Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2003
12/04/2003US20030222331 Leadframe-based semiconductor package for multi-media card
12/04/2003US20030222330 Passivation processing over a memory link
12/04/2003US20030222326 Terminal, semiconductor device, terminal forming method and flip chip semiconductor device manufactrring method
12/04/2003US20030222324 Laser systems for passivation or link processing with a set of laser pulses
12/04/2003US20030222314 High capacitance package substrate
12/04/2003US20030222302 Nonvolatile semiconductor memory device
12/04/2003US20030222295 High performance system-on-chip inductor using post passivation process
12/04/2003US20030222288 Apparatus and method for providing low-loss transmission lines in interconnected mesh plane systems
12/04/2003US20030222286 Semiconductor device
12/04/2003US20030222284 Wiring structure on a semiconducting substrate
12/04/2003US20030222282 Direct-connect signaling system
12/04/2003US20030222281 Semiconductor device and a method of manufacturing the same
12/04/2003US20030222274 Semiconductor integrated circuit device
12/04/2003US20030222260 Monitor pattern of semiconductor device and method of manufacturing semiconductor device
12/04/2003US20030222249 Thermally or electrically-conductive form-in-place gap filter
12/04/2003US20030221969 Copper sulfate plating bath is used which contains a polyether containing at least five ether oxygen atoms in molecule, and a compound represented by formula of R1-S-(CH2O)n-R2-SO3M (wherein, R1 is a hydrogen atom, -(S)n-(CH2O)n-R2-SO3M, or
12/04/2003US20030221816 Finned heat sink
12/04/2003US20030221815 Hydronic pump type heat radiator
12/04/2003US20030221814 Apparatus having forced fluid cooling and pin-fin heat sink
12/04/2003US20030221813 Heat sink assembly
12/04/2003US20030221812 Three-phase heat transfer structure
12/04/2003US20030221313 Method for making stacked integrated circuits (ICs) using prepackaged parts
12/04/2003DE4345303C2 Zuführungsdraht-Rahmen zur Verwendung bei der Herstellung einer Halbleitervorrichtung mit LOC-Struktur und Verfahren zur Herstellung einer Halbleitervorrichtung mit LOC-Struktur A lead wire frame for use in the manufacture of a semiconductor device having the LOC structure and method of manufacturing a semiconductor device having the LOC structure
12/04/2003DE20311052U1 Luftführung für eine Wärmesenke Air duct for a heat sink
12/04/2003DE10224155C1 Sensor unit has individual sensors embedded in input surface connected in sensor groups via conductor path structure on underside of input surface
12/04/2003CA2486209A1 Control arrangement for heating devices
12/04/2003CA2485185A1 Method for producing a component comprising a conductor structure that is suitable for use at high frequencies
12/04/2003CA2484794A1 Glass material for use at high frequencies
12/04/2003CA2483297A1 Compliant component for supporting electrical interface component
12/03/2003EP1367871A2 Wiring forming system and wiring forming method for forming wiring on wiring board
12/03/2003EP1367668A1 Broadband microstrip to waveguide transition on a multilayer printed circuit board
12/03/2003EP1367645A2 Semiconductor device and manufacturing method thereof
12/03/2003EP1367644A1 Semiconductor electronic device and method of manufacturing thereof
12/03/2003EP1367643A2 Electronic module
12/03/2003EP1367642A2 Semiconductor device having a heat spreader exposed from a seal resin
12/03/2003EP1367641A1 Heat radiator
12/03/2003EP1367640A2 System and methods for removing heat from opto-electronic components
12/03/2003EP1366860A1 Non-destructive method for measuring the thickness of a bonded wafer
12/03/2003EP1366539A1 Coupling device using buried capacitors in multilayered substrate
12/03/2003EP1366526A1 An rf power ldmos transistor
12/03/2003EP1366522A2 Conductor track arrangement and method for producing a conductor track arrangement
12/03/2003EP1366521A2 Method of manufacturing a semiconductor device and a support plate, and a semiconductor device obtained by means of said method
12/03/2003EP1366520A1 Heat dissipation device
12/03/2003EP1366519A2 Cooling device
12/03/2003EP1366518A1 In-situ cap and method of fabricating same for an integrated circuit device
12/03/2003EP1366515A2 Semiconductor wafer with process control modules
