Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2003
12/10/2003CN2591778Y Terminal structure of electronic element
12/10/2003CN2591777Y CPU radiator
12/10/2003CN2591776Y Thin flat heat pipe radiator
12/10/2003CN2591775Y Thin flat heat pipe radiator
12/10/2003CN2591774Y Radiator device with thermal conducting tube at base
12/10/2003CN2591773Y Radiating apparatus with illuminating element
12/10/2003CN2591772Y Chip package structure
12/10/2003CN2591668Y Central processor radiating structural parts with fixed pins
12/10/2003CN1461495A Wiring method and element arragning method using the same, and method of producing image display devices
12/10/2003CN1461182A Rigidity flexible base board and camera using the same
12/10/2003CN1461181A Distributing base board and electronic device using it
12/10/2003CN1461055A Strong dielectric capacitor and mfg. method and semiconductor storage device
12/10/2003CN1461054A Electrooptical device and semiconductor device
12/10/2003CN1461053A Wire jointing reinforced semiconductor assembly
12/10/2003CN1461051A 半导体装置 Semiconductor device
12/10/2003CN1461050A Semiconductor device and its mfg. method
12/10/2003CN1461047A Material for forming low dielectric constant insulation film, low dielectric constant insulation film, its forming method and semiconductor
12/10/2003CN1461041A Simple technology for manufacturing semiconductor device
12/10/2003CN1461008A Circuit device for semiconductor
12/10/2003CN1460923A Single-output feedback-free sequential test response compression circuit
12/10/2003CN1460895A Processing method, mfg. method and processing device for semiconductor
12/10/2003CN1130842C Microwave module
12/10/2003CN1130822C Method for manufacturing surface acoustic wave device
12/10/2003CN1130772C Semiconductor device comprising high density integrated circuit having large number of insulated gate field effect transistors
12/10/2003CN1130769C Low voltage triggered static discharge protective circuit
12/10/2003CN1130768C Electrostatic discharge protector
12/10/2003CN1130767C Semiconductor device with high radiation character and method of mfg. the same
12/10/2003CN1130766C Process for mfg. thin-film transistor
12/10/2003CN1130755C Method for correcting photo-adjacency effect in course of production of semiconductor device
12/10/2003CN1130587C Packaging adhesive belt and roll for packaging conducting wire unit of LCD
12/10/2003CN1130315C Glass composition having low dielectric constant for high-frequency circuits
12/09/2003US6662351 Wiring editing method, for semiconductor package, capable of easily editing offset of wiring pattern
12/09/2003US6662136 Digital temperature sensor (DTS) system to monitor temperature in a memory subsystem
12/09/2003US6661691 Interconnection structure and methods
12/09/2003US6661666 Device for enhancing the local cooling of electronic packages subject to laminar air flow
12/09/2003US6661663 Fiber guide connected to a heatsink fastener
12/09/2003US6661661 Common heatsink for multiple chips and modules
12/09/2003US6661660 Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
12/09/2003US6661659 Water cooled inverter
12/09/2003US6661658 Fluid-cooled heat sink for electronic components
12/09/2003US6661330 Patterned polysilicon, electroconductive suicide, and contact layers
12/09/2003US6661317 Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly
12/09/2003US6661106 Alignment mark structure for laser fusing and method of use
12/09/2003US6661105 Alignment mark structure
12/09/2003US6661103 Apparatus for packaging flip chip bare die on printed circuit boards
12/09/2003US6661102 Semiconductor packaging apparatus for controlling die attach fillet height to reduce die shear stress
12/09/2003US6661101 Semiconductor device
12/09/2003US6661100 Low impedance power distribution structure for a semiconductor chip package
12/09/2003US6661099 Semiconductor device, semiconductor package for use therein, and manufacturing method thereof
12/09/2003US6661098 High density area array solder microjoining interconnect structure and fabrication method
12/09/2003US6661097 Titanium nitride layer prevents titanium from reacting with copper; integrated circuits
12/09/2003US6661095 Semiconductor device
