Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2003
11/27/2003WO2003098682A1 Semiconductor package and method of preparing same
11/27/2003WO2003098672A1 Deposition method of insulating layers having low dielectric constant of semiconductor device
11/27/2003WO2003098666A2 High-frequency power semiconductor module with a hollow housing and method for the production thereof
11/27/2003WO2003098641A1 Wiring material and wiring board using the same
11/27/2003WO2003098541A1 Fingerprint sensor having enhanced esd protection and associated methods
11/27/2003WO2003098415A1 A liquid cooling device for a notebook computer
11/27/2003WO2003098141A1 Vapor augmented heatsink with multi-wick structure
11/27/2003WO2003097557A1 Method for producing a ceramic-copper composite substrate
11/27/2003WO2003097527A1 Particulate aluminum nitride and method for production thereof
11/27/2003WO2003097290A1 Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein
11/27/2003WO2003073473A3 High frequency device packages and methods
11/27/2003WO2003071601A3 Circuit module and method for the production thereof
11/27/2003WO2003052820A3 Clamping device
11/27/2003WO2003052819A3 Apparatus and method for augmented cooling of computers
11/27/2003WO2003046984A3 Electromagnetic shield
11/27/2003WO2003030608A9 Cooling system having independent fan location
11/27/2003WO2003025243A3 Metal nitride deposition by ald using gettering reactant
11/27/2003WO2003021679A3 Integrated circuit structure and a method of making an integrated circuit structure
11/27/2003WO2003017324A3 Structure and method for fabrication of a leadless chip carrier with embedded inductor
11/27/2003WO2003012860A3 Boron-doped titanium nitride layer for high aspect ratio semiconductor devices
11/27/2003WO2003003122A3 Method of measuring critical dimension and overlay in single step
11/27/2003WO2002091450A3 Ordered two-phase dielectric film, and semiconductor device containing the same
11/27/2003WO2002080271A3 Fluxless flip chip interconnection
11/27/2003US20030221178 Active trace rerouting
11/27/2003US20030220706 Wafer map host system
11/27/2003US20030220455 Heat resistant resin composition and adhesive film
11/27/2003US20030220012 Compliant component for supporting electrical interface component
11/27/2003US20030220007 Electrical connector with distortion-resistant cover
11/27/2003US20030219987 Method of protecting a passivation layer during solder bump formation
11/27/2003US20030219976 Using stabilizers in electroless solutions to inhibit plating of fuses
11/27/2003US20030219974 Method for manufacturing semiconductor device
11/27/2003US20030219969 Semiconductor device and manufacturing method thereof
11/27/2003US20030219967 Semiconductor device with elongated interconnecting member and fabrication method thereof
11/27/2003US20030219966 Small pitch torch bump for mounting high-performance flip-chip
11/27/2003US20030219957 High quality and yield; does not generate particles even when heat treated
11/27/2003US20030219929 Laser-assisted silicide fuse programming
11/27/2003US20030219928 Substrate identification circuit and semiconductor device
11/27/2003US20030219927 Solder balls and conductive wires for a semiconductor package, and an improved manufacturing method, and evaporation method therefor
11/27/2003US20030219926 Semiconductor device and method of manufacturing the same, and electronic instrument
11/27/2003US20030219925 Chip package structure having filter
11/27/2003US20030219632 Electrical and electronic apparatus comprising substrates having oxygen and water vapor impervious multilayers
11/27/2003US20030219626 Creating an improved surface that serves as a base or underlayer, planarization layer, read layer, write layer and encapsulation material for use in generic devices that require superior heat dissipation, mechanical hardness and surface
11/27/2003US20030219623 Solder joints with low consumption rate of nickel layer
11/27/2003US20030219619 Thermosetting resin composition and semiconductor device obtained with the same
11/27/2003US20030219604 Three-layer structure consisting of a layer A, a layer B and a layer C laminated in this order, wherein the layer A comprises a fluororesin having a melting point higher than the press molding temperature of a product to be molded, the
11/27/2003US20030219588 Dielectric film for printed wiring board, multilayer printed board, and semiconductor device
11/27/2003US20030219126 Method for scrambling the current consumption of an integrated circuit
