| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/30/2014 | US20140026676 Detecting anomalous weak beol sites in a metallization system |
| 01/30/2014 | US20140026653 Radiation-Blocking Structures |
| 01/30/2014 | DE202013105654U1 Multichip-Gehäusestruktur Multi-chip package structure |
| 01/30/2014 | DE112012001924T5 Elektronische Steuergerät-Baugruppe und Fahrzeug mit derselben Electronic control unit module and car with the same |
| 01/30/2014 | DE102013214915A1 Verdrahtungseinrichtung zum Verdrahten einer elektronischen Vorrichtung Wiring device for wiring an electronic device |
| 01/30/2014 | DE102013214649A1 Halbleiterbauelement und verfahren zur herstellung eines halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device |
| 01/30/2014 | DE102013108148A1 Elektrische Vorrichtungspackung mit einem Laminat und Verfahren zur Herstellung einer elektrischen Vorrichtungspackung mit einem Laminat An electrical device package having a laminate and process for the preparation of an electrical device package having a laminate |
| 01/30/2014 | DE102013107784A1 Herstellung von Haftstrukturen in dielektrischen Schichten unter Nutzung von Photoprozesstechnologie und Haftstrukturen einschließende Bauelemente Production of adhesive structures in dielectric layers with the use of Photo Process Technology and adhesive structures enclosing components |
| 01/30/2014 | DE102013107761A1 Halbleitervorrichtung mit einer Diode und Verfahren zum Herstellen einer Halbleitervorrichtung A semiconductor device comprising a diode and method of manufacturing a semiconductor device |
| 01/30/2014 | DE102013107591A1 Wafer und Chips mit Teststrukturen Wafers and chips with test structures |
| 01/30/2014 | DE102012213077A1 Verfahren zum Kontaktieren eines Halbleitermaterials mit einer Kontaktlage A method for contacting a semiconductor material with a contact position |
| 01/30/2014 | DE102012211952A1 Leistungshalbleitermodul mit mindestens einem stressreduzierenden Anpasselement Power semiconductor module with at least one stress reducing matching element |
| 01/30/2014 | DE102012014813A1 Component for refrigeration of e.g. electronic element used in e.g. power electronics field, has first component portion that is provided with larger area than carrier element of second component portion |
| 01/30/2014 | DE102007009731B4 Steuerschaltung für eine Halbleitervorrichtung mit Überhitzungsschutzfunktion Control circuit for a semiconductor device having overheating protection function |
| 01/30/2014 | DE102005046973B4 Struktur und Verfahren zum gleichzeitigen Bestimmen einer Überlagerungsgenauigkeit und eines Musteranordnungsfehlers Structure and method for simultaneously determining an overlay accuracy and a pattern arrangement error |
| 01/30/2014 | CA2822132A1 Semiconductor device and method for reduced bias temperature instability (bti) in silicon carbide devices |
| 01/29/2014 | EP2690941A1 Wiring substrate |
| 01/29/2014 | EP2690938A1 Method for forming copper wiring, method for manufacturing wiring substrate, and wiring substrate |
| 01/29/2014 | EP2690937A1 Method for forming copper wiring, method for manufacturing wiring substrate, and wiring substrate |
| 01/29/2014 | EP2690658A1 Power semiconductor module and power unit device |
| 01/29/2014 | EP2690657A2 Robust fuse-protected transistor |
| 01/29/2014 | EP2690656A1 Power device insulating heat radiation structure, circuit board and power supply equipment |
| 01/29/2014 | EP2690655A2 Method for making via holes |
| 01/29/2014 | EP2690434A1 Compact microdevice for gas chromatography analysis comprising at least one thermoelectric module |
| 01/29/2014 | EP2690186A1 Composite member provided with substrate formed from composite material |
| 01/29/2014 | EP2689464A2 Conductive paste composition and semiconductor devices made therewith |
| 01/29/2014 | EP2689456A1 Symmetrical center tap inductor structure |
| 01/29/2014 | EP2689455A1 Semiconductor chip with supportive terminal pad |
| 01/29/2014 | EP2689454A1 Thermal interface pad material with perforated liner |
| 01/29/2014 | EP2688974A1 Thermal interface based on a material having low thermal resistance and manufacturing process |
| 01/29/2014 | EP2538761B1 Intelligent Power Module and related assembling method |
| 01/29/2014 | EP2530105B1 Silicone resin composition, silicone resin sheet, optical semiconductor element device, and producing method of silicone resin sheet |
| 01/29/2014 | EP1438744B1 Method of forming a raised contact for a substrate |
| 01/29/2014 | EP1195801B1 Process for plasma treating an isolation layer with low permittivity |
| 01/29/2014 | DE202014000065U1 Vapor-Chamber-Kühler Vapor Chamber cooler |
| 01/29/2014 | CN203416546U Heat transfer unit |
| 01/29/2014 | CN203416178U Photovoltaic power module system |
| 01/29/2014 | CN203415573U Over-current protection chip |
| 01/29/2014 | CN203415572U Triode framework |
| 01/29/2014 | CN203415571U SOP-8L packaging lead frame |
| 01/29/2014 | CN203415570U Metal electrode and semiconductor laser using the metal electrode to realize packaging |
| 01/29/2014 | CN203415569U Pressing strip used for fixing MOS tube |
| 01/29/2014 | CN203415568U Heat dissipation treatment structure of high voltage diode |
