Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2003
12/09/2003US6660185 Photoluminescent phosphor powders, methods for making phosphor powders and devices incorporating same
12/09/2003US6660139 Plating apparatus and method
12/09/2003US6660135 Staged aluminum deposition process for filling vias
12/09/2003US6659778 Contact assembly for land grid array interposer or electrical connector
12/09/2003US6659507 Enhanced security for tamper-apparent labels, seals or tags
12/09/2003US6659334 Method for forming end-face electrode
12/09/2003US6659169 Cooler for electronic devices
12/09/2003US6659168 Heatsink with multiple fin types
12/09/2003US6659004 Screen printing paste, screen printing method, and baked thick film body
12/09/2003US6658861 Cooling of high power density devices by electrically conducting fluids
12/09/2003US6658736 Method of fabricating a heat exchanger, for regulating the temperature of multiple integrated circuit modules, having a face of a solid malleable metal coated with a release agent
12/09/2003US6658734 Method of manufacturing a circuit member for a resin-sealed semiconductor device
12/09/2003US6658733 Method of manufacturing via interconnection of glass-ceramic wiring board
12/09/2003US6658728 Method for fabricating a spring structure on a substrate
12/05/2003CA2430803A1 Heat dissipation structures and method of making
12/04/2003WO2003101166A1 Aluminum nitride sintered compact having metallized layer and method for preparation thereof
12/04/2003WO2003101164A1 Nanoparticle filled underfill
12/04/2003WO2003100863A1 Microwave field effect transistor structure on silicon carbide substrate
12/04/2003WO2003100859A2 Method for producing a component comprising a conductor structure that is suitable for use at high frequencies and corresponding component
12/04/2003WO2003100858A2 Surface mounted decoupling capacitor system and process of making the same
12/04/2003WO2003100857A2 Active shield of an integrated circuit
12/04/2003WO2003100856A1 Compliant component for supporting electrical interface component
12/04/2003WO2003100855A1 Electrical component
12/04/2003WO2003100854A2 Electronic component module and method for the production thereof
12/04/2003WO2003100853A1 Multilayer substrate with built-in coil, semiconductor chip, methods for manufacturing them
12/04/2003WO2003100852A1 Shielding wire in multilayer board, semiconductor chip, electronic circuit element, and method for producing the same
12/04/2003WO2003100851A1 Semiconductor device mounting board, method for producing the same, method for inspecting board, and semiconductor package
12/04/2003WO2003100846A2 Glass material for use at high frequencies
12/04/2003WO2003100829A2 Forming a multi segment integrated circuit with isolated substrates
12/04/2003WO2003100825A2 Multiple thickness semiconductor interconnect and method therefor
12/04/2003WO2003100512A1 A thin film transistor panel for a liquid crystal display
12/04/2003WO2003100326A1 Control arrangement for heating devices
12/04/2003WO2003099900A1 Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the same, and sealing material and laminate each comprising or made with the same
12/04/2003WO2003090287B1 Modular thermoelectric couple and stack
12/04/2003WO2003087221A3 Thermally conductive phase change materials
12/04/2003WO2003073475A3 Heat sink for semiconductor die employing phase change cooling
12/04/2003WO2003068825A8 Multifunctional monomers and their use in making cross-linked polymers and porous films
12/04/2003WO2003063243A8 Thin films, structures having thin films, and methods of forming thin films
12/04/2003WO2003021676A3 Connecting the emitter contacts of a semiconductor device
12/04/2003WO2003015164A3 Damping of high frequency bond wire vibration
12/04/2003WO2002101827A3 High performance flipchip package that incorporates heat removal with minimal thermal mismatch
12/04/2003WO2002095801B1 Improved connection assembly for integrated circuit sensors
12/04/2003WO2002075786A3 Bond wire tuning of rf power transistors and amplifiers
12/04/2003WO2002069374A3 Tape ball grid array semiconductor package structure and assembly process
12/04/2003WO2002061802A3 Metal-to-metal antifuse structure and fabrication method
12/04/2003US20030226121 Method of designing interconnects
12/04/2003US20030225473 Product management method, program for performing product management, and storage medium having recorded the program therein
12/04/2003US20030224923 High thermal expansion glass and tape composition
12/04/2003US20030224789 Method & systems for providing information to a home system regarding a wireless unit roaming in a visited system
12/04/2003US20030224663 Apparatus for providing controlled impedance in an electrical contact
12/04/2003US20030224622 Insulation film on semiconductor substrate and method for forming same
12/04/2003US20030224610 Fabrication process for bonded wafer precision layer thickness control and its non-destructructive measurement method
12/04/2003US20030224607 Structure including multiple wire-layers and methods for forming the same
12/04/2003US20030224577 Method for manufacturing thin film semiconductor device and method for forming resist pattern thereof
12/04/2003US20030224558 Method and system for assembling a printed circuit board using a land grid array
12/04/2003US20030224556 Traceless flip chip assembly and method
12/04/2003US20030224554 Package with a substrate of high thermal conductivity
12/04/2003US20030224553 System for flexible interconnect packaging
12/04/2003US20030224552 Partial wafer processing for random size wafers
12/04/2003US20030224546 Method and apparatus for reducing noise in electrical power supplied to a semiconductor
12/04/2003US20030224542 Method for making multi-chip packages and single chip packages simultaneously and structures from thereof
12/04/2003US20030224540 Recognition method of a mark provided on a semiconductor device
12/04/2003US20030224266 High-precision that can perform the design, testing, and formation of wiring easily and at high speed, can reduce the cost involved in the formation and design, can accommodate further miniaturization, and can cope with design changes.
