Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2003
12/17/2003CN1131563C Semiconductor assembly
12/17/2003CN1131562C Semiconductor device and its manufacturing method
12/17/2003CN1131556C Semiconductor package and method of amnufacturing the same
12/17/2003CN1131550C Alignment marks of semiconductor substrate and manufacturing method thereof
12/17/2003CA2431520A1 Finned heat sinks
12/16/2003US6665858 Manufacturing method of semiconductor device
12/16/2003US6665374 Active matrix substrate, method of manufacturing same, and flat-panel image sensor
12/16/2003US6665204 Semiconductor memory device for decreasing a coupling capacitance
12/16/2003US6665194 Semiconductor package able to accommodate a large number of connections with improved electrical characteristics
12/16/2003US6665190 Modular PC card which receives add-in PC card modules
12/16/2003US6665188 Snapping device for CPU cooler
12/16/2003US6665187 Thermally enhanced lid for multichip modules
12/16/2003US6665186 Liquid metal thermal interface for an electronic module
12/16/2003US6665184 Tapered cold plate
12/16/2003US6665182 Module unit for memory modules and method for its production
12/16/2003US6665181 Cooling device capable of reducing thickness of electronic apparatus
12/16/2003US6665180 System for cooling a component in a computer system
12/16/2003US6664874 Mounting structure of high-frequency wiring board
12/16/2003US6664864 Cavity design printed circuit board for a temperature compensated crystal oscillator and a temperature compensated crystal oscillator employing the same
12/16/2003US6664863 LC oscillator
12/16/2003US6664794 Apparatus and method for evaluating the surface insulation resistance of electronic assembly manufacture
12/16/2003US6664779 Package with environmental control material carrier
12/16/2003US6664709 Surface acoustic wave device
12/16/2003US6664673 Cooler for electronic devices
12/16/2003US6664650 Method of forming an alignment key on a semiconductor wafer
12/16/2003US6664649 Lead-on-chip type of semiconductor package with embedded heat sink
12/16/2003US6664647 Semiconductor device and a method of manufacturing the same
12/16/2003US6664645 Method of mounting a semiconductor chip, circuit board for flip-chip connection and method of manufacturing the same, electromagnetic wave readable data carrier and method of manufacturing the same, and electronic component module for an electromagnetic wave readable data carrier
12/16/2003US6664644 Semiconductor device and method for manufacturing the same
12/16/2003US6664643 Semiconductor device and method for manufacturing the same
12/16/2003US6664642 Dummy regions are disposed in a shallow trench element isolation region; an insulating film is planarized by the chemical mechanical polishing
12/16/2003US6664641 Wiring structure for an integrated circuit
12/16/2003US6664640 Semiconductor device
12/16/2003US6664639 Contact and via structure and method of fabrication
12/16/2003US6664638 Semiconductor integrated circuit having reduced cross-talk noise
12/16/2003US6664637 Flip chip C4 extension structure and process
12/16/2003US6664634 Metal wiring pattern for memory devices
12/16/2003US6664633 Alkaline copper plating
12/16/2003US6664632 Utilization of die active surfaces for laterally extending die internal and external connections
12/16/2003US6664630 Semiconductor device
12/16/2003US6664628 An unsingulated semiconductor wafer comprising a plurality of dice; an electronic component attached to at least two of said dice, said electronic component overlapping said at least two dice
12/16/2003US6664627 Water cooling type cooling block for semiconductor chip
12/16/2003US6664625 Mounting structure of a semiconductor device
12/16/2003US6664624 Semiconductor device and manufacturing method thereof
12/16/2003US6664621 Semiconductor chip package with interconnect structure
12/16/2003US6664620 Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer
12/16/2003US6664619 Laminate film packaged storage device and fabricating method thereof
12/16/2003US6664618 Tape carrier package having stacked semiconductor elements, and short and long leads
12/16/2003US6664616 Semiconductor device and manufacturing method thereof
12/16/2003US6664615 Method and apparatus for lead-frame based grid array IC packaging
12/16/2003US6664614 Lead frame and bottom lead semiconductor package using the lead frame
