Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2003
12/02/2003US6657860 Heat dissipating device and computer
12/02/2003US6657835 ESD protection circuit for mixed-voltage I/O by using stacked NMOS transistors with substrate triggering technique
12/02/2003US6657761 Optical scanning device, image forming apparatus, and optical scanning method
12/02/2003US6657735 Method of evaluating critical locations on a semiconductor apparatus pattern
12/02/2003US6657696 Flexible substrate, electro-optical device and electronic equipment
12/02/2003US6657656 Mount inspection apparatus
12/02/2003US6657542 Electronic device and method of manufacture the same
12/02/2003US6657523 Stacked radio-frequency module
12/02/2003US6657484 System and method for decoupling capacitance for an integrated circuit chip
12/02/2003US6657377 Cylindrical electrical component having two electrodes on bottom face
12/02/2003US6657318 Semiconductor integrated circuit device and method for mounting circuit blocks in semiconductor integrated circuit device
12/02/2003US6657313 Dielectric interposer for chip to substrate soldering
12/02/2003US6657312 Semiconductor device in which bump used for fixing potential of silicon substrate can be easily formed
12/02/2003US6657311 Heat dissipating flip-chip ball grid array
12/02/2003US6657310 Top layers of metal for high performance IC's
12/02/2003US6657309 Semiconductor chip and semiconductor device of chip-on-chip structure
12/02/2003US6657307 Semiconductor integrated circuit having functional macro with improved power line connection structure
12/02/2003US6657306 Paste including a mixture of powders, connection plug, burying method, and semiconductor device manufacturing method
12/02/2003US6657305 Semiconductor recessed mask interconnect technology
12/02/2003US6657303 Integrated circuit with low solubility metal-conductor interconnect cap
12/02/2003US6657302 Integration of low dielectric material in semiconductor circuit structures
12/02/2003US6657301 Contact structure, method of forming the same, semiconductor device, and method of manufacturing the same
12/02/2003US6657299 Semiconductor with a stress reduction layer and manufacturing method therefor
12/02/2003US6657298 Integrated circuit chip package having an internal lead
12/02/2003US6657297 Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads
12/02/2003US6657296 Semicondctor package
12/02/2003US6657295 Multilayer interconnect board and multilayer semiconductor device
12/02/2003US6657293 Chip scale package in which layout of wiring lines is improved
12/02/2003US6657292 Package board for multiple-pin ball grid array package, multiple-pin ball grid array package, and semiconductor device
12/02/2003US6657291 Combined resistor-capacitor elements for decoupling in electronic packages
12/02/2003US6657290 Semiconductor device having insulation layer and adhesion layer between chip lamination
12/02/2003US6657289 Apparatus relating to block configurations and fluidic self-assembly processes
12/02/2003US6657288 Compression layer on the lead frame to reduce stress defects
12/02/2003US6657287 Leadframe assembly
12/02/2003US6657286 Microelectronic assembly formation with lead displacement
12/02/2003US6657285 Semiconductor anti-interference band for integrated circuit
12/02/2003US6657284 Graded dielectric layer and method for fabrication thereof
12/02/2003US6657283 Reducing relative stress between HDP layer and passivation layer
12/02/2003US6657282 Electrical and electronic apparatus comprising flip chips in pattern layouts having thermosetting resins such as polyimides or epoxy resins as seals or covering for stress relieving or shockproofing; packaging
12/02/2003US6657280 Redundant interconnect high current bipolar device
12/02/2003US6657278 Diverse band gap energy level semiconductor device
12/02/2003US6657277 Method for forming antifuse via structure
12/02/2003US6657275 Pad and via placement design for land side capacitors
12/02/2003US6657266 Semiconductor switching device
12/02/2003US6657247 Semiconductor device with MIM capacitance element
12/02/2003US6657246 MRAM with an effective noise countermeasure
12/02/2003US6657245 Resin-encapsulated semiconductor apparatus and process for its fabrication
12/02/2003US6657134 Stacked ball grid array
12/02/2003US6657131 I/C package / thermal-solution retention mechanism with spring effect
12/02/2003US6657130 Electrical and physical design integration method and apparatus for providing interconnections on first level ceramic chip carrier packages
12/02/2003US6657124 Advanced electronic package
12/02/2003US6657031 Curable; polyepoxide reworkable through thermal decomposition; printed circuits, semiconductors
12/02/2003US6656996 Contains a filler of spherical fused silica having a maximum particle size of not larger than 45 mu m and may contain metal impurities having a particle size of not larger than 53 mu m.
