| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/24/2015 | US8963210 Standard cell for integrated circuit |
| 02/24/2015 | US8963202 Electrostatic discharge protection apparatus |
| 02/24/2015 | US8963196 Slim LED package |
| 02/24/2015 | US8963156 Semiconductor devices including WiSX |
| 02/24/2015 | US8963150 Semiconductor device having a test pad connected to an exposed pad |
| 02/24/2015 | US8963120 Optoelectronic semiconductor component and photonic crystal |
| 02/24/2015 | US8963016 Printed wiring board and method for manufacturing same |
| 02/24/2015 | US8963013 Three dimensional interposer device |
| 02/24/2015 | US8962481 Chip-on-wafer structures and methods for forming the same |
| 02/24/2015 | US8962480 ESD network circuit with a through wafer via structure and a method of manufacture |
| 02/24/2015 | US8962479 Interconnect structures containing nitrided metallic residues |
| 02/24/2015 | US8962478 Method to use self-repair Cu barrier to solve barrier degradation due to Ru CMP |
| 02/24/2015 | US8962474 Method for forming an air gap around a through-silicon via |
| 02/24/2015 | US8962473 Method of forming hybrid diffusion barrier layer and semiconductor device thereof |
| 02/24/2015 | US8962471 Bump, method for forming the bump, and method for mounting substrate having the bump thereon |
| 02/24/2015 | US8962470 Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus |
| 02/24/2015 | US8962461 GaN HEMTs and GaN diodes |
| 02/24/2015 | US8962443 Semiconductor device having an airbridge and method of fabricating the same |
| 02/24/2015 | US8962440 Semiconductor device and method of manufacturing semiconductor device |
| 02/24/2015 | US8962439 Memory cell |
| 02/24/2015 | US8962405 Method of manufacturing semiconductor device by mounting and positioning a semiconductor die using detection marks |
| 02/24/2015 | US8962397 Multiple well drain engineering for HV MOS devices |
| 02/24/2015 | US8962396 Fabrication method of carrier-free semiconductor package |
| 02/24/2015 | US8962395 QFN package and manufacturing process thereof |
| 02/24/2015 | US8962394 Semiconductor device and method of manufacturing the same |
| 02/24/2015 | US8962393 Integrated circuit packaging system with heat shield and method of manufacture thereof |
| 02/24/2015 | US8962391 Method of fabricating a wafer level chip scale package without an encapsulated via |
| 02/24/2015 | US8962390 Method for manufacturing a chip packaging structure |
| 02/24/2015 | US8962363 Method for forming a groove on a surface of flat plate formed of a nitride semiconductor crystal |
| 02/24/2015 | US8962355 Optical element package and method of manufacturing the same |
| 02/24/2015 | US8962069 Process for making a structure with hermetically closed cavity under controlled atmosphere |
| 02/24/2015 | US8961725 Component placement on flexible and/or stretchable substrates |
| 02/24/2015 | US8960970 Light emitting device and method for manufacturing same |
| 02/24/2015 | US8960899 Assembling thin silicon chips on a contact lens |
| 02/24/2015 | US8960526 Flux for soldering and soldering process |
| 02/24/2015 | US8960267 Heat sink module |
| 02/24/2015 | US8959762 Method of manufacturing an electronic module |
| 02/24/2015 | US8959759 Method for assembling computer modules small in thickness |
| 02/24/2015 | US8959758 Method of manufacturing circuit board, method of manufacturing electronic device, and electronic device |
| 02/24/2015 | US8959756 Method of manufacturing a printed circuit board having an embedded electronic component |
| 02/24/2015 | CA2656316C Electronic module configured for air flow therethrough and system including same |
| 02/24/2015 | CA2637812C Semiconductor device |
| 02/19/2015 | WO2015023696A1 Integrated passive device (ipd) on subtrate |
| 02/19/2015 | WO2015023637A1 Conductor pad for flexible circuits and flexible circuit incorporating the same |
| 02/19/2015 | WO2015023510A1 Stacked via structures and methods of fabrication |
| 02/19/2015 | WO2015023312A2 Radiation hardened microelectronic chip packaging technology |
| 02/19/2015 | WO2015022994A1 Heat-radiating circuit board and electronic device |
| 02/19/2015 | WO2015022993A1 Ceramic circuit board and electronic device |
| 02/19/2015 | WO2015022948A1 Heat-radiating film and method and device for producing same |
| 02/19/2015 | WO2015022856A1 Elastic wave device |
| 02/19/2015 | WO2015022795A1 Solid-state image pickup device, method for manufacturing same, and image pickup device |
| 02/19/2015 | WO2015022563A1 Thermal interface material layer and package-on-package device comprising thermal interface material layer |