12/09/2003US6661094 Semiconductor device having a dual damascene interconnect spaced from a support structure
12/09/2003US6661093 Semiconductor device
12/09/2003US6661092 Memory module
12/09/2003US6661091 Semiconductor device
12/09/2003US6661090 Metal adhesion layer in an integrated circuit package
12/09/2003US6661089 Semiconductor package which has no resinous flash formed on lead frame and method for manufacturing the same
12/09/2003US6661088 Semiconductor integrated circuit device having interposer and method of manufacturing the same
12/09/2003US6661087 Lead frame and flip chip semiconductor package with the same
12/09/2003US6661086 Three-dimensionally embodied circuit with electrically connected semiconductor chips
12/09/2003US6661085 Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack
12/09/2003US6661084 Single level microelectronic device package with an integral window
12/09/2003US6661083 Plastic semiconductor package
12/09/2003US6661082 Flip chip substrate design
12/09/2003US6661081 Semiconductor device and its manufacturing method
12/09/2003US6661080 Vacuum chuck with plurality of suction ports is aligned on tape such that suction ports contact only tape and not holes; wafer singulation
12/09/2003US6661079 Semiconductor-based spiral capacitor
12/09/2003US6661078 Inductance element and semiconductor device
12/09/2003US6661077 Semiconductor device including primary connecting plug and an auxiliary connecting plug
12/09/2003US6661076 Semiconductor device
12/09/2003US6661048 Semiconductor memory device having self-aligned wiring conductor
12/09/2003US6661026 Thin film transistor substrate
12/09/2003US6660946 Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin
12/09/2003US6660945 Interconnect structure and method of making same
12/09/2003US6660942 Semiconductor device with an exposed external-connection terminal
12/09/2003US6660941 Electronic parts mounting board and production method thereof
12/09/2003US6660811 Epoxy resin composition and curing product thereof
12/09/2003US6660680 Heating aerosols at low temperature; well-controlled microstructure and morphology
12/09/2003US6660670 Ceramics and method of preparing the same
12/09/2003US6660634 Method of forming reliable capped copper interconnects
12/09/2003US6660626 Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint
12/09/2003US6660618 Reverse mask and oxide layer deposition for reduction of vertical capacitance variation in multi-layer metallization systems
12/09/2003US6660617 Method for fabricating a semiconductor device
12/09/2003US6660612 Design to prevent tungsten oxidation at contact alignment in FeRAM
12/09/2003US6660566 Heat conductive molded body and manufacturing method thereof and semiconductor device
12/09/2003US6660565 Flip chip molded/exposed die process and package structure
12/09/2003US6660563 Method and system for assembling a printed circuit board using a land grid array
12/09/2003US6660562 Method and apparatus for a lead-frame air-cavity package
12/09/2003US6660561 Method of assembling a stackable integrated circuit chip
12/09/2003US6660558 Semiconductor package with molded flash
12/09/2003US6660557 Method of manufacturing an electronic device
12/09/2003US6660545 Semiconductor device and manufacturing method therefor, circuit substrate, and electronic apparatus
12/09/2003US6660543 Method of measuring implant profiles using scatterometric techniques wherein dispersion coefficients are varied based upon depth
12/09/2003US6660542 Method of controlling stepper process parameters based upon optical properties of incoming process layers, and system for accomplishing same
12/09/2003US6660541 Semiconductor device and a manufacturing method thereof
12/09/2003US6660540 Test wafer and method for investigating electrostatic discharge induced wafer defects
12/09/2003US6660456 Transferring an image of the first opening from a photoresist layer into the first film layer by etching
12/09/2003US6660391 Polysilazane having alkyl, phenyl and/or fluoroalkyl groups; high thermal stability; reliable; cost effective
12/09/2003US6660203 Formed sheet of thermalconductive silicone gel and method for producing the same
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