| 01/29/2014 | CN203415567U Composite radiator |
| 01/29/2014 | CN203415566U Combined radiator for inverter welding machine |
| 01/29/2014 | CN203415565U Heat pipe and heating plate combined heat radiation apparatus |
| 01/29/2014 | CN203415564U Protective quick-connect bidirectional triode thyristor module |
| 01/29/2014 | CN203415563U 一种igbt模块 One kind igbt module |
| 01/29/2014 | CN203415562U Sensor of environmental light and approaching distance of secondary compression molding encapsulation |
| 01/29/2014 | CN203415561U Packaging substrate and semiconductor element supporting body |
| 01/29/2014 | CN103548425A Electronic component with heat-dissipating block and board employing said component |
| 01/29/2014 | CN103548361A Semiconductor device and microphone |
| 01/29/2014 | CN103548274A Cooling system and method for cooling radio unit |
| 01/29/2014 | CN103548145A Semiconductor device and method for manufacturing semiconductor device |
| 01/29/2014 | CN103548136A Connection carrier for semiconductor chips and semiconductor component |
| 01/29/2014 | CN103548135A Heat dissipating substrate, and element equipped with same |
| 01/29/2014 | CN103548134A Heat sink for cooling power electronics |
| 01/29/2014 | CN103548129A Method for permanently bonding wafers by a connecting layer by means of solid-state diffusion or phase transformation |
| 01/29/2014 | CN103548028A Hybrid interconnect technology |
| 01/29/2014 | CN103547130A Square two-way suction type processor instillation device |
| 01/29/2014 | CN103547129A Square installing device for processor |
| 01/29/2014 | CN103547128A Processor installation device capable of exhausting air in two directions |
| 01/29/2014 | CN103547127A Installing device for processor |
| 01/29/2014 | CN103547126A Installer for processor |
| 01/29/2014 | CN103547118A Multi-stage heat sink, cooling system with the same and method for controlling the same |
| 01/29/2014 | CN103545440A Thermoelectric conversion structure and its use in heat dissipation device |
| 01/29/2014 | CN103545309A Semiconductor device comprising an integrated capacitor and method of fabrication |
| 01/29/2014 | CN103545305A Power module |
| 01/29/2014 | CN103545302A Three-dimensional integration scheme for infrared focal plane array and digital storage control chip |
| 01/29/2014 | CN103545299A High-voltage rectification silicon stack |
| 01/29/2014 | CN103545298A Power semiconductor module with at least one stress-reducing adjustment element |
| 01/29/2014 | CN103545297A Multi-chip overlapping and packing structure and manufacturing method thereof |
| 01/29/2014 | CN103545296A Integrated circuit stack with integrated electromagnetic interference shielding |
| 01/29/2014 | CN103545295A Chip package and method for forming the same |
| 01/29/2014 | CN103545294A Semiconductor detection structure and method |
| 01/29/2014 | CN103545293A Polycrystalline silicon electro-migration test structure and test method |
| 01/29/2014 | CN103545292A TSV structure and manufacturing method thereof |
| 01/29/2014 | CN103545291A Dual anti-fuse |
| 01/29/2014 | CN103545290A Anti-fuse of semiconductor device, semiconductor module and system each including the semiconductor device, and method for forming the anti-fuse |
| 01/29/2014 | CN103545289A Semiconductor device and method for manufacturing the same |
| 01/29/2014 | CN103545288A Stacked fan-out semiconductor chip |
| 01/29/2014 | CN103545287A 半导体结构 The semiconductor structure |
| 01/29/2014 | CN103545286A Circuit substrate, semiconductor package structure and circuit substrate manufacturing technology |
| 01/29/2014 | CN103545285A Semicondutor module and method for determining a current flowing through a load connection |
| 01/29/2014 | CN103545284A High-power lead frame |
| 01/29/2014 | CN103545283A Semiconductor packages having multiple lead frames and methods of formation thereof |
| 01/29/2014 | CN103545282A Insulated gate bipolar thyristor module and electrode power terminal |
| 01/29/2014 | CN103545281A Semiconductor device |
| 01/29/2014 | CN103545280A Multi-chip package |
| 01/29/2014 | CN103545279A Semiconductor device and method of manufacturing the same |
| 01/29/2014 | CN103545278A Bump-on-trace packaging structure and method for forming the same |
| 01/29/2014 | CN103545277A Semiconductor package and method of fabricating the same |
| 01/29/2014 | CN103545276A Semiconductor devices and methods of fabricating the same |
| 01/29/2014 | CN103545275A Through silicon via package structure and forming method |
| 01/29/2014 | CN103545274A Heat-dissipating fastener fixing structure and tool for demounting heat-dissipating fastener |
| 01/29/2014 | CN103545273A Energy-storage radiating sheet and production method thereof |
| 01/29/2014 | CN103545272A Semiconductor chip including heat radiation portion and method of fabricating the semiconductor chip |
| 01/29/2014 | CN103545271A Semiconductor chip including heat radiation member, and display module |
| 01/29/2014 | CN103545270A Semiconductor device and stacked semiconductor package having the same |
| 01/29/2014 | CN103545269A High-power press-fitted IGBT packaging module |