11/27/2003US20030218871 Accuracy during temperature variations; laminate of dielectric and metal wire; controlling expansion
11/27/2003US20030218870 Low temperature co-fired ceramic with improved shrinkage control
11/27/2003US20030218868 Multi-chip module
11/27/2003US20030218866 Heat sink clip with pressing cam
11/27/2003US20030218865 Semiconductor thermal management system
11/27/2003US20030218864 Radiation apparatus
11/27/2003US20030218851 Voltage variable material for direct application and devices employing same
11/27/2003US20030218850 Electronics device unit
11/27/2003US20030218849 Tower type heat sink
11/27/2003US20030218475 Circuit configuration and method for detecting an unwanted attack on an integrated circuit
11/27/2003US20030218263 Electronic component with a semiconductor chip, method of producing an electronic component and a panel with a plurality of electronic components
11/27/2003US20030218262 Semiconductor device and its manufacturing method
11/27/2003US20030218261 Integrated circuit coated with thermosetting polymer, with hardened adhesive polymer underfill encapsulant including intermixed reaction product of thermosetting polymer and fluxing agent that chemically immobilizes flux and by-products
11/27/2003US20030218260 Semiconductor device and its manufacturing method, a circuit board and an electronic device
11/27/2003US20030218259 Bond pad support structure for a semiconductor device
11/27/2003US20030218258 Curable thermosetting adhesive
11/27/2003US20030218257 Semiconductor element, semiconductor device, and method for manufacturing semiconductor element
11/27/2003US20030218256 Semiconductor device barrier layer
11/27/2003US20030218255 Semiconductor integrated circuit device with test element group circuit
11/27/2003US20030218254 Forming annular groove in dielectric; filling with photoresist; high density, miniaturization
11/27/2003US20030218251 Image sensor module and method of fabricating the same
11/27/2003US20030218250 Method for high layout density integrated circuit package substrate
11/27/2003US20030218249 High-density integrated circuit package and method for the same
11/27/2003US20030218248 Semiconductor integrated circuit device
11/27/2003US20030218247 Semiconductor device and method for fabricating the same
11/27/2003US20030218246 Semiconductor device passing large electric current
11/27/2003US20030218245 Semiconductor device and a method of manufacturing the same
11/27/2003US20030218244 Miniaturized contact spring
11/27/2003US20030218243 Solder pads for improving reliability of a package
11/27/2003US20030218241 Semiconductor device
11/27/2003US20030218240 Ceramic package with radiating lid
11/27/2003US20030218238 Semiconductor device and electronic device
11/27/2003US20030218237 Apparatus and method for molding a semiconductor die package with enhanced thermal conductivity
11/27/2003US20030218235 Surface mount solder method and apparatus for decoupling capacitance and process of making
11/27/2003US20030218234 Programmable latch using antifuses
11/27/2003US20030218233 Surface-mounting type of electronic circuit unit suitable for miniaturization and a method for fabricating the unit
11/27/2003US20030218230 Semiconductor device and manufacturing method therefor
11/27/2003US20030218216 Semiconductor memory module
11/27/2003US20030218191 Vertical electrical interconnections in a stack
11/27/2003US20030218188 Lateral DMOS transistor having reduced surface field
11/27/2003US20030218182 Strees-controlled dielectric integrated circuit
11/27/2003US20030218178 Thin film transistor array panel for liquid crystal display
11/27/2003US20030218168 Semiconductor substrate and test pattern for the same
11/27/2003US20030218167 Carrier module for mu-BGA type device
11/27/2003US20030218055 Integrated circuit packages without solder mask and method for the same
11/27/2003US20030217858 Packaging structure with low switching noises
11/27/2003US20030217837 Heat transfer device
11/27/2003US20030217836 Riveted bond structure for heat sink
11/27/2003US20030217835 CPU heat sink fastener
11/27/2003US20030217462 Method for improving electromigration performance of metallization features through multiple depositions of binary alloys
11/27/2003DE20315169U1 Wärmeabführplatten-Modul Wärmeabführplatten module
11/27/2003DE20311701U1 Cooling system for e.g. personal computer, uses flowing water to absorb heat and emit heat via radiator inside computer casing
11/27/2003CA2473851A1 Encryption, authentication, and key management for multimedia content pre-encryption
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