Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2003
11/26/2003EP1365458A1 Barrier layer for an article and method of making said barrier layer by expanding thermal plasma
11/26/2003EP1365451A1 Module component
11/26/2003EP1365450A1 An improved wire-bonded chip on board package
11/26/2003EP1365449A2 Metallic strain-absorbing layer for improved fatigue resistance of solder-attached devices
11/26/2003EP1365444A1 Trench capacitor having two electrodes independent from the substrate
11/26/2003EP1365268A2 Butt joined electronic assembly and module having an electronical standoff
11/26/2003EP1364979A1 Thermosetting resin composition and semiconductor device obtained with the same
11/26/2003EP1364762A1 Release film
11/26/2003EP1364564A2 Cooling device, method for the production thereof, and device for carrying out this method
11/26/2003EP1364416A2 Thermoelectric devices
11/26/2003EP1364406A2 Circuit arrangement
11/26/2003EP1364405A1 High voltage semiconductor device
11/26/2003EP1364404A2 Hollow structure in an integrated circuit and method for producing such a hollow structure in an integrated circuit
11/26/2003EP1364403A2 High-density flip-chip interconnect
11/26/2003EP1364402A2 Power module having improved transient thermal impedance
11/26/2003EP1364401A2 Microelectronic package having bumpless laminated interconnection layer
11/26/2003EP1364399A1 Semiconductor chip and production method for a housing
11/26/2003EP0734586B1 Method for fabricating self-assembling microstructures
11/26/2003CN2588534Y Air filter
11/26/2003CN2588533Y Microelectronic chip heat sink
11/26/2003CN2588532Y Holding fastener
11/26/2003CN2588531Y CPU heat sink
11/26/2003CN2588530Y Computer CPU heat sink
11/26/2003CN2588441Y Pipe type heat sink
11/26/2003CN1459077A Portable electronic device
11/26/2003CN1458815A Metal core base plate and its producing process
11/26/2003CN1458693A Semiconductor storage device and its producing method
11/26/2003CN1458691A Structure and method for forming multiple lead line frame semiconductor device
11/26/2003CN1458690A Static charging seal ring for system static protection
11/26/2003CN1458689A 半导体器件 Semiconductor devices
11/26/2003CN1458688A Electronic module
11/26/2003CN1458687A Semiconductor element cooler and its control method
11/26/2003CN1458686A Copper radiator and its producing process
11/26/2003CN1458678A Integrated circuit chip and wafer and its producing and detecting method
11/26/2003CN1458216A Sealing wax for electronic element coil
11/26/2003CN1129187C Method for producing blowable fuses on integrated circuit
11/26/2003CN1129186C LOC semiconductor package and fabricating method thereof
11/26/2003CN1129185C Semiconductor device, semiconductor equipment, and method for mfg. same
11/26/2003CN1129184C Lead frame for semiconductor device
11/26/2003CN1129183C 半导体装置 Semiconductor device
11/26/2003CN1129180C Semiconductor device and manufacturing method of same
11/25/2003US6654257 Noise protection sheet
11/25/2003US6654254 Printed circuit board assembly having retention module and back plate
11/25/2003US6654248 Top gated heat dissipation
11/25/2003US6654247 Computer heat dissipating structure
11/25/2003US6654246 Heat sink assembly with fixing members
11/25/2003US6654242 Electronic apparatus with built-in CPU
11/25/2003US6654108 Test structure for metal CMP process control
11/25/2003US6653916 Microwave monolithic integrated circuit (MMIC) carrier interface
11/25/2003US6653857 Increasing implicit decoupling capacitance using asymmetric shieldings
11/25/2003US6653852 Wafer integrated plasma probe assembly array
11/25/2003US6653741 Thermal interface material and heat sink configuration
11/25/2003US6653740 Vertical conduction flip-chip device with bump contacts on single surface
11/25/2003US6653739 Semiconductor device
11/25/2003US6653738 Semiconductor device
11/25/2003US6653737 Interconnection structure and method for fabricating same
11/25/2003US6653736 Multilayer flexible wiring boards
