Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2003
12/18/2003WO2003075337A8 Fluxless assembly of chip size semiconductor packages
12/18/2003WO2003063240A3 Cooling device
12/18/2003WO2003060998B1 Wire bond-less electronic component for use with an external circuit and method of manufacture
12/18/2003WO2003028098A3 Programmable chip-to-substrate interconnect structure and device and method of forming same
12/18/2003WO2003014633A3 Heat removal system
12/18/2003WO2003001597A3 Vertically contacted stacked chips
12/18/2003WO2002095826A3 Photonic and electronic components on a shared substrate
12/18/2003WO2002086947A3 A method for making a metal-insulator-metal capacitor using plate-through mask techniques
12/18/2003WO2002078078A3 Dispensing process for fabrication of microelectronic packages
12/18/2003WO2002075926B1 Antifuse reroute of dies
12/18/2003WO2002069397A3 Semiconductor die package having mesh power and ground planes
12/18/2003WO2002067326A3 Integrated circuit die having an electromagnetic interference shield
12/18/2003WO2002065542B1 Underfill compositions
12/18/2003US20030232523 Electrical connector having reliable soldering configuration
12/18/2003US20030232519 Socket structure for grid array (GA) packages
12/18/2003US20030232494 Dual damascene copper interconnect to a damascene tungsten wiring level
12/18/2003US20030232493 Semiconductor power device and method of formation
12/18/2003US20030232492 Semiconductor device package and method of making the same
12/18/2003US20030232488 Wafer level packaging
12/18/2003US20030232486 Semiconductor device and method of manufacturing the same
12/18/2003US20030232471 Semiconductor device and method of fabricating the same
12/18/2003US20030232463 Carbon foam heat exchanger for intedgrated circuit
12/18/2003US20030232462 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods
12/18/2003US20030232461 Methods for packaging image sensitive electronic devices
12/18/2003US20030232460 Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods
12/18/2003US20030232205 Bonding nickel/copper alloy plate onto ceramic substrate, applying photoresist, ethching, then removing photoresist; reduces the displacement failure during mounting of semiconductor
12/18/2003US20030232204 Metal/ceramic bonding article and method for producing same
12/18/2003US20030231673 Optical semiconductor device increasing productivity and method of fabricating the same
12/18/2003US20030231479 Retention module for heat sink
12/18/2003US20030231471 A thermal management aid having a chemical vapor deposition diamond surface(CVDD), an arrangment of aligned carbon nanotubes coupling a surface of the circuit die to CVDD surface of the thermal management aid
12/18/2003US20030231468 Integrated crossflow cooler for electronic components
12/18/2003US20030231458 Metal-insulator-metal (MIM) capacitor and method for fabricating the same
12/18/2003US20030231457 Plated terminations
12/18/2003US20030231456 Energy conditioning structure
12/18/2003US20030231088 Semiconductor device and electronic device
12/18/2003US20030230812 Semiconductor interconnection structure with TaN and method of forming the same
12/18/2003US20030230809 Semiconductor device and method of manufacturing same
12/18/2003US20030230807 Circuit board with trace configuration for high-speed digital differential signaling
12/18/2003US20030230806 Method for manufacturing semiconductor device and electronic device and method for calculating connection condition
12/18/2003US20030230805 Semiconductor device and manufacturing method thereof
12/18/2003US20030230804 Having integrated circuit portion and plurality of pads connected to integrated circuit; plurality of distributing lines formed on semiconductor structure, connected to connecting pads; encapsulating resin layer formed on surface
12/18/2003US20030230803 Semiconductor device
12/18/2003US20030230802 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods
12/18/2003US20030230801 Semiconductor device assemblies and packages including multiple semiconductor devices and methods
12/18/2003US20030230800 Semiconductor device manufacturing method, semiconductor device, and semiconductor device unit
12/18/2003US20030230799 Intrinsic thermal enhancement for FBGA package
12/18/2003US20030230798 Wafer level MEMS packaging
