| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/25/2003 | WO2003107427A1 Interlayer dielectric and pre-applied die attach adhesive materials |
| 12/25/2003 | US20030237070 Semiconductor circuit designing method, semiconductor circuit designing apparatus, program, and semiconductor device |
| 12/25/2003 | US20030236028 Fixture for an electrical device |
| 12/25/2003 | US20030235980 Silicon-rich oxide for copper damascene interconnect incorporating low dielectric constant dielectrics |
| 12/25/2003 | US20030235979 Electric device and method for fabricating the same |
| 12/25/2003 | US20030235971 Manufacturing method for a semiconductor device |
| 12/25/2003 | US20030235940 Manufacturing method of semiconductor device |
| 12/25/2003 | US20030235938 Method of manufacturing semiconductor resin molding and resin member employed therefor |
| 12/25/2003 | US20030235767 Phase shift mask blank, phase shift mask, and method of manufacture |
| 12/25/2003 | US20030235710 Semiconductor device comprising substrate having first layer of dielectric material, second layer of amorphous silicon, amorphous germanium or alloys thereof, and third layer; second layer provides adhesion between first and third layers |
| 12/25/2003 | US20030235091 Semiconductor device without adverse effects caused by inclinations of word line and bit line |
| 12/25/2003 | US20030235044 Electronic circuit board manufacturing process and associated apparatus |
| 12/25/2003 | US20030235041 Container for an electronic component |
| 12/25/2003 | US20030235038 Power semiconductor module |
| 12/25/2003 | US20030235037 Heatsink mounting unit |
| 12/25/2003 | US20030235034 Component alignment and retention mechanism |
| 12/25/2003 | US20030235033 Variable length and directional cooling duct |
| 12/25/2003 | US20030235019 Electrostatic discharge protection scheme for flip-chip packaged integrated circuits |
| 12/25/2003 | US20030235018 Method and structures for reduced parasitic capacitance in integrated circuit metallizatons |
| 12/25/2003 | US20030234703 Bridges for microelectromechanical structures |
| 12/25/2003 | US20030234655 System and method for using a capacitance measurement to monitor the manufacture of a semiconductor |
| 12/25/2003 | US20030234583 Repeater methods for constrained pitch wire buses on integrated circuits |
| 12/25/2003 | US20030234454 Integrated circuit package and method of manufacturing the integrated circuit package |
| 12/25/2003 | US20030234453 Flip chip interconncetion structure and process of making the same |
| 12/25/2003 | US20030234452 Optical integrated circuit element package and process for making the same |
| 12/25/2003 | US20030234451 Stabilized wire bonded electrical connections and method of making same |
| 12/25/2003 | US20030234450 Ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device |
| 12/25/2003 | US20030234448 Method and structures for reduced parasitic capacitance in integrated circuit metallizations |
| 12/25/2003 | US20030234447 Contact structure for reliable metallic interconnection |
| 12/25/2003 | US20030234446 Frame has a perforation to form, between a central platform and a peripheral part located a certain distance apart, radiating elongate leads |
| 12/25/2003 | US20030234445 Semiconductor package and manufacturing method thereof |
| 12/25/2003 | US20030234444 Lead frame |
| 12/25/2003 | US20030234443 Low profile stacking system and method |
| 12/25/2003 | US20030234442 Semiconductor package and method for fabricating the same |
| 12/25/2003 | US20030234441 Method of mounting a leadless package and structure therefor |
| 12/25/2003 | US20030234438 Integrated circuit structure for mixed-signal RF applications and circuits |
| 12/25/2003 | US20030234437 Inductor for semiconductor integrated circuit and method of fabricating the same |
| 12/25/2003 | US20030234436 Semiconductor device with a spiral inductor and magnetic material |
| 12/25/2003 | US20030234435 Fuse configuration with modified capacitor border layout for a semiconductor storage device |
| 12/25/2003 | US20030234434 Semiconductor device |
| 12/25/2003 | US20030234426 Electrostatic discharge protection device |
| 12/25/2003 | US20030234425 Protection circuit for electrostatic discharge |
| 12/25/2003 | US20030234416 Capacitor for a semiconductor device and method for fabrication therefor |
| 12/25/2003 | US20030234415 Scalable three-dimensional fringe capacitor with stacked via |
| 12/25/2003 | US20030234399 Thin film transistor array panel |
