Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2003
12/11/2003WO2003103055A1 Arrangement for reducing current density in a transistor in an ic
12/11/2003WO2003103048A1 Die connected with integrated circuit component
12/11/2003WO2003103047A1 Stacked ic device with ic chip selecting/counting function
12/11/2003WO2003103046A1 Buried digit line stack and process for making same
12/11/2003WO2003103045A1 High-power land grid array package and socket
12/11/2003WO2003103044A1 Thermally or electrically conductive gap filler
12/11/2003WO2003103043A1 Heat spreader with down set leg attachment feature
12/11/2003WO2003103042A2 Electronic component comprising external surface contacts and a method for producing the same
12/11/2003WO2003103039A1 Method for manufacturing semiconductor device
12/11/2003WO2003103038A1 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
12/11/2003WO2003103020A2 Layered components, materials, methods of production and uses thereof
12/11/2003WO2003102682A1 Thin film transistor array panel for a liquid crystal display
12/11/2003WO2003102510A2 Prevention of tampering in electronic devices
12/11/2003WO2003102071A1 Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition
12/11/2003WO2003101902A1 Ltcc tape composition
12/11/2003WO2003083883A3 Packaging microelectromechanical structures
12/11/2003WO2003067604A3 Circuit system with a printed board comprising a programmable memory element
12/11/2003WO2003049147A3 Integrated circuits including metal oxide and hydrogen barrier layers and their method of fabrication
12/11/2003WO2003028159A3 Metallic surface of a body, method for producing a structured metallic surface of a body and the use thereof
12/11/2003WO2003025975A3 Integrated circuit having a reduced spacing between a bus and adjacent circuitry
12/11/2003WO2003023855A3 Semiconductor device with compliant electrical terminals, apparatus including the semiconductor device, and methods for forming same
12/11/2003WO2003023823A3 Stacking of multilayer modules
12/11/2003WO2003021673A9 High-frequency chip packages
12/11/2003WO2003021667A3 Package with integrated inductor and/or capacitor
12/11/2003US20030229479 Dummy fill for integrated circuits
12/11/2003US20030228789 Coupling mechanism for radiator
12/11/2003US20030228767 Method of manufacturing a semiconductor device including a heat treatment procedure
12/11/2003US20030228757 Optimization methods for on-chip interconnect geometries suitable for ultra deep sub-micron processes
12/11/2003US20030228756 Method of forming a fuse
12/11/2003US20030228749 Plating metal caps on conductive interconnect for wirebonding
12/11/2003US20030228720 Semiconductor device and a method of manufacturing the same
12/11/2003US20030228714 Dummy fill for integrated circuits
12/11/2003US20030227959 Thermal interface material with low melting alloy
12/11/2003US20030227749 Heat dissipation assembly
12/11/2003US20030227732 Enhanced heat transfer structure with heat transfer members of variable density
12/11/2003US20030227593 Liquid crystal display device and manufacturing method of liquid crystal display device
12/11/2003US20030227592 Wiring substrate, display device, and manufacturing method of wiring substrate
12/11/2003US20030227096 Semiconductor device
12/11/2003US20030227095 Semiconductor device and manufacturing method thereof
12/11/2003US20030227094 Wafer level packaging of micro electromechanical device
12/11/2003US20030227093 Flip-chip package substrate and flip chip die
12/11/2003US20030227092 Method of rounding a corner of a contact
12/11/2003US20030227091 Plating metal caps on conductive interconnect for wirebonding
12/11/2003US20030227090 Dual damascene semiconductor devices
12/11/2003US20030227089 Semiconductor device and method for manufacturing the same
12/11/2003US20030227088 Semiconductor device and manufacturing method for the same
12/11/2003US20030227087 Semiconductor device and method of manufacturing the same
12/11/2003US20030227086 Semiconductor device having multilevel copper wiring layers and its manufacture method
12/11/2003US20030227085 Semiconductor device comprising capacitor
12/11/2003US20030227084 Flexible routing channels among vias
12/11/2003US20030227083 Semiconductor package and method for packing a semiconductor
12/11/2003US20030227081 High-frequency circuit device, resonator, filter, duplexer, and high-frequency circuit apparatus
12/11/2003US20030227080 Multi-chip module