11/25/2003US6653732 Electronic component having a semiconductor chip
11/25/2003US6653731 Semiconductor device and method for fabricating same
11/25/2003US6653730 Electronic assembly with high capacity thermal interface
11/25/2003US6653729 Semiconductor device and test method for manufacturing same
11/25/2003US6653727 Semiconductor chip package with direction-flexible mountability
11/25/2003US6653726 Power redistribution bus for a wire bonded integrated circuit
11/25/2003US6653725 Chip package and method of manufacturing the same
11/25/2003US6653724 Chip on board package for optical mice and lens cover for the same
11/25/2003US6653723 System for providing an open-cavity low profile encapsulated semiconductor package
11/25/2003US6653721 LOC semiconductor assembled with room temperature adhesive
11/25/2003US6653720 Semiconductor electronic parts
11/25/2003US6653719 Controlling gas flow; plasma polymerization
11/25/2003US6653718 Dielectric films for narrow gap-fill applications
11/25/2003US6653717 Enhancement in throughput and planarity during CMP using a dielectric stack containing an HDP oxide
11/25/2003US6653710 Fuse structure with thermal and crack-stop protection
11/25/2003US6653691 Devices having plurality of field effect transistor unit cells which utilize Faraday shield layers to reduce parasitic gate-to-drain capacitance and concomitantly improve high frequency switching performance
11/25/2003US6653690 Semiconductor device comprising high density integrated circuit having a large number of insulated gate field effect transistors
11/25/2003US6653681 Additional capacitance for MIM capacitors with no additional processing
11/25/2003US6653672 Semiconductor die pad placement and wire bond
11/25/2003US6653671 Semiconductor device
11/25/2003US6653661 Chip-type LED and process of manufacturing the same
11/25/2003US6653655 Integrated semiconductor device including high-voltage interconnections passing through low-voltage regions
11/25/2003US6653575 Electronic package with stacked connections and method for making same
11/25/2003US6653574 Multi-layered substrate with a built-in capacitor design and a method of making the same
11/25/2003US6653564 Conductor strip arrangement for a molded electronic component and process for molding
11/25/2003US6653563 Alternate bump metallurgy bars for power and ground routing
11/25/2003US6653236 Methods of forming metal-containing films over surfaces of semiconductor substrates; and semiconductor constructions
11/25/2003US6653235 Fabricating process for forming multi-layered metal bumps by electroless plating
11/25/2003US6653229 Integrated circuit with a recessed conductive layer
11/25/2003US6653222 Plasma enhanced liner
11/25/2003US6653220 Advance metallization process
11/25/2003US6653218 Method of fabricating resin-encapsulated semiconductor device
11/25/2003US6653214 Measured via-hole etching
11/25/2003US6653208 Wafer on wafer packaging and method of fabrication for full-wafer burn-in and testing
11/25/2003US6653193 Resistance variable device
11/25/2003US6653173 Method and apparatus for packaging a microelectronic die
11/25/2003US6653172 Methods for providing void-free layers for semiconductor assemblies
11/25/2003US6653171 Flip-chip type semiconductor device having split voids within under-fill layer and its manufacturing method
11/25/2003US6653170 Semiconductor chip assembly with elongated wire ball bonded to chip and electrolessly plated to support circuit
11/25/2003US6653169 Packaged semiconductor and process for manufacturing the same
11/25/2003US6653168 LSI package and internal connecting method used therefor
11/25/2003US6653167 Facilitating heat transfer from an integrated circuit package
11/25/2003US6652958 Graphitized carbon fibers obtained by spinning, infusibilizing, carbonizing, pulverizing, then graphitizing mesophase pitch; for use in development of semiconductors, electronics, power/light sources
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