidirectional controllable thyristors for electrostatic discharge protection
11/19/2003CN1457096A Electrostatic discharging protection element
11/19/2003CN1457095A Semiconductor device with siliceous metal wiring layer and manufacturing method thereof
11/19/2003CN1457094A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
11/19/2003CN1457093A Potted element for solid camera device
11/19/2003CN1457092A Locked CPU radiator and method thereof
11/19/2003CN1457091A Nailing rack structure of integrated circuit
11/19/2003CN1456959A Semiconductor memory compoent face down chip interface circuit and face down chip interface method
11/19/2003CN1456955A Computer CPU radiator with out electric power
11/19/2003CN1456927A Semiconductor component and display screen module therewith
11/19/2003CN1128475C Semiconductor device
11/19/2003CN1128473C Silicon complementary metal oxide semiconductor body contact on insulator formed by grating
11/19/2003CN1128469C Method for connecting electronic device with flexible circuit carrier and flexible electronic carrier
11/19/2003CN1128467C Method for packaging integrated circuit
11/19/2003CN1128466C Method for forming gate having polyside structure
11/19/2003CN1128396C Heat radiator
11/18/2003US6650576 Semiconductor memory and memory board therewith
11/18/2003US6650559 Power converting device
11/18/2003US6650544 Integrated circuit chip cooling structure with vertical mounting through holes
11/18/2003US6650543 Heat dissipation device
11/18/2003US6650542 Piezoelectric actuated jet impingement cooling
11/18/2003US6650541 Fan-securing device for use with a heat transfer device
11/18/2003US6650538 Fin heat sink and airflow tube assembly employing annular airflows, and methods of fabrication thereof
11/18/2003US6650220 Parallel spiral stacked inductor on semiconductor material
11/18/2003US6650215 Finned heat sinks
11/18/2003US6650129 Method of testing semiconductor device
11/18/2003US6650022 Semiconductor device exhibiting enhanced pattern recognition when illuminated in a machine vision system
11/18/2003US6650021 Recessed bond pad
11/18/2003US6650020 Resin-sealed semiconductor device
11/18/2003US6650017 Electrical wiring of semiconductor device enabling increase in electromigration (EM) lifetime
11/18/2003US6650016 Flip chips
11/18/2003US6650015 Cavity-down ball grid array package with semiconductor chip solder ball