12/04/2003US20030224261 Due to the symmetry of the structure, the overlay accuracy in the first direction may be determined on the basis of the same reference data as used for the second, so that establishing libraries is simplified.
12/04/2003US20030224199 Metal/ceramic bonding article and method for producing same
12/04/2003US20030224197 Solder
12/04/2003US20030224186 Thermally conductive phase change materials
12/04/2003US20030224156 Low dielectric materials and methods for making same
12/04/2003US20030224152 Conductive film forming composition, conductive film, and method for forming the same
12/04/2003US20030224116 Directing the overcoat material at an oblique angle so that the material is only deposited on the top portions of the structures without filling the gaps
12/04/2003US20030224104 Placing the metal film precursor on an organic film to produce a transfer sheet, contacting the surface with a substrate, and heating the sheet to decompose the film and the precursor and join the metal ultrafine particles
12/04/2003US20030223697 Systems and methods for removing heat from opto-electronic components
12/04/2003US20030223535 Lithography device for semiconductor circuit pattern generator
12/04/2003US20030223302 Semiconductor device having semiconductor memory
12/04/2003US20030223198 Stacked device assembly
12/04/2003US20030223181 Electronic device package
12/04/2003US20030223173 Tube-in-plate cooling or heating plate
12/04/2003US20030223164 Semiconductor apparatus and protection circuit
12/04/2003US20030223008 Image sensor module and process of fabricating the same
12/04/2003US20030222750 On-chip differential multi-layer inductor
12/04/2003US20030222667 Probe card assembly
12/04/2003US20030222356 Semiconductor integrated circuit, printed circuit board and electronic apparatus
12/04/2003US20030222355 Flip-chip semiconductor device having I/O modules in an internal circuit area
12/04/2003US20030222354 Construction through insulated interconnection is performed by forming, in a body of semiconductor material, a trench extending from the front (of the body for a thickness portion thereof; filling the trench with dielectric material;
12/04/2003US20030222353 Semiconductor device
12/04/2003US20030222352 Under-bump metallugical structure
12/04/2003US20030222350 Semiconductor device and method of fabricating the same
12/04/2003US20030222349 Semiconductor device with multilayer interconnection structure
12/04/2003US20030222348 Semiconductor device
12/04/2003US20030222344 Semiconductor device having a heat spreader exposed from a seal resin
12/04/2003US20030222343 Substrate having a plurality of bumps, method of forming the same, and method of bonding substrate to another
12/04/2003US20030222342 Multi-chip package
12/04/2003US20030222341 Placed adjacent a face of a microelectronic substrate and configured to oscillate to dissipate at least some heat that is generated by the microelectronic substrate during operation thereof. The MEMS oscillatory devices can be configured to
12/04/2003US20030222340 Enhancement of current-carrying capacity of a multilayer circuit board
12/04/2003US20030222339 Wiring substrate and semiconductor device
12/04/2003US20030222338 Reverse wire bonding techniques
12/04/2003US20030222337 Die connected with integrated circuit component for electrical signal passing therebetween
12/04/2003US20030222336 Semiconductor package with heat-dissipating structure and method of making the same
12/04/2003US20030222333 Sealed electronic device packages with transparent coverings
12/04/2003US20030222332 High-power lga socket
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