12/11/2003US20030227079 Super high density module with integrated wafer level packages
12/11/2003US20030227078 Thin film transistor array panel for a liquid crystal display
12/11/2003US20030227077 Microelectronic package having a bumpless laminated interconnection layer
12/11/2003US20030227076 Semiconductor device and method of manufacturing the same
12/11/2003US20030227075 Memory card and a method of manufacturing the same
12/11/2003US20030227074 Semiconductor device
12/11/2003US20030227073 Lead frame and manufacturing method thereof and a semiconductor device
12/11/2003US20030227068 Sputtering target
12/11/2003US20030227067 Semiconductor component with integrated circuit, cooling body, and temperature sensor
12/11/2003US20030227066 Microelectronic packaging and methods for thermally protecting package interconnects and components
12/11/2003US20030227053 ESD protection circuit
12/11/2003US20030227030 Light emitting semiconductor device
12/11/2003US20030227025 Electronic circuit device
12/11/2003US20030226688 Vented circuit board for cooling power components
12/11/2003US20030226685 Wiring structure
12/11/2003US20030226640 Method for manufacturing semiconductor device using adhesive sheet with embedded conductor bodies
12/11/2003US20030226371 Method and apparatus for high heat flux heat transfer
12/11/2003US20030226253 Method and apparatus for thermally coupling a heat dissipation device to a microelectronic device
12/11/2003DE4345302C2 Verfahren zur Herstellung einer Halbleitervorrichtung mit LOC-Struktur und Zuführungsdraht-Rahmen zur Verwendung bei der Herstellung einer Halbleitervorrichtung mit LOC-Struktur A method of manufacturing a semiconductor device having the LOC structure, and lead-in wire frame for use in the manufacture of a semiconductor device having the LOC structure
12/11/2003DE20315053U1 Component arrangement has power semiconductor and defect recognition circuit with load that is provided in series to semiconductor layer and has detection circuit generating defect signal that depends on voltage across load
12/11/2003CA2483272A1 Die connected with integrated circuit component
12/10/2003EP1370123A2 Metal/ceramic bonding article and method for producing same
12/10/2003EP1369922A1 Multilayer metal structure of supply rings large parasitic resistance
12/10/2003EP1369921A2 Semiconductor package and method for packaging a semiconductor
12/10/2003EP1369920A2 Wiring structure
12/10/2003EP1369919A1 Flip chip package
12/10/2003EP1369918A2 Heat transfer device with thermal superconducting heat transfer layer
12/10/2003EP1369917A2 Electronic component mounting board, method of manufacturing the same, electronic component module, and communications equipment
12/10/2003EP1369916A1 Hydronic pump type heat radiator
12/10/2003EP1369915A2 Semiconductor device with integrated circuit, heat sink and temperature sensor
12/10/2003EP1369908A2 Methods for depositing pinhole-defect free organic polysilica coatings
12/10/2003EP1369907A2 Low dielectric materials and methods for making same
12/10/2003EP1369737A2 Liquid crystal display device and manufacturing method thereof
12/10/2003EP1369445A1 Curing accelerator, epoxy resin composition, and semiconductor device
12/10/2003EP1369402A1 Tape composition and process for constrained sintering of low temperature co-fired ceramic
12/10/2003EP1369397A1 High thermal expansion glass and tape composition
12/10/2003EP1369002A2 Adaptor for plastic-leaded chip carrier (plcc) and other surface mount technology (smt) chip carriers
12/10/2003EP1368875A1 Electrostatic discharge protection structures having high holding current for latch-up immunity
12/10/2003EP1368861A2 Semiconductor device having signal contacts and high current power contacts
12/10/2003EP1368858A1 Module and electronic device
12/10/2003EP1368833A2 Integrated circuit comprising electric connecting elements
12/10/2003EP1368832A2 Diamondoid-containing materials in microelectronics
12/10/2003EP1368828A2 Formation of a frontside contact on silicon-on-insulator substrate
12/10/2003EP1368699A1 Display device
12/10/2003EP1368401A1 Liquid epoxy resin emulsions, method for the production and use thereof
12/10/2003EP1186032B1 Method for producing a portable electronic device with an integrated circuit protected by a photosensitive resin
12/10/2003CN2591779Y Non-pin semiconductor assembly
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