| 02/19/2015 | WO2015022193A1 Electrical component with an area to be contacted electrically and method for preparing an electrical component for a connection process |
| 02/19/2015 | WO2015022032A1 Enhanced structure for natural cooling heat sink |
| 02/19/2015 | US20150050782 Fabrication method of packaging substrate |
| 02/19/2015 | US20150050781 Semiconductor package with embedded die and its methods of fabrication |
| 02/19/2015 | US20150050780 Adhesive sheet and method for manufacturing semiconductor device |
| 02/19/2015 | US20150050779 Packaged Semiconductor Devices, Methods of Packaging Semiconductor Devices, and PoP Devices |
| 02/19/2015 | US20150050778 Method and apparatus for producing semiconductor device |
| 02/19/2015 | US20150050777 Integrated circuit package having surface-mount blocking elements |
| 02/19/2015 | US20150050755 Metrology marks for bidirectional grating superposition patterning processes |
| 02/19/2015 | US20150049546 Method of programming fuse cells and repairing memory device using the programmed fuse cells |
| 02/19/2015 | US20150049441 Circuit board with corner hollows |
| 02/19/2015 | US20150048525 Metrology marks for unidirectional grating superposition patterning processes |
| 02/19/2015 | US20150048524 Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another |
| 02/19/2015 | US20150048523 Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer |
| 02/19/2015 | US20150048522 Semiconductor package |
| 02/19/2015 | US20150048521 Semiconductor package |
| 02/19/2015 | US20150048520 Magnetic contacts |
| 02/19/2015 | US20150048519 Semiconductor devices with through via electrodes, methods of fabricaring the same, memory cards including the same, and electronic systems including the same |
| 02/19/2015 | US20150048518 Metal pad offset for multi-layer metal layout |
| 02/19/2015 | US20150048517 Crack stopping structure in wafer level packaging (wlp) |
| 02/19/2015 | US20150048516 Integrated circuit with a sidewall layer and an ultra-thick metal layer and method of making |
| 02/19/2015 | US20150048515 Fabrication of a substrate with an embedded die using projection patterning and associated package configurations |
| 02/19/2015 | US20150048514 Stacked via structures and methods of fabrication |
| 02/19/2015 | US20150048513 Method for obtaining three-dimensional actin structures and uses thereof |
| 02/19/2015 | US20150048512 Semiconductor devices including multiple interconnection structures and methods of manufacturing the same |
| 02/19/2015 | US20150048511 Opening Fill Process and Structure Formed Thereby |
| 02/19/2015 | US20150048510 Semiconductor device |
| 02/19/2015 | US20150048509 Cmos compatible wafer bonding layer and process |
| 02/19/2015 | US20150048508 Nanowires coated on traces in electronic devices |
| 02/19/2015 | US20150048507 Conductive diffusion barrier structure for ohmic contacts |
| 02/19/2015 | US20150048505 Wiring substrate, method of manufacturing the same, and semiconductor device |
| 02/19/2015 | US20150048504 Package assembly for chip and method of manufacturing same |
| 02/19/2015 | US20150048503 Packages with Interposers and Methods for Forming the Same |
| 02/19/2015 | US20150048502 Preventing misshaped solder balls |
| 02/19/2015 | US20150048501 Semiconductor package |
| 02/19/2015 | US20150048500 Multi-Chip Structure and Method of Forming Same |
| 02/19/2015 | US20150048499 Fine-pitch pillar bump layout structure on chip |
| 02/19/2015 | US20150048498 Alignment Structures and Methods of Forming Same |
| 02/19/2015 | US20150048497 Interposer with electrostatic discharge protection |
| 02/19/2015 | US20150048496 Fabrication process and structure to form bumps aligned on tsv on chip backside |
| 02/19/2015 | US20150048495 Adhesive for semiconductor, fluxing agent, manufacturing method for semiconductor device, and semiconductor device |
| 02/19/2015 | US20150048494 Phase changing on-chip thermal heat sink |
| 02/19/2015 | US20150048493 Semiconductor package and method of manufacturing the same |
| 02/19/2015 | US20150048492 PCB Based RF-Power Package Window Frame |
| 02/19/2015 | US20150048491 Lead frame, manufacture method and package structure thereof |
| 02/19/2015 | US20150048490 Memory module |
| 02/19/2015 | US20150048488 Semiconductor Devices, Methods of Manufacture Thereof, and Inter-metal Dielectric (IMD) Structures |
| 02/19/2015 | US20150048484 Passivation for Group III-V Semiconductor Devices Having a Plated Metal Layer over an Interlayer Dielectric Layer |