| 12/25/2003 | US20030234353 Integration of electronic data storage into a telecommunications component |
| 12/25/2003 | US20030234277 Microelectronic device interconnects |
| 12/25/2003 | US20030234275 Wire bonder for ball bonding insulated wire and method of using same |
| 12/25/2003 | US20030234118 Flip-chip package substrate |
| 12/25/2003 | US20030234074 Thermal interface materials and methods for their preparation and use |
| 12/25/2003 | US20030234072 Suppression of planar shrinkage in ltcc ceramic tape laminate structures without externally applied forces |
| 12/24/2003 | WO2003107445A1 Semiconductor device, semiconductor circuit and method for producing semiconductor device |
| 12/24/2003 | WO2003107430A1 Enhanced structure and method for buried local interconnects |
| 12/24/2003 | WO2003107423A1 A lamp and method of producing a lamp |
| 12/24/2003 | WO2003107422A1 Semiconductor device and its manufacturing method |
| 12/24/2003 | WO2003107419A1 Increasing thermal conductivity of thermal interface using carbon nanotubes and cvd |
| 12/24/2003 | WO2003107418A1 Cooling body |
| 12/24/2003 | WO2003107417A1 Packaging for semiconductor components and method for producing the same |
| 12/24/2003 | WO2003107416A1 Method for the production of an nrom memory cell arrangement |
| 12/24/2003 | WO2003107414A1 Method for testing and adjusting a lamp heating installation |
| 12/24/2003 | WO2003107412A1 Optical fiber arrays with precise hole sizing |
| 12/24/2003 | WO2003107268A1 Non-contact communication system information carrier |
| 12/24/2003 | WO2003106328A2 Micromechanical component and corresponding production method |
| 12/24/2003 | WO2003070994A3 Lead-free tin-silver-copper alloy solder composition |
| 12/24/2003 | WO2003054927A3 Structure and process for packaging rf mems and other devices |
| 12/24/2003 | WO2003017324A8 Structure and method for fabrication of a leadless chip carrier with embedded inductor |
| 12/24/2003 | WO2002071486A3 Mixed analog and digital integrated circuits |
| 12/24/2003 | DE19936321C2 Anordnung und Verfahren zum Testen einer Vielzahl von Halbleiterchips auf Waferebene Arrangement and method for testing a plurality of semiconductor chips at the wafer level |
| 12/24/2003 | DE10214121C1 Optoelektronisches Bauelement mit mehreren Halbleiterchips Optoelectronic component having a plurality of semiconductor chips |
| 12/24/2003 | CN2595062Y Cooler of rectifier cabinet |
| 12/24/2003 | CN2594991Y Big-power amplifier radiator |
| 12/24/2003 | CN2594990Y Refrigerating radiator |
| 12/24/2003 | CN2594989Y Heat exchange fin plate for improving heat exchange efficience |
| 12/24/2003 | CN2594988Y Main radiating component of radiator |
| 12/24/2003 | CN2594987Y Passive radiator with variable flow direction |
| 12/24/2003 | CN2594986Y Radiator device with air duct |
| 12/24/2003 | CN2594985Y Radiator device with air guiding cover |
| 12/24/2003 | CN2594984Y Radiator device with side grooves |
| 12/24/2003 | CN2594983Y Radiator device with grooves on three surfaces |
| 12/24/2003 | CN2594982Y Radiator with inserting fins on bottom |
| 12/24/2003 | CN2594981Y Radiator |
| 12/24/2003 | CN2594980Y Assembled finned radiator |
| 12/24/2003 | CN2594979Y Integrated circuit chip carrier |
| 12/24/2003 | CN2594978Y Package for big-power component |
| 12/24/2003 | CN2594858Y Elastic buckle |
| 12/24/2003 | CN2594857Y CPU radiator |
| 12/24/2003 | CN2594856Y Radiating air exhausting devices |
| 12/24/2003 | CN1463572A Method for mfg. ceramic multilayered board |
| 12/24/2003 | CN1463471A Semiconductor device and production method therefor |
| 12/24/2003 | CN1463454A 低电感格栅阵列电容器 Low inductance capacitor array grid |
| 12/24/2003 | CN1463414A Method for connecting chip to antenna of radio frequency identification device of contactless chip card variety |
| 12/24/2003 | CN1463411A Lead-frame configuration for chips |
| 12/24/2003 | CN1463283A Thermosetting resin compsn. |
| 12/24/2003 | CN1463282A Thermosetting resin compsn., method for producing same and suspensionlike mixture |
| 12/24/2003 | CN1463279A Organosilicate polyer and insulating film therefrom |
| 12/24/2003 | CN1463261A Method for mfg. ceramic part |
| 12/24/2003 | CN1463141A Image sensor assembly and its mfg. method |
| 12/24/2003 | CN1463075A Ceramic packing with radiating cap |
| 12/24/2003 | CN1463048A Thermoelectric modular packing |
| 12/24/2003 | CN1463043A Semiconductor device and its mfg. method |