| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/24/2003 | CN1463041A 半导体集成电路装置 The semiconductor integrated circuit device |
| 12/24/2003 | CN1463040A Semiconductor device with exposed radiator from sealed resin |
| 12/24/2003 | CN1463039A Structure of thermal fin with high heat conductivity and its manufacturing method |
| 12/24/2003 | CN1463038A Semiconductor device and its mfg. method |
| 12/24/2003 | CN1463037A Semiconductor device and its mfg. method |
| 12/24/2003 | CN1463036A Chip of memory, chip-on-chip device of using same and its mfg. method |
| 12/24/2003 | CN1463032A Identifying method of mark on semiconductor device |
| 12/24/2003 | CN1132509C Sheet for heat transfer substrate and method for mfg. sheet, and heat transfer substrate using same and mfg. method therefor |
| 12/24/2003 | CN1132276C Thin cross section electric connector and terminal thereof for inserter grid mesh array component |
| 12/24/2003 | CN1132268C Electrical connector of pin grid array assembly |
| 12/24/2003 | CN1132248C Semiconductor appts. and method for producing semiconductor appts. |
| 12/24/2003 | CN1132245C 3维器件的制造方法 The method of manufacturing three-dimensional device |
| 12/24/2003 | CN1132244C Resin-encapsulated semiconductor device and method of mfg. same |
| 12/24/2003 | CN1132243C Metal substrate having IC chip and carrier mounting |
| 12/24/2003 | CN1132242C Automated stacking and soldering appts. for three dimensional stack package devices and mfg. method thereof |
| 12/24/2003 | CN1132237C External lead wire corrector and visual examinator for semiconductor device |
| 12/24/2003 | CN1132236C Semiconductor devices and method of making devices |
| 12/24/2003 | CN1132235C Upside down mounting chip package with optimization adhesiveness of selant and producing method thereof |
| 12/24/2003 | CN1132120C 生物计量传感器及其制造方法 Biometric sensor and manufacturing method thereof |
| 12/24/2003 | CN1132088C Fan assisted heat sink device |
| 12/24/2003 | CN1131883C Epoxy resin compsn. adhesive film and preimpregnatel blank and multilayer printing circuit board |
| 12/24/2003 | CA2634288A1 Led packaging method and packaged led |
| 12/24/2003 | CA2488904A1 A lamp and method of producing a lamp |
| 12/23/2003 | US6668242 Emulator chip package that plugs directly into the target system |
| 12/23/2003 | US6668125 Lead frame, optical module, and a method of optical module |
| 12/23/2003 | US6667885 Attachment of a single heat dissipation device to multiple components with vibration isolation |
| 12/23/2003 | US6667884 Heat dissipating assembly |
| 12/23/2003 | US6667882 Cooling assembly for a heat producing assembly |
| 12/23/2003 | US6667874 Structure for eliminating electromagnetic interference caused by central processing unit |
| 12/23/2003 | US6667561 Integrated circuit capable of operating in multiple orientations |
| 12/23/2003 | US6667560 Board on chip ball grid array |
| 12/23/2003 | US6667559 Ball grid array module and method of manufacturing same |
| 12/23/2003 | US6667557 Adhesively attaching collar to support substrate and electric device |
| 12/23/2003 | US6667556 Flip chip adaptor package for bare die |
| 12/23/2003 | US6667552 Low dielectric metal silicide lined interconnection system |
| 12/23/2003 | US6667551 Semiconductor device and manufacturing thereof, including a through-hole with a wider intermediate cavity |
| 12/23/2003 | US6667550 Installation structure and method for optical parts and electric parts |
| 12/23/2003 | US6667549 Micro circuits with a sculpted ground plane |
| 12/23/2003 | US6667548 Diamond heat spreading and cooling technique for integrated circuits |
| 12/23/2003 | US6667547 High current capacity semiconductor device package and lead frame with large area connection posts and modified outline |
| 12/23/2003 | US6667546 Ball grid array semiconductor package and substrate without power ring or ground ring |
| 12/23/2003 | US6667545 Rectifier diode with improved means for tension relief of the connected headwire |
| 12/23/2003 | US6667544 Stackable package having clips for fastening package and tool for opening clips |
| 12/23/2003 | US6667542 Anisotropic conductive film-containing device |
| 12/23/2003 | US6667541 Terminal land frame and method for manufacturing the same |
| 12/23/2003 | US6667537 Semiconductor devices including resistance elements and fuse elements |
| 12/23/2003 | US6667536 Thin film multi-layer high Q transformer formed in a semiconductor substrate |
| 12/23/2003 | US6667535 Fuse structure |
| 12/23/2003 | US6667534 Copper fuse structure and method for manufacturing the same |
| 12/23/2003 | US6667533 Triple damascene fuse |
| 12/23/2003 | US6667532 Semiconductor power component comprising a safety fuse |