12/18/2003US20030230797 Semiconductor module structure incorporating antenna
12/18/2003US20030230794 Semiconductor fabrication method and apparatus, and semiconductor device
12/18/2003US20030230793 Support for microelectronic, microoptoelectronic or micromechanical devices
12/18/2003US20030230792 To assure quality of electrical connection between the lead frame and a chip mounted on the lead frame
12/18/2003US20030230791 Power distribution plane layout for VLSI packages
12/18/2003US20030230780 Fully silicided NMOS device for electrostatic discharge protection
12/18/2003US20030230428 PBGA electrical noise isolation of signal traces
12/18/2003US20030230403 Conductive thermal interface and compound
12/18/2003US20030230401 Distributed graphitic foam heat exchanger system
12/18/2003US20030230400 Cold plate assembly
12/18/2003US20030230399 Apparatus and method for extracting heat from a device
12/18/2003US20030230398 Heat dissipation device
12/18/2003US20030229986 Fluxless bumping process
12/18/2003DE20314728U1 Ceramic cooling device e.g. for CPU, has heat-dissipating layer combined with heat-conducting layer and comprising micropore structure with hollow crystals
12/18/2003DE20212173U1 Processor cooling system, has evaporating cooler connected via heat-sink to air-tight pump comprising check valves, with cooling side made of thermally-conductive material
12/18/2003CA2488700A1 Method and apparatus for cooling a circuit component
12/18/2003CA2488626A1 Method and apparatus for cooling a portable computer
12/17/2003EP1372215A2 Semiconductor module structure incorporating antenna
12/17/2003EP1372194A1 Method for fabricating shaped blocks
12/17/2003EP1372193A2 Semiconductor device and method of manufacturing the same
12/17/2003EP1372190A1 A process for mounting electronic devices onto submounts and submount therefor
12/17/2003EP1372188A1 Solid-state device and its manufacturing method
12/17/2003EP1372162A1 Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work
12/17/2003EP1371753A1 Pretreating method before plating and composites having a plated coat
12/17/2003EP1371621A1 Metal/ceramic bonding article and method for producing same
12/17/2003EP1371096A2 Integrated circuit package with a capacitor
12/17/2003EP1371094A1 sUPER-THIN HIGH SPEED FLIP CHIP PACKAGE
12/17/2003EP1371092A1 Method for structuring a flat substrate consisting of a glass-type material
12/17/2003EP1371091A1 Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics
12/17/2003EP1371090A1 HYBRID LOW-k INTERCONNECT STRUCTURE COMPRISED OF 2 SPIN-ON DIELECTRIC MATERIALS
12/17/2003CN2593392Y Electric connector
12/17/2003CN2593365Y High density multi-chip module
12/17/2003CN2593364Y Evaporative heat-transfer tube type radiator
12/17/2003CN2593363Y Heat tube radiator
12/17/2003CN2593362Y 散热器鳍片 Radiator fins
12/17/2003CN2593361Y 散热器鳍片 Radiator fins
12/17/2003CN2593360Y 散热器 Heat sink
12/17/2003CN2593254Y Liquid-cooled radiator
12/17/2003CN1462574A Multilayer printed circuit board
12/17/2003CN1462494A Shielded carrier with components for land grid array connectors
12/17/2003CN1462479A Semiconductor device and its manufacturing method
12/17/2003CN1462476A Power source circuit device
12/17/2003CN1462088A Manufacturing method of radio circuit and radio circuit
12/17/2003CN1462076A Direct cooling type luminous diode
12/17/2003CN1462072A Semiconductor packaging device and its manufacturing method
12/17/2003CN1462071A System for flexible interconnection packaging
12/17/2003CN1462070A Chip packaging structure
12/17/2003CN1462065A Wiring forming system and wiring forning method for wiring on wiring board
12/17/2003CN1461779A Substance for forming electrically-conducting film and electrically-conducting film and its manufacturing method
12/17/2003CN1131610C Array-type integrated sensor based on weak-light electromechanical system for emitting or receiving laser
12/17/2003CN1131594C Sound coding device, and decoding device, optical recording medium and sound transmission method
12/17/2003CN1131566C Electrostatic discharging protector for polysilicon diode
12/17/2003CN1131564C Integrated circuit wiring system and method for implementing engineering change of semiconductor integrated circuit
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