12/03/2003EP1366513A1 Method for multilevel copper interconnects for ultra large scale integration
12/03/2003EP1366512A1 A common ball-limiting metallurgy for i/o sites
12/03/2003EP1366510A2 Ruthenium silicide wet etch
12/03/2003EP1366328A1 Improved efficiency thermoelectrics utilizing thermal isolation
12/03/2003EP1181125B1 Pipe preparing tool
12/03/2003EP1004630B1 Semiconductor sealing epoxy resin composition and semiconductor device using the same
12/03/2003EP0963603B1 Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections
12/03/2003EP0888708B1 Fan attachment clip for heat sink
12/03/2003CN2590177Y Thin-type flat heat pipe radiator
12/03/2003CN2590176Y Fin of radiating equipment having heat conductive tube
12/03/2003CN2590175Y Laminated heat radiating device
12/03/2003CN2590174Y Radiator structure having increased radiating area
12/03/2003CN2590173Y Radiator fin
12/03/2003CN2590172Y Radiator fin
12/03/2003CN2590171Y High radiating efficiency radiator
12/03/2003CN2590170Y Radiator structure
12/03/2003CN2590169Y Even heating multiple chip electronic component packaging assembly
12/03/2003CN2589490Y Pitch adjustable galvanizing cup of anode, cathode and even flow plate in disk stage packaging
12/03/2003CN1460397A High-frequency module
12/03/2003CN1460312A Demountable clamping for land grid array connectors
12/03/2003CN1460308A 微波电路 Microwave Circuits
12/03/2003CN1460293A Radiation type BGA package and production method therefor
12/03/2003CN1460292A Package for electronic part and method of mfg. package
12/03/2003CN1460291A Chip module with bond-wire connections with small loop height
12/03/2003CN1460273A Composite electronic components
12/03/2003CN1460203A Circuit arrangement and method for detecting undesired attack on integrated circuit
12/03/2003CN1460120A Extrudable bridged grease-like heat radiating material, container sealingly filled with material, method of mfg. container, and method of radiating heat by use thereof
12/03/2003CN1460000A Patterning process of circuit base board
12/03/2003CN1459872A Semiconductor integrating device and mfg. method thereof
12/03/2003CN1459857A 半导体器件 Semiconductor devices
12/03/2003CN1459856A Semiconductor IC apparatus
12/03/2003CN1459855A Semiconductor device and mfg. method thereof
12/03/2003CN1459854A Welding spot structure for increasing packing reliability
12/03/2003CN1459853A Radiator fin, heat pipe, platter metal integrated radiator
12/03/2003CN1459852A Crystal wafer assembling structure
12/03/2003CN1459844A Method for forming double Damascus interconnecting by using low-K dielectric material
12/03/2003CN1459842A Virtual pattern on integrated circuit
12/03/2003CN1459838A Loading plate manufacturing process for packaging using stacking type photoresist image transfer
12/03/2003CN1459831A Metal fuse structure of semiconductor assembly part and its manufacturing method
12/03/2003CN1459808A Plated terminals
12/03/2003CN1459469A Thermosetting resin composition and semiconductor device obtained therefrom
12/03/2003CN1459405A Stripping film
12/03/2003CN1459338A Method and equipment for quantitatively distributing adhesion agent onto heat radiator fin, and positioning adhesion therefor
12/03/2003CN1129991C Socket for pin grid array component and actuating mechanism thereof
12/03/2003CN1129964C Solid state pickup device excellent in heat resistance and method of manufacturing the device
12/03/2003CN1129957C Method for manufacturing semiconductor devices having dual damascene structure
12/03/2003CN1129826C Semiconductor circuit, particularly for use in integrated module
12/02/2003US6658243 High frequency power amplifying apparatus having amplifying stages with gain control signals of lower amplitudes applied to earlier preceding stages
12/02/2003US6657910 Semiconductor device having internal power terminals including a positive power terminal and a negative power terminal
12/02/2003US6657901 Semiconductor device formed in a rectangle region on a semiconductor substrate including a voltage generating circuit
12/02/2003US6657870 Die power distribution system
12/02/2003US6657865 Heat dissipating structure
12/02/2003US6657864 High density thermal solution for direct attach modules
12/02/2003US6657862 Radial folded fin heat sinks and methods of making and using same
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