| 12/23/2003 | US6667531 Method and apparatus for a deposited fill layer |
| 12/23/2003 | US6667530 Semiconductor device and manufacturing method thereof |
| 12/23/2003 | US6667514 Semiconductor component with a charge compensation structure and associated fabrication |
| 12/23/2003 | US6667439 Integrated circuit package including opening exposing portion of an IC |
| 12/23/2003 | US6667256 Glass-ceramic composition for ceramic electronic part, ceramic electronic part, and method for manufacturing multilayer ceramic electronic part |
| 12/23/2003 | US6667253 Alignment mark and exposure alignment system and method using the same |
| 12/23/2003 | US6667236 Method of manufacturing a two layer liner for dual damascene vias |
| 12/23/2003 | US6667235 Semiconductor device and manufacturing method therefor |
| 12/23/2003 | US6667230 Passivation and planarization process for flip chip packages |
| 12/23/2003 | US6667222 Method to combine zero-etch and STI-etch processes into one process |
| 12/23/2003 | US6667221 Method of manufacturing semiconductor device |
| 12/23/2003 | US6667217 Method of fabricating a damascene copper inductor structure using a sub-0.18 um CMOS process |
| 12/23/2003 | US6667212 Alignment system for planar charge trapping dielectric memory cell lithography |
| 12/23/2003 | US6667195 Laser repair operation |
| 12/23/2003 | US6667193 Semiconductor device and a method of manufacturing the same |
| 12/23/2003 | US6667192 Device and method for making devices comprising at least a chip fixed on a support |
| 12/23/2003 | US6667191 Chip scale integrated circuit package |
| 12/23/2003 | US6667190 Method for high layout density integrated circuit package substrate |
| 12/23/2003 | US6667094 Paste for screenprinting electric structures onto carrier substrates |
| 12/23/2003 | US6667073 Leadframe for enhanced downbond registration during automatic wire bond process |
| 12/23/2003 | US6666997 Method for removing cleaning compound flash from mold vents |
| 12/23/2003 | US6666980 Method for manufacturing a resistor |
| 12/23/2003 | US6666964 High density, multilayer printed circuits comprising flexible dielectric substrates having apertures, wire conductors and gold layers formed in electroplating baths; electronics |
| 12/23/2003 | US6666703 Connector for integrated circuits, and assembly for use on integrated circuits |
| 12/23/2003 | US6666640 Fastener for a heat-radiator on a chip |
| 12/23/2003 | US6666392 Finely crusted thermosetting resin and inorganic dielectric powder; casting into metal mold, heating, pressurization |
| 12/23/2003 | US6666371 Sealing system for electronic device and sealing method therefor |
| 12/23/2003 | US6666369 Semiconductor device manufacturing method, electronic parts mounting method and heating/melting process equipment |
| 12/23/2003 | US6666368 Methods and systems for positioning substrates using spring force of phase-changeable bumps therebetween |
| 12/23/2003 | US6666337 Method and apparatus for determining wafer identity and orientation |
| 12/23/2003 | US6666261 Liquid circulation cooler |
| 12/23/2003 | US6666260 Scalable and modular heat sink-heat pipe cooling system |
| 12/23/2003 | US6665931 Wiring method for forming conductor wire on a substrate board |
| 12/23/2003 | CA2344429C Device for supplying output data in reaction to input data, method for checking authenticity and method for encrypted data transmission |
| 12/18/2003 | WO2003105288A1 Contact for spiral contactor and spiral contactor |
| 12/18/2003 | WO2003105226A1 Semiconductor device |
| 12/18/2003 | WO2003105225A1 Lead frame |
| 12/18/2003 | WO2003105224A2 Method and apparatus for cooling a portable computer |
| 12/18/2003 | WO2003105223A2 Quad flat non-leaded package comprising a semiconductor device |
| 12/18/2003 | WO2003105222A1 Method for contact bonding electronic components on an insulating substrate and component module produced according to said method |
| 12/18/2003 | WO2003105217A1 Wafer pre-alignment apparatus and method |
| 12/18/2003 | WO2003105213A2 Method of manufacturing an electronic device |
| 12/18/2003 | WO2003105198A1 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 12/18/2003 | WO2003105187A2 Optimization methods for on-chip interconnect geometries suitable for ultra deep sub-micron processes |
| 12/18/2003 | WO2003105186A2 Integrated circuit and method for manufacturing same |
| 12/18/2003 | WO2003104958A2 Method and apparatus for cooling a circuit component |
| 12/18/2003 | WO2003104882A1 A thin film transistor array panel |
| 12/18/2003 | WO2003081725A3 A miniaturized contact spring |
| 12/18/2003 | WO2003078153A3 Lamination of high-layer-count substrates |