12/16/2003US6664613 Magnetic shielding for integrated circuits
12/16/2003US6664603 Semiconductor device, memory system and electronic apparatus
12/16/2003US6664599 ESD protection device
12/16/2003US6664586 Memory device and manufacturing method thereof
12/16/2003US6664585 Semiconductor memory device having multilayered storage node contact plug and method for fabricating the same
12/16/2003US6664500 Laser-trimmable digital resistor
12/16/2003US6664484 Components with releasable leads
12/16/2003US6664483 Electronic package with high density interconnect and associated methods
12/16/2003US6664480 Singulation methods and substrates for use with same
12/16/2003US6664463 Apparatus and method for shielding electromagnetic radiation
12/16/2003US6664344 Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product
12/16/2003US6664318 Curable composition for solventless hydrophobic resin encapsulation of electronic components comprising non-silicone oligomer having flexible hydrocarbon backbone with reactive functionality, adhesion promoter, optional viscosity modifier
12/16/2003US6664192 Method for bottomless deposition of barrier layers in integrated circuit metallization schemes
12/16/2003US6664178 Method of forming buried interconnecting wire
12/16/2003US6664176 Method of making pad-rerouting for integrated circuit chips
12/16/2003US6664175 Method of forming ruthenium interconnect for an integrated circuit
12/16/2003US6664174 Semiconductor device and method for fabricating the same
12/16/2003US6664171 Method of alloying a semiconductor device
12/16/2003US6664159 Mixed metal nitride and boride barrier layers
12/16/2003US6664142 Laser repair operation
12/16/2003US6664141 Method of forming metal fuses in CMOS processes with copper interconnect
12/16/2003US6664140 Methods for fabricating integrated circuit devices using antiparallel diodes to reduce damage during plasma processing
12/16/2003US6664139 Method and apparatus for packaging a microelectronic die
12/16/2003US6664138 Method for fabricating a circuit device
12/16/2003US6664136 Semiconductor device and manufacturing method thereof
12/16/2003US6664135 Method of manufacturing a ball grid array type semiconductor package
12/16/2003US6664133 Lead frame and method of manufacturing the same
12/16/2003US6664131 Method of making ball grid array package with deflectable interconnect
12/16/2003US6664130 Methods of fabricating carrier substrates and semiconductor devices
12/16/2003US6664129 Integrated circuits and methods for their fabrication
12/16/2003US6664127 Manufacturing highly dense multi-layer printed wiring board by using laser drilling.
12/16/2003US6664125 Solid-state image pickup device and a method of manufacturing the same
12/16/2003US6664120 Method and structure for determining a concentration profile of an impurity within a semiconductor layer
12/16/2003US6664001 Layered substrate with battery
12/16/2003US6663980 Clad plate for lead frames, lead frame using the same, and method of manufacturing the lead frame
12/16/2003US6663973 Polysiloxane with a fluoroaromatic silanediol monomer
12/16/2003US6663969 Magnetic field is applied to boron nitride powder increasing thermoconductivity; dielectrics
12/16/2003US6663964 Heat dissipating structure
12/16/2003US6663946 Multi-layer wiring substrate
12/16/2003US6663915 Immersing the substrate in a copper plating bath; immersing an activator in copper plating bath; performing a direct contact between activator and substrate to deposit copper on substrate
12/16/2003US6663799 For use in electrical connection between circuit devices and electrical connection between wirings in a circuit device
12/16/2003US6663789 Bonded substrate structures and method for fabricating bonded substrate structures
12/16/2003US6662993 Bondhead lead clamp apparatus
12/16/2003US6662865 Multi-load thermal regulating system having electronic valve control
12/16/2003US6662442 Forming insulator layer having through-hole; conductive passageway formed by electroplating metal; flat conductive layer for good adhesion; accuracy
12/16/2003US6662412 Buckle of IC heat dissipating device
12/11/2003WO2003103360A1 Cooling element for an electronic device
12/11/2003WO2003103355A1 Composite multi-layer substrate and module using the substrate
12/11/2003WO2003103350A1 Conductive sheet
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