12/02/2003US6656855 Deposition method of dielectric films having a low dielectric constant
12/02/2003US6656834 Method of selectively alloying interconnect regions by deposition process
12/02/2003US6656833 Method of DRAM
12/02/2003US6656829 Semiconductor integrated circuit device and manufacturing method of that
12/02/2003US6656827 Electrical performance enhanced wafer level chip scale package with ground
12/02/2003US6656826 Semiconductor device with fuse to be blown with energy beam and method of manufacturing the semiconductor device
12/02/2003US6656825 Semiconductor device having an improved local interconnect structure and a method for forming such a device
12/02/2003US6656822 Method for reduced capacitance interconnect system using gaseous implants into the ILD
12/02/2003US6656819 Process for producing semiconductor device
12/02/2003US6656815 Process for implanting a deep subcollector with self-aligned photo registration marks
12/02/2003US6656814 Methods of fabricating integrated circuit devices including distributed and isolated dummy conductive regions
12/02/2003US6656773 Transfer molding of integrated circuit packages
12/02/2003US6656772 Method for bonding inner leads to bond pads without bumps and structures formed
12/02/2003US6656771 Semiconductor device, method of connecting a semiconductor chip, circuit board, and electronic equipment
12/02/2003US6656770 Thermal enhancement approach using solder compositions in the liquid state
12/02/2003US6656766 Semiconductor device having chip scale package
12/02/2003US6656765 Fabricating very thin chip size semiconductor packages
12/02/2003US6656758 Method of manufacturing a chip size package
12/02/2003US6656754 Method of forming a semiconductor chip carrier
12/02/2003US6656753 Method and structure for measuring bridge induced by mask layout amendment
12/02/2003US6656752 Ion current density measuring method and instrument, and semiconductor device manufacturing method
12/02/2003US6656750 Method for testing chips on flat solder bumps
12/02/2003US6656693 Self assembled nano-devices using DNA
12/02/2003US6656647 Method for examining structures on a wafer
12/02/2003US6656609 Electroluminescence
12/02/2003US6656422 For fixing silicon chips; tin, gold, and germanium
12/02/2003US6656389 Combination of thermally conducting solid filler, dispersant and linear alkylbenzene carrier; applied to an electronic component to increase the cooling of the component
12/02/2003US6656275 Partial plating system
12/02/2003US6655974 Semiconductor device-socket
12/02/2003US6655450 Forced oscillatory flow type heat pipe and designing method for the same
12/02/2003US6655449 Heat dissipation device by liquid cooling
12/02/2003US6655448 Radiator with heat dissipation pieces connected in series
12/02/2003US6655023 Method and apparatus for burning-in semiconductor devices in wafer form
12/02/2003US6655022 Packaging integrated circuit using micro ball grid array techniques
12/02/2003US6655020 Method of packaging a high performance chip
12/02/2003CA2293110C Conductive elastomer interconnect
12/02/2003CA2241402C Heat dissipator including coolant passage and method of fabricating the same
11/2003
11/27/2003WO2003098983A1 Printed wiring board
11/27/2003WO2003098867A2 Encryption, authentication, and key management for multimedia content pre-encryption
11/27/2003WO2003098709A1 Semiconductor device using semiconductor chip
11/27/2003WO2003098706A2 Method for fixing a semiconductor chip in a plastic housing body, optoelectronic semiconductor component
11/27/2003WO2003098692A1 Integrated circuit with reverse engineering protection
11/27/2003WO2003098689A1 High-frequency range to housing
11/27/2003WO2003098688A2 Structural design of under bump metallurgy for high reliability bumped packages
11/27/2003WO2003098687A1 Semiconductor device and its manufacturing method
11/27/2003WO2003098686A1 Cooling devices for cooling electric components, module consisting of a cooling device and electric components and assembly comprising a cooling device or module and a support
11/27/2003WO2003098683A1 System for aligning wafers and for reading micro bar-codes and